• Title/Summary/Keyword: Electronic package

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KPACK: Relativistic Two-component Ab Initio Electronic Structure Program Package

  • Kim, Inkoo;Lee, Yoon Sup
    • Bulletin of the Korean Chemical Society
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    • v.34 no.1
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    • pp.179-187
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    • 2013
  • We describe newly developed software named KPACK for relativistic electronic structure computation of molecules containing heavy elements that enables the two-component ab initio calculations in Kramers restricted and unrestricted formalisms in the framework of the relativistic effective core potential (RECP). The spin-orbit coupling as relativistic effect enters into the calculation at the Hartree-Fock (HF) stage and hence, is treated in a variational manner to generate two-component molecular spinors as one-electron wavefunctions for use in the correlated methods. As correlated methods, KPACK currently provides the two-component second-order M${\o}$ller-Plesset perturbation theory (MP2), configuration interaction (CI) and complete-active-space self-consistent field (CASSCF) methods. Test calculations were performed for the ground states of group-14 elements, for which the spin-orbit coupling greatly influences the determination of term symbols. A categorization of three procedures is suggested for the two-component methods on the basis of spin-orbit coupling manifested in the HF level.

The usage of Electronic Databases in Academic Libraries in Ghana. The Experience of Ghana Communication Technology University Library (GCTUL)

  • Afua Frempong- Kore;Ameyaw Samuel
    • International Journal of Knowledge Content Development & Technology
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    • v.14 no.2
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    • pp.7-27
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    • 2024
  • This study examines the use of electronic databases (e-databases) by faculty members of the Ghana Communication Technology University (GCTU). The study used a descriptive research method. Copies of the questionnaire were used for the data collection. Due to the manageable population, no sampling method was used in this study. The Statistical Package for the Social Sciences (IBM-SPSS 21.0) was used for data analysis. The results showed that most faculty members were aware of the availability of databases in the library. Additionally, the findings established that Emerald, as well as Taylor and Francis, were ranked highly in terms of availability and accessibility. The study identified problems such as difficulty in downloading information as well as poor internet connectivity. Based on the results, the study recommended that library management should address all the challenges that users encounter as soon as possible.

Atomistic simulation of surface passivated wurtzite nanowires: electronic bandstructure and optical emission

  • Chimalgi, Vinay U.;Nishat, Md Rezaul Karim;Yalavarthi, Krishna K.;Ahmed, Shaikh S.
    • Advances in nano research
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    • v.2 no.3
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    • pp.157-172
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    • 2014
  • The three-dimensional Nano-Electronic Modeling toolkit (NEMO 3-D) is an open source software package that allows the atomistic calculation of single-particle electronic states and optical response of various semiconductor structures including bulk materials, quantum dots, impurities, quantum wires, quantum wells and nanocrystals containing millions of atoms. This paper, first, describes a software module introduced in the NEMO 3-D toolkit for the calculation of electronic bandstructure and interband optical transitions in nanowires having wurtzite crystal symmetry. The energetics (Hamiltonian) of the quantum system under study is described via the tight-binding (TB) formalism (including $sp^3$, $sp^3s^*$ and $sp^3d^5s^*$ models as appropriate). Emphasis has been given in the treatment of surface atoms that, if left unpassivated, can lead to the creation of energy states within the bandgap of the sample. Furthermore, the developed software has been validated via the calculation of: a) modulation of the energy bandgap and the effective masses in [0001] oriented wurtzite nanowires as compared to the experimentally reported values in bulk structures, and b) the localization of wavefunctions and the optical anisotropy in GaN/AlN disk-in-wire nanowires.

Study on the Compositions of Photosensitive Ag Paste for Patterning Embedded Fine-Line Inductor in LTCC (LTCC 내장형 미세 라인 인덕터 구현을 위한 감광성 Ag Paste 조성에 관한 연구)

  • Lee, Sang-Myoung;Park, Seong-Dae;Yoo, Myong-Jae;Lee, Woo-Sung;Kang, Nam-Kee;Nahm, Sahn
    • Journal of the Korean Ceramic Society
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    • v.44 no.3 s.298
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    • pp.157-161
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    • 2007
  • Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

