• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.296-297
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• 2005

We have investigated the quench performance of shunt reactors in the parallel connection of resistive type superconducting fault current limiter (SFCL) components based on YBCO films. To increase voltage rating, components are connected in series and to increase current level, they are connected in parallel. This method has cauesd the unbalanced quench between each components. To improve the problem, we have compared the quench properties between the current limiting components without and with shunt reactors connected in parallel. To improve the quench performance, across individual SFCL components connected the shunt reactor in parallel. The components with shunt reactors successfully produced simultaneous quench, resulting from the bypass of the fault current in the direction of the shunt reactor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.10
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• pp.799-802
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• 2011

In this study, SiC single-crystal ingots were prepared on two seed crystals with different doping level by using the physical vapor transport (PVT) technique; then, SiC crystal wafers sliced from the grown SiC ingot were systematically investigated to find the effect of seed doping level on the doping concentration and crystal quality of the SiC. To exclude extra effects induced by adjustment of the process parameters, we simultaneously grew the SiC crystals on two seed crystals with different level, which were fabricated from previous two SiC crystal ingots.

• Journal of Applied Reliability
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• v.12 no.3
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• pp.153-163
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• 2012

Recently, as a electronic components are becoming more high-density, so that electronic circuits have smaller pitches between the leads and are more vulnerable to insulation failure. And the reliability of electric insulation has become an ever important issue as device contact pitches and print patterns shrink. Ion migration occurs in highly humid environment as voltage is applied to an installed print circuit. Under highly humid and voltage applied circumstances, electronic components respond to applied voltages by electrochemical ionization of metals, and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. In thesis, we study acceleration test of ion migration in FR-4 PCB plated with Sn. Voltage applied test of FR-4 PCB circuits plated with Sn was tested in the temperature and humidity environments. As a result of this test, equation of acceleration model was derived.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.05a
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• pp.87-89
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• 1994

The effects of low molecular weight components of LDPE and sample molding condition were investigated to find the orgins for heterocharge in LDPE without any addtives. Low molecular weight chains of LDPE encourages the formation of heterocharge by being charged and migrating the counter electrode. The formation of heteroohage in LDPE was also effected by sample preparation process and the kind of a moling film. When PET film is used as a molding layer, the carbonyl, which may lead to increase the heterocharge, formed at surface of LDPE.

• Transactions of Materials Processing
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• v.4 no.1
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• pp.79-91
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• 1995

Precision forming of electronic components has appeared to be competitive according to manufacturing cost and dimensional tolerances. Now domestic electronic companies have been involving in utilization of the finite element method in process design of precision forming. A forming process to produce an electronic component, aperture, has been inbestigated to find out forming defects during multi-operations. The applications of the commercial FEM software MARC show a possibility of defect in precision coining process among the whole multi-process. Thus the coining process of three-dimensional deformation is analyzed using DAMF-3D which has been developed in this lab with the rigid-plastic algorithm. The result f simulations by DAMF-3D provides clear description of the defect involved in the coining process.

• International Journal of Automotive Technology
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• v.8 no.3
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• pp.361-373
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• 2007

In previous work, an approach based on maximizing the efficiency of an internal combustion engine while ignoring the power conversion efficiency of other powertrain components, such as the electric motor and power battery or ultracapacitor, was implemented in the steady-state optimization of an internal combustion engine for hybrid electric vehicles. In this paper, a novel control algorithm was developed and successfully justified as the basis for maximal power conversion efficiency of overall powertrain components. Results indicated that fuel economy improvement by 3.9% compared with the conventional control algorithm under China urban transient-state driving-cycle conditions. In addition, using the view of the novel control algorithm, maximal power generation of the electric motor can be chosen.

• Journal of Biosystems Engineering
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• v.33 no.5
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• pp.333-339
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• 2008

The purpose of this study was to develop a portable electronic nose system to measure volatile components of agricultural and food products. Also, a graphical operating software to control the electronic nose system and to acquire signals through the Internet was developed. An array of five commercial metal oxide gas sensors was used to detect various volatile gas components of target samples. Transient and steady state signals were analyzed to extract variables related to sample states, To find optimal operating conditions of the system, several experiments were performed with different gas chambers, vacuum pumps, gas sampling temperatures, and sample container sizes. The patterns of gas sensor signals were analysed to find effects of the various conditions.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.22-30
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• 2013

Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

• Journal of Power Electronics
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• v.13 no.6
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• pp.919-927
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• 2013

This paper proposes a Boundary Current Mode (BCM) control scheme to realize soft switching on a conventional single phase full bridge DC/AC inverter. This technique with the advantages of no auxiliary components, low cost, high efficiency, and simple in control, is attractive for micro-inverter applications. The operation principle and characteristic waveforms of the proposed soft switching technique are analyzed in theory. A digital controller is provided based on that theory. To balance the requirements of efficiency, switching frequency, and inductor size, the design considerations are discussed in detail to guide in BCM inverter construction. A 150W prototype is built under these guidelines to implement the BCM control scheme. Simulation and experiment results demonstrate the feasibilities of the proposed soft switching technique.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.882-885
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• 2004

Organic molecules have many properties that make them attractive for electronic applications. We have been examining the progress of memory cell by using molecular-scale switch to give an example of the application using both nanoscale components and Si-technology. In this study, molecular electronic devices were fabricated with amion style derivatives as redox-active component to compare to the devices using Zn-Porphyrin derivatives. This molecule is amphiphilic to allow monolayer formation by the Langmuir-Blodgett (LB) method, and then this LB monolayer is inserted between two metal electrodes. According to current-voltage (I-V) characteristics, it was found that the devices show remarkable hysteresis behavior and can be used as memory devices at ambient conditions, when aluminum oxide layer was existed on bottom electrode. Diode-like characteristics were measured only, when Pt layer was existed as bottom electrode. It was also found that this metal layer interacts with the organic molecules and acts as a protecting layer, when thin Ti layer was inserted between the organic molecular layer and the top Al electrode. These electrical properties of the devices may be applicable to active components for the memory and/or logic gates in the future.