• Transactions on Electrical and Electronic Materials
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• 제4권3호
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• pp.34-37
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• 2003

[ $HfO_2$ ] and $HfO_xN_y$ films were deposited by plasma-enhanced chemical vapor deposition using $Hf[OC(CH_3)_3]_4$ as the precursor in the absence of $O_2$. The crystallization temperature of the $HfO_xN_y$ films is higher than that of the $HfO_2$ film. Nitrogen incorporation in $HfO_xN_y$ was confirmed by auger electron spectroscopy analysis. After post deposition annealing (PDA) at 800$\Box$, the EOT increased from 1.34 to 1.6 nm in the $HfO_2$ thin films, whereas the increase of EOT was suppressed to less than 0.02 nm in the $HfO_xN_y$. The leakage current density decreased from 0.18 to 0.012 $A/cm^2$ with increasing PDA temperature in the $HfO_2$ films. But the leakage current density of $HfO_xN_y$ does not vary with increasing PDA temperature because an amorphous $HfO_xN_y$ films suppresses the diffusion of oxygen through the gate dielectric.

• 대한전자공학회논문지SD
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• 제43권9호
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• pp.64-68
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• 2006

본 연구에서는 Si bump를 이용해 기판의 기계적, 열적 특성을 개선한 MCM-D 기판공정을 개발하였고, 이를 system-on-package(SOP)-D개념의 system 구현에 적용하고자 하였다. 이 과정에서 밀리미터파 대역에 적용될 수 있는 필터를 설계하고 구현하여 그 특성을 관찰하였다. 두 가지 형태의 필터를 구현하였는데 첫 번째는 공진기간의 커플링을 이용한 구조로서 2층의 금속층과 3층의 유전체(BCB)를 이용하였다. 구현된 필터 특성은 중심주파수 55 GHz에서의 삽입손실이 2.6 dB이고 군지연이 0.06 ns정도로 우수한 특성을 나타내었다. 또한 일반적으로 알려진coupled line 형태의 필터를 구현하였는데 삽입손실이 3 dB, 군지연이 0.1 ns정도의 특성을 나타내었다. 이렇게 내장형 필터를 포함한 MCM-D 기판은 MMIC를 flip-chip 방법으로 실장 할 수 있어서 집적화된 밀리미터파 대역 초소형 system 구현에 적용되어 우수한 특성을 나타낼 것으로 기대된다.

• 한국전기전자재료학회논문지
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• 제30권11호
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• pp.717-721
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• 2017

We studied the performance enhancement of organic light-emitting diodes (OLEDs) using 2,3,5,6-fluoro-7,7,8,8-tetracyanoquinodimethane ($F_4-TCNQ$) as the hole-transport layer. To investigate how $F_4-TCNQ$ affects the device performance, we fabricated a reference device in an ITO (170 nm)/TPD(40 nm)/$Alq_3$(60 nm)/LiF(0.5 nm)/Al(100 nm) structure. Several types of test devices were manufactured by either doping the $F_4-TCNQ$ in the TPD layer or forming a separate $F_4-TCNQ$ layer between the ITO anode and TPD layer. N,N'-diphenyl-N,N'-di(m-tolyl)-benzidine (TPD), tri(8-hydroxyquinoline) aluminum ($Alq_3$), and $F_4-TCNQ$ layers were formed by thermal evaporation at a pressure of $10_{-6}$ torr. The deposition rate was $1.0-1.5{\AA}/s$ for TPD and $Alq_3$. The LiF was subsequently thermally evaporated at a deposition rate of $0.2{\AA}/s$. The performance of the OLEDs was considered with respect to the turn-on voltage, luminance, and current efficiency. It was found that the use of $F_4-TCNQ$ in OLEDs enhances the performance of the device. In particular, the use of a separate layer of $F_4-TCNQ$ realizes better device performance than other types of OLEDs.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.130.2-130.2
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• 2013

Today, chemical vapor deposition (CVD) of hydrocarbon gases has been demonstrated as an attractive method to synthesize large-area graphene layers. However, special care should be taken to precisely control the resulting graphene layers in CVD due to its sensitivity to various process parameters. Therefore, a facile synthesis to grow graphene layers with high controllability will have great advantages for scalable practical applications. In order to simplify and create efficiency in graphene synthesis, the graphene growth by thermal annealing process has been discussed by several groups. However, the study on growth mechanism and the detailed structural and optoelectronic properties in the resulting graphene films have not been reported yet, which will be of particular interest to explore for the practical application of graphene. In this study, we report the growth of few-layer, large-area graphene films using rapid thermal annealing (RTA) without the use of intentional carbon-containing precursor. The instability of nickel films in air facilitates the spontaneous formation of ultrathin (<2~3 nm) carbon- and oxygen-containing compounds on a nickel surface and high-temperature annealing of the nickel samples results in the formation of few-layer graphene films with high crystallinity. From annealing temperature and ambient studies during RTA, it was found that the evaporation of oxygen atoms from the surface is the dominant factor affecting the formation of graphene films. The thickness of the graphene layers is strongly dependent on the RTA temperature and time and the resulting films have a limited thickness less than 2 nm even for an extended RTA time. The transferred films have a low sheet resistance of ~380 ${\Omega}/sq$, with ~93% optical transparency. This simple and potentially inexpensive method of synthesizing novel 2-dimensional carbon films offers a wide choice of graphene films for various potential applications.