Electronic State of ZnO Doped with Elements of IIIB family, Calculated by Density functional Theory (범밀도함수법을 이용하여 계산한 IIIB족 원소가 도핑된 ZnO의 전자상태)

  • Lee, Dong-Yoon;Lee, Won-Jae;Min, Bok-Ki;Kim, In-Sung;Song, Jae-Sung;Kim, Yang-Soo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.7
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    • pp.589-593
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    • 2005
  • The electronic states of ZnO doped with Al, Ga and In, which belong to III family elements in periodic table, were calculated using the density functional theory. In this study, the calculation was performed by two Programs; the discrete variational Xa (DV-Xa) method, which is a sort of molecular orbital full potential method; Vienna Ab-initio Simulation Package (VASP), which is a sort of pseudo potential method. The fundamental mixed orbital structure in each energy level near the Fermi level was investigated with simple model using DV-Xa. The optimized crystal structures calculated by VASP were compared to the measured structures. The density of state and the energy levels of dopant elements were shown and discussed in association with properties.

Bluetooth Network for Group Behavior of Multi-Agent Robotic System

  • Seo, Sang-Wook;Ko, Kwang-Eun;Hwang, Se-Hee;Jang, In-Hun;Sim, Kwee-Bo
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • v.7 no.1
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    • pp.17-21
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    • 2007
  • Multi-Agent Robotic System (MARS) is a system that independent autonomous robots in the restricted environments infer their status from pre-assigned conditions and operate their jobs through the cooperation with each other. In the MARS, a robot contains sensor part to percept the situation around themselves, communication part to exchange information, and actuator part to do given work. Especially, in order to cooperate with other robots, communicating with other robots is one of the essential elements. Because Bluetooth has many advantages such as low power consumption, small size module package, and various standard protocols, Bluetooth is rated as one of the efficient communicating technologies which can apply to small-sized robot system. In this paper, we will develop Bluetooth communicating system for autonomous robots. For the purpose, the communication system must have several features-separated module, flexible interface. We will discuss how to construct and what kind of procedure to develop the communicating system.

Estimation of Transferred Power from a Noise Source to an IC with Forwarded Power Characteristics

  • Pu, Bo;Kim, Taeho;Kim, SungJun;Kim, Jong-Hyeon;Kim, SoYoung;Nah, Wansoo
    • Journal of electromagnetic engineering and science
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    • v.13 no.4
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    • pp.233-239
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    • 2013
  • This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.

Stacked Pad Area Away Package Modules for a Radio Frequency Transceiver Circuit (RF 송수신 회로의 적층형 PAA 패키지 모듈)

  • Jee, Yong;Nam, Sang-Woo;Hong, Seok-Yong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.10
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    • pp.687-698
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    • 2001
  • This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

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Realization of gas sensor using LTCC(Low Temperature Cofired Ceramic) technology (LTCC 기술을 이용한 가스센서 구현)

  • Jeon, J.I.;Choi, H.J.;Lee, Y.B.;Kim, K.S.;Park, J.H.;Kim, M.Y.;Im, C.I.;Mun, J.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.369-370
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    • 2005
  • LTCC (Low Temperature Cofired Ceramic) technology is one of technologies which can realize SIP (System-In-a-Package). In this paper realization of gas sensor using LTCC technology was described. In the conventional gas sensor structure, wire bonding method is generally used as an interconnection method whereas in the LTCC sensor structure, via was used for the interconnection. As sensing materials, $SnO_2$ was adopted. The effect of frit glass portion on the adhesion of the sensing material to the LTCC substrate and the electrical conductivity of the sensing material were analyzed. AgPd, PdO, Pt was added to the sensing material as an additive for improving the gas sensitivity and electrical conductivity and the effect of the amount of additives in the sensing material on the electrical conductivity was investigated. The effect of the amount of frit glass in the termination on the sensor performance, especially mechanical integrity, was considered and the crack initiation and propagation in the boundary between the sensing material and the termination was studied.

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Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

  • Lee, Duck-Jung;Lee, Yun-Hi;Moon, Gwon-Jin;Kim, Jun-Dong;Choi, Won-Do;Lee, Sang-Geun;Jang, Jin;Ju, Byeong-Kwon
    • Journal of Information Display
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    • v.2 no.4
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    • pp.34-38
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    • 2001
  • We suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 $cd/m^2$. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.

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