• Title/Summary/Keyword: Electronics cooling

검색결과 323건 처리시간 0.029초

다양한 크기의 윅(wick)을 이용한 mLHP의 개발 (Development of mLHP by using Various Size of Wick)

  • 하정석;최영돈;안득균
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2008년도 동계학술발표대회 논문집
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    • pp.175-180
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    • 2008
  • This paper is dedicated to the development of cooling devices such as mLHP with Fan-Fin system limited by noise and vibration. As we know, Heat pipe has the limitation of cooling capability to cool down the electronics. It is bounded by capillary and thermal limitation but heat load that it has to deal with is increasing. Especially Today's electronic technology has a tendency to integrate lots of function into the small piece of a processor like Dual core having 35W heat load for mobile and desktop computer respectively. There is an optimum operating condition of temperature, below $70^{\circ}C$, during the maximum heat load, 35W. There is the motivation needed to develop the new type of cooling devices and we can discuss about the new challenge beyond heat pipe.

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Balancing Well 교차혼합 지중열교환기의 스마트 냉난방 히트펌프 시스템의 성능평가에 관한 연구 (Study on the Performance Evaluation of Smart Heating and Cooling Heat Pump System in a Balancing Well Cross-Conditioned Ground Heat Exchanger)

  • 이창희;김동규;유병석;김부일
    • 신재생에너지
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    • 제16권4호
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    • pp.41-48
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    • 2020
  • This study performed a single hole operation method using a balancing well-cross-mixed underground heat exchanger, and conducted thermal performance studies of an SCW-type underground heat exchanger using a two-well. The study attempted to change the existing operating method of the two adjacent SCW underground heat exchangers with one ball each. The SCW-type geothermal heat exchanger is considered to enable up to 20% of bleed discharge at maximum load, which makes groundwater usage unequal. The efficiency factor of the geothermal system was improved by constructing the discharged water by cross-mixing two balancing wells to prevent the discharge of groundwater sources and keep the temperature of the underground heat exchanger constant. As a result of the cooling and heating operation with the existing SCW heat exchange system and the balancing well-cross-mixed heat exchange system, the measured performance coefficient improved by 23% and 12% in cooling and heating operations, respectively. In addition, when operating with a balanced cross-mixing heat exchange system, it has been confirmed that the initial basement temperature is constant with a standard deviation of 0.08 to 0.12℃.

Optimized Local Relocation for VLSI Circuit Modification Using Mean-Field Annealing

  • Karimi, Gholam Reza;Verki, Ahmad Azizi;Mirzakuchaki, Sattar
    • ETRI Journal
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    • 제32권6호
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    • pp.932-939
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    • 2010
  • In this paper, a fast migration method is proposed. Our method executes local relocation on a model placement where an additional module is added to it for modification with a minimum number of displacements. This method is based on mean-field annealing (MFA), which produces a solution as reliable as a previously used method called simulated annealing. The proposed method requires substantially less time and hardware, and it is less sensitive to the initial and final temperatures. In addition, the solution runtime is mostly independent of the size and complexity of the input model placement. Our proposed MFA algorithm is optimized by enabling module rotation inside an energy function called permissible distances preservation energy. This, in turn, allows more options in moving the engaged modules. Finally, a three-phase cooling process governs the convergence of problem variables called neurons or spins.

기존 12/8 및 새로운 6/5 SRM의 성능분석 및 비교 (Performance Evaluation and Comparison of Conventional 12/8 and Novel 6/5 Switched Reluctance Motors)

  • 서진요;이동희;안진우
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2016년도 전력전자학술대회 논문집
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    • pp.517-518
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    • 2016
  • In this paper, a novel 6/5 switched reluctance motor (SRM) with segmental rotor is proposed for vehicle cooling fan application. Unlike conventional SRMs, the proposed motor adopts hybrid stator poles and segmental rotor structures, thereby making the motor operate in short flux paths and parts of the flux paths magnetically isolated between the phases. Therefore, compared with conventional SRMs, the proposed structure could improve the output torque density and reduce the core loss, thereby improving the electric utilization of the motor. To verify the proposed structure, the performance of the proposed structure is evaluated. Meanwhile, a conventional 12/8 SRM which has been used for vehicle cooling fan application is also evaluated. Finally, the effectiveness of the proposed SRM is demonstrated by the simulation and experimental results.

