• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.53-58
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• 2009

A SMT mounter is a kind of equipment that mounts SMD parts quickly on the printed circuit board. By using linear motors, it is controlled with high speed and precision, which is similar to semi-conductor and display process equipment. It is necessarily used in an assembly process of an electronic device. Mobile devices such as a mobile phone and PDA are required to reduce mount areas due to the demands for high performance and small size. Hence, super small sized and complex mobile devices have been developed. To improve the productivity of the corresponding equipment, designs with large sized, high speed, and multidisciplinary functions have been consistently performed. Meanwhile, a design trend of large size and light-weight on SMT mounter causes a low natural frequency of systems and vibration problems at the high speed operation. In this paper, the dynamic characteristics of the SMD mounter system were investigated through a modal test and transmissibility test, and verified by finite element method. Also, various design improvement was performed to avoid the resonance phenomena.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.9 no.6
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• pp.2144-2159
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• 2015

CISCO VNI predicted an average annual growth rate of 66% for mobile video traffic between 2014 and 2019 and accordingly much academic research related to video streaming has been initiated. In video streaming, Adaptive Bitrate (ABR) is a streaming technique in which a source video is stored on a server at variable encoding rates and each streaming user requests the most appropriate video encoding rate considering their channel capacity. However, these days, ABR related studies are only focusing on real-time rate adaptation omitting energy efficiency though it is one of the most important requirement for mobile devices, which may cause dissatisfaction for streaming users. In this paper, we propose an energy efficient prefetching based dynamic adaptive streaming technique by considering the limited characteristics of the batteries used in mobile devices, in order to reduce the energy waste and provide a similar level of service in terms of the average video rate compared to the latest ABR streaming technique which does not consider the energy consumption. The simulation results is showing that our proposed scheme saves 65~68% of energy at the average global mobile download speed compared to the latest high performance ABR algorithm while providing similar rate adaptation performance.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.29-29
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• 1999

The synthesis of layered structures on the nanometer scale has become essential for continued improvements in the operation of various electronic and magnetic devices. Abrupt metal-metal interfaces are desired for applications ranging from metallization in semiconductor devices to fabrication of magnetoresistive tunnel junctions for read heads on magnetic disk drives. In particular, characterizing the interface structure between various transition metals (TM) and aluminum is desirable. We have used the techniques of MeV ion backscattering and channeling (HEIS), x-ray photoemission (ZPS), x-ray photoelectron diffraction(XPD), low-energy ion scattering (LEIS), and low-energy electron diffraction(LEED), together with computer simulations using embedded atom potentials, to study solid-solid interface structure for thin films of Ni, Fe, Co, Pd, Ti, and Ag on Al(001), Al(110) and Al(111) surfaces. Considerations of lattice matching, surface energies, or compound formation energies alone do not adequately predict our result, We find that those metals with metallic radii smaller than Al(e.g. Ni, Fe, Co, Pd) tend to form alloys at the TM-Al interface, while those atoms with larger atomic radii(e.g. Ti, Ag) form epitaxial overlayers. Thus we are led to consider models in which the strain energy associated with alloy formation becomes a kinetic barrier to alloying. Furthermore, we observe the formation of metastable fcc Ti up to a critical thickness of 5 monolayers on Al(001) and Al(110). For Ag films we observe arbitrarily thick epitaxial growth exceeding 30 monolayers with some Al alloying at the interface, possible driven by interface strain relief. Typical examples of these interface structures will be discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• Journal of Distribution Science
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• v.11 no.4
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• pp.5-11
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• 2013

Purpose - The aim of this work is to study the reorientation that the export industrial sectors in Costa Rica have experienced during the last 20 years. Research design, data, methodology - The study employs the Cluster Analysis with the export data (20 years of cut-off period) from Costa Rica to the U.S-market. To make the predictions, the technique of the time series was used, with official data (from 2001 to 2010) from the U.S. Department of Commerce and the U.S. International Trade Commission. Results - The Cluster Analysis, show how the economic sectors of traditional products exports of Costa Rica have progressively become in exporters of non-traditional products, meanwhile,the time series confirms that this trend will continue, at least during the next five years. Conclusions - The industry of traditional products exports of Costa Rica (dressmaking, vegetables, coffee, mate, species, etc.) will progressively become in exporters of non- traditional products with a high-tech component (i.e., mechanical equipment and devices, electronic devices and medical equipment),as a consequence of the Chinese (Costa Rica's main competitor) economy's presence in the Organization for Economic Co-operation and Development (OCDE). This fact has enabled the potential improvement of Costa Rica's international competitiveness in the U.S. market.

