• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.31-36
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• 2015

The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.201-209
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• 2004

As the European Community's Directive on the Restriction of Hazardous Substances in Electrical and Electronic Equipment banning lead (Pb) in electronics products will take effect on July 1, 2006, most electronics manufacturers will be commencing with volume production of Pb-free components by the middle of 2004. Electrodeposited pure tin finishes on electronic components are a leading contender to replace the industry standard tin-lead. Commensurate with this shift will be a somewhat steep learning curve as manufacturers adapt a variety of equipment and processes to contend with the issues surrounding this critical, industry-wide material conversion. Since the electrodeposited finish directly influences the critical reliability characteristics of the component itself, the nature of the Pb-free component finish must be well characterized and understood. Only through a thorough examination of the attributes of the electroplated tin deposit can critical decisions be made regarding component finish reliability. This paper investigates the properties of electrodeposited tin that may have an effect on component reliability, namely, grain structure (size and shape), oxide formation, tin whisker formation, and solderability. Data will be presented from laboratory and production settings, with the objective being to enable manufacturers to draw their own conclusions regarding previously established perceptions and misconceptions about electrodeposited tin properties.

• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.16 no.2
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• pp.424-444
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• 2022

In hospitals and pharmacies, the distribution of medicines is an important part. Any mistakes, misses, fake medicines and expired medicines can cause medical accidents. With the widespread application of the Internet of Things technology (IoT), traditional drug distribution methods need to be upgraded. This article proposes a drug distribution management scheme based on the Internet of Things technology. In the production of drugs, a flexible RFID tag was printed on the packaging box, which stored a series of information such as drug name, dosage, raw materials, efficacy, production date, expiration date, and manufacturer. The use of a drug distribution management system combined with RFID readers can identify drug information and effectively prevent the occurrence of erroneous, missed, counterfeit, and expired drugs. It can also improve management efficiency, reduce management costs, and control management risks. Through the circuit design and software system development, the test results show that this solution is effective and feasible, the proposed method can achieve the expected results.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.49-53
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• 2018

Since various methods to form well-aligned nano-/micro- patterns are underlying technologies to fabricate next generation wearable electronic devices, many efforts have been made to realize finer patterns in recent years. Among lots of patterning methods, the present invention includes a nano-transfer printing (n-TP) process which is advantageous in that a processing cost is low and high-resolution patterns can be formed within a short processing time. We successfully achieved pattern formation of highly ordered Pt lines with line-width of 250 nm, 500 nm, and $1{\mu}m$ on transparent and flexible substrates. In addition, we analyzed the durability of the patterns, showing excellent stability of line-shape even after a physical and repeated bending test of 500 times using a bending machine. As a result, it is expected that a n-TP process is very useful for forming various metal patterns, and it is also expected to be applied to wiring and interconnection technology of next generation flexible electronic devices.

• Korean Journal of Food Science and Technology
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• v.49 no.1
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• pp.14-19
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• 2017

The objective of this study was to analyze the volatile changes occurring in retort pouches during heating using a mass spectrometry-based electronic nose. The data obtained by the electronic nose analysis was used to generate a discriminant function analysis plot. The plot showed that volatile compounds of the heated water in the retort pouch were increased by the interaction between container and water as the heating time increased. Conversely, volatile compounds of the container itself decreased when only the container was measured separately. This result means that volatile compounds from the packaging material migrated into the water. In the case of heated beef bone soup, volatile compounds were increased compared to the unheated beef bone soup after 20 min of heating. According to the results of GC/MS, nonanal and 3,5-di-tert-butyl-4-hydroxytoluene (BHT) were detected in the heated water and nonanal, heptanal, octanal, and BHT were detected in the heated beef bone soup.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.1-12
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• 2023

In the current era of the global mobile smart device revolution, electronic devices are required in all spaces that people interact with. The establishment of the internet of things (IoT) among smart devices has been recognized as a crucial objective to advance towards creating a comfortable and sustainable future society. In-mold electronic (IME) processes have gained significant industrial significance due to their ability to utilize conventional high-volume methods, which involve printing functional inks on 2D substrates, thermoforming them into 3D shapes, and injection-molded, manufacturing low-cost, lightweight, and functional components or devices. In this article, we provide an overview of IME and its latest advances in application. We review biomimetic nanomaterials for constructing self-supporting biosensor electronic materials on the body, energy storage devices, self-powered devices, and bio-monitoring technology from the perspective of in-mold electronic devices. We anticipate that IME device technology will play a critical role in establishing a human-machine interface (HMI) by converging with the rapidly growing flexible printed electronics technology, which is an integral component of the fourth industrial revolution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.3-6
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• 2004

Power semiconductor devices are being compact, high performance and intelligent thanks to recent remarkable developments of silicon design, process and related packaging technologies. Developments of MOS-gate transistors such as MOSFET and IGBT are dominant thanks to their advantages on high speed operation. In conjunction with package technology, silicon technologies such as trench, charge balance and NPT will support future power semiconductors. In addition, wide band gap material such as SiC and GaN are being studies for next generation power semiconductor devices.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.2
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• pp.137-146
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• 1998

The experimental study is concerned with two-phase closed thermosyphons, (i.e., wickless heat pipes) for the cooling of high power electronic components in telecommunication system. The thermosyphon which can deal with a high heat flux of up to $4.9W/cm^2$ is developed, and the cooling characteristics of thermosyphon is analyzed according to design parameters which are the types of and quantity of working fluid, number of pipes, wire insertion in pipe, inclination angle of thermosyphon, and cooling air velocity. Using water as working fluid is superior cooling performance compared to using acetone, and cooling performance is improved as the number of thermosyphon becomes larger, inserting wires in the pipes, and inclination of $30~60^{\circ}$.