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선삭가공에서 표면 거칠기에 미치는 냉각방법의 영향 (Effect of Cooling Method on Surface Roughness in Turning)

  • 김영덕
    • 한국기계가공학회지
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    • 제10권3호
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    • pp.87-93
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    • 2011
  • CNC lathe machining has been widely used for parts machining of vehicles, aircraft, ships, electronics, etc. because cost savings for shortening processing time and increasing productivity are great. In this study, the purpose is to investigate the effect of cooling methods such as oil mist, water-soluble cutting oils on the workpiece surface roughness with the cutting speed, cutting depth, tool nose radius and feed rate of CNC lathe machine as a parameter in the cutting process of the aluminum alloy 2024 which is used a lot recently on aircraft parts. It is found that oil mist is coolant and water-soluble cooled by cutting the experimental conditions, cutting speed and cutting depth without effecting the surface roughness value was constant.

비등열전달 향상을 위한 초소형 핀 제작공정에 관한 연구 (A Study on the microcooling Fin Fabrication Process for Enhancing Boiling Heat Transfer)

  • 유삼상;임태우;정석권;박종운
    • 수산해양교육연구
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    • 제19권3호
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    • pp.366-372
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    • 2007
  • This paper presents the fabrication techniques of microcooling fins for microelectronics applications. The various types of cooling fins have been fabricated on the surface of a silicon wafer (4inch-N type) by using wet etching technique. The designed micro fins and micro channels are considered as an effective method for cooling microelectronics devices generating high heat flux. Further we extensively investigate the design processes fabricating micro fins and channels which can cool the heat generated from high density electronics devices.

Implementation of Single-Wire Communication Protocol for 3D IC Thermal Management Systems using a Thin Film Thermoelectric Cooler

  • Kim, Nam-Jae;Lee, Hyun-Ju;Kim, Shi-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권1호
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    • pp.18-23
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    • 2012
  • We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

Temperature Distribution of a Low Temperature Heat Pipe with Multiple Heaters for Electronic Cooling

  • Noh, Hong-Koo;Song, Kyu-Sub
    • ETRI Journal
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    • 제20권4호
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    • pp.380-394
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    • 1998
  • A numerical study has been performed to predict the characteristics on the transient operation of the heat pipe with multiple heaters for electronic cooling. The model of the heat pipe was composed of the evaporator section with four heaters, insulated transport section, and the condensor section with a conductor which is cooled with uniform heat flux condition to surrounding. The governing equations and the boundary conditions were solved by the generalized PHOENICS computational code employing the finite volume method. Two test cases are investigated in present study; Case 1 indicates that the 1st and 2nd heaters among four heating sources are heated off, while the 3rd and 4th heaters are heated on. Case 2 is the inverse situation switched from heating location of Case 1. The results show that the transient time to reach the steady state is shorter for Case 1 than for Case 2. Especially, the temperature difference of the heater during switching operation is relatively small compared to the maximum allowable operating temperature difference in electronic system. Hence, it is predicted that the heat pipe in present study operates with thermally good reliability even for switching the heaters.

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비단열 모세관의 형상 변경에 따른 소형 냉동 사이클 성능 해석 (Simulation of the small Refrigeration Cycle as shape change of the Non-Adiabatic Capillary Tube)

  • 남기원;이대용;박상구;정지환;김윤수
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2009년도 하계학술발표대회 논문집
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    • pp.550-555
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    • 2009
  • The present simulation focuses on the effect of the shape of capillary tube-suction line heat exchangers(SLHX), The results in the three cases of the SLHX types show that both of the location and length of heat exchange section influence the coefficient of performance(COP) and cooling capacity. Simulation shows the COP may be improved by 4.6% and the cooling capacity may be improved by 13.6% in the Lateral type.

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빙축열 에어컨의 동적 사이클 해석 (Dynamic Analysis of Cool Thermal Storage Air Conditioning System)

  • 고재윤;서태범
    • 한국태양에너지학회 논문집
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    • 제28권1호
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    • pp.65-74
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    • 2008
  • In this study, dynamic characteristics analysis of AC system is investigated using a cool thermal storage system. A analysing program for cool thermal storage AC system is developed. The performances are studied by several variables and dynamic characteristics. Comparing the result at conventional operation condition with that at the condition using ice storage system, this study showed the effects of the sub cooled degree, superheated degree, efficiency of compressor and evaporating temperature. At the condition using thermal storage system, the thermal storage process was operated during midnight being not needed the cooling of the AC unit through the continuous running of the condenser. The refrigerant was sub-cooled using stored energy after being discharged from the air source condenser during the daytime. The COP was increased owing to the sub-cooling of refrigerant during daytime, thus the power consumption was effectively decreased.