• Journal of the Korea Computer Industry Society
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• v.3 no.2
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• pp.149-158
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• 2002

This paper deals with design and verification of an arithmetic logic unit(ALU) to be used for development of optical computers. The ALU is based on optical switching device, $LiNbO_3$, which is easy to interface with electronic technology and most common in the market. It consists of an arithmetic/logic circuit performing logic operations, memory devices storing operands and the results of operations, and supplementary circuits to select instruction codes, and operates in bit-serial manner. In addition, a simulator is developed for verification of the design, and a set of basic instructions are executed in sequence and step-by-step changes in the accumulator and the memory are examined through simulations, to show that various operations are performed correctly.

• Progress in Superconductivity
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• v.1 no.1
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• pp.36-41
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• 1999

Methods for mode identification and accurate measurements of the unloaded Q ($Q_0$) of a dielectric-loaded $TE_{01{\delta}}$ mode cavity resonator with HTS endplates are proposed. A resonator with a sapphire rod and $YBa_2Cu_3O_{7-x}$(YBCO) endplates was prepared and its microwave properties were studied at temperatures above 30 K. The $TE_{01{\delta}}$ mode $Q_0$ of the resonator, designed to work as a tunable resonator with variations in the gap distance (s) between the sapphire rod and the top YBCO, was more than 1000000 at s = 0 mm and at 30 K with the resonant frequency of 19.56 GHz. The $TE_{01{\delta}}$ mode $Q_0$ decreases as s increases for s < 2 mm until mode couplings between the $TE_{01{\delta}}$ mode and other modes appeared at s = 2 mm. Significant dependence of the $TE_{01{\delta}}$ mode $Q_0$ on the input and output coupling constants was also observed. Applications of the open-ended $TE_{01{\delta}}$ mode cavity resonator for a tunable resonator with a very high Q as well as a characterization tool for the surface resistance measurements of HTS films are described.

• Korean Journal of Materials Research
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• v.14 no.6
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• pp.443-450
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• 2004

Parylene polymer thin film shows excellent homogeneous coverage chracteristics when it was deposited onto very complex three dimensional solid matters, such as deep hole and micro crack. The parylene deposition process can be conducted at room temperature although most of chemical vapor deposition processes request relatively high processing temperature. Therefore, the parylene coating process does not induce any thermal problems. Parylene thin film is transparent and has extremly high chemical stability. For example, it shows high chemical stability with high reactive chemical solutions such as strong acid, strong alkali and acetone. The bio-stability of this material gives good chances to use for a packaging of biomedical devices and electronic devices such as display. In this review article, principle of deposition process, properties and application fields of parylene polymer thin film are introduced.

• Journal of KIISE:Software and Applications
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• v.34 no.3
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• pp.219-225
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• 2007

UPnP AV Framework automatically integrates and manages various AV devices that are connected to network as an important component in home network. Therefore, user can access and control AV contents at any time. But, other existing home entertainment systems target multimedia service support that is based on multimedia home server system. In this paper, we propose an integrated home entertainment system (u-MUSE system) that supports remote control service. It can manage application in remote AV device or control AV contents directly in home network environment. The proposed system sufficiently performs role of control center for electronic devices in home via integrated system control and AV contents playback service.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.69-70
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• 2000

There are currently considerable interest in the applications of conjugated polymers, oligomers, and small molecules for thin-film electronic devices. Organic materials have potential advantages to be utilized as semiconductors in field-effect transistors and light-emitting diodes. In this study, pentacene thin-film transistors (TFTs) were fabricated on glass substrate. Aluminums were used for gate electrodes. Silicon dioxide was deposited as a gate insulator by PECVD and patterned by reactive ion etching (R.I.E). Gold was used for the electrodes of source and drain. The active semiconductor pentacene layer was thermally evaporated in vacuum at a pressure of about $10^{-8}$ Torr and a deposition rate $0.3{\AA}/s$. The fabricated devices exhibited the field-effect mobility as large as 0.07 $cm^2/V.s$ and on/off current ratio as larger than $10^7$.