• 전기전자학회논문지
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• 제11권4호
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• pp.272-278
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• 2007

본 논문에서는 최근 고출력 및 고온 분야의 반도체 분야에 널리 이용되고 있는 AlGaN/GaN 고 전자 이동도 트랜지스터 (High Electron Mobility Transistor, HEMT) 에 대해 DC (direct current) 특성과 열 특성을 기판을 달리하며 시뮬레이션을 수행하였다. 일반적으로 HEMT 소자의 전자 이동도 및 열전도 특성은 기판의 영향이 그 특성을 크게 좌우한다. 이러한 문제점으로 인해 GaN 기반의 HEMT 소자의 기판에 대한 연구가 활발히 진행되고 있다. 따라서, 일반적인 Drift-Diffusion 모델과 열 모델을 이용하여 Si, sapphire, SiC (silicon carbide)으로 각각 기판을 변화시키며 시뮬레이션을 하였다. 열 모델 시뮬레이션은 온도를 각각 300, 400, 500K로 변화시키며 그 결과를 비교, 해석 하였다. 전류-전압 (I-V) 특성을 T= 300 K, $V_{GS}$=1 V의 조건에서 시뮬레이션 한 결과, 드레인 포화전류 ($I_{D,max}$)의 값과 sapphire 기판은 189 mA/mm, SiC 기판은 293 mA/mm, Si 기판은 258 mA/mm 를 나타내었다. 또한 T= 500 K에서 최대 전달컨덕턴스($G_{m,max}$)는 각각 38, 50, 31 mS/mm 를 나타내었다.

• 센서학회지
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• 제9권3호
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• pp.242-247
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• 2000

10 mole%의 과잉 PbO가 첨가된 타겟을 이용하여 $(La_{0.5}Sr_{0.5})CoO_3(LSCO)/Pt/Ti/SiO_2/Si$ 위에 RF 마그네트론 스퍼터링 방법을 이용하여 $Pb_{0.99}[(Zr_{0.6}Sn_{0.4})_{0.9}Ti_{0.1}]_{0.98}Nb_{0.02}O_3(PNZST)$ 박막을 증착시켰다. $500^{\circ}C$의 기판온도, 80W의 RF power에서 증착된 박막은 급속열처리(RTA)후에 페로브스카이트 상으로 결정화되었다. $650^{\circ}C$, 공기중에서 10초 동안 열처리된 박막이 가장 우수한 결정성과 전기적 특성을 나타내었다. 이러한 박막으로 제작된 PNZST 커패시터는 약 $20\;{\mu}C/cm^2$ 정도의 잔류분극과 약 50 kV/cm 정도의 항전계를 나타내었다. 또한, $2.2{\times}10^9$의 스위칭 후에도 잔류분극의 감소는 10% 미만이었다.

• Transactions on Electrical and Electronic Materials
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• 제11권6호
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• pp.261-265
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• 2010

In this paper, we attempt to improve the electrical characteristics of epoxy resin at high temperature (above $80^{\circ}C$) by adding magnesium oxide (MgO), which has high thermal conductivity. Scanning electron microscopy (SEM) of the dispersion of specimens with added MgO reveals that they are evenly dispersed without concentration. The dielectric breakdown characteristics of $SiO_2$ and MgO nanocomposites are tested by measurements at different temperatures to investigate the filler's effect on the dielectric breakdown characteristics. The dielectric breakdown strength of specimens with added $SiO_2$ decreases slowly below $80^{\circ}C$ (low temperature) but decreases rapidly above $80^{\circ}C$ (high temperature). However, the gradient of the dielectric breakdown strength of specimens with added MgO is slow at both low and high temperatures. The dielectric breakdown strength of specimens with 0.4 wt% $SiO_2$ is the best among the specimens with added $SiO_2$, and that of specimens with 3.0 wt% and 5.0 wt% MgO is the best among those with added MgO. Moreover, the dielectric strength of specimens with 3.0 wt% MgO at high temperatures is approximately 53.3% higher than that of specimens with added $SiO_2$ at $100^{\circ}C$, and that of specimens with 5.0 wt% of MgO is approximately 59.34% higher under the same conditions. The dielectric strength of MgO is believed to be superior to that of $SiO_2$ owing to enhanced thermal radiation because the thermal conductivity rate of MgO (approximately 42 $W/m{\cdot}K$) is approximately 32 times higher than that of $SiO_2$ (approximately 1.3 $W/m{\cdot}K$). We also confirmed that the allowable breakdown strength of specimens with added MgO at $100^{\circ}C$ is within the error range when the breakdown probability of all specimens is 40%. A breakdown probability of up to 40% represents a stable dielectric strength in machinery and apparatus design.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• 한국정보전자통신기술학회논문지
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• 제12권4호
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• pp.449-455
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• 2019

본 논문은 Bridgeless PFC Converter의 환류 다이오드를 SiC SBD(Schottky Barrier Diode)로 제안하여 고효율화를 달성하였다. 또한 Bridgeless PFC Converter의 동작원리에 대한 설명을 통해 Bridgeless PFC Converter에서 환류 다이오드의 도통 구간을 나타내어 환류 다이오드의 손실에 따른 시스템 손실의 기여도를 검증하였고, SiC SBD 소자의 물성 및 역 회복 특성에 따른 장점을 설명하였으며 턴 온 손실과 턴 오프 손실을 측정하여 효율을 비교 분석하고, 소자 단품 특성을 확인하기 위한 다이오드의 역회복 파형 분석을 통하여 소자의 역회복 손실을 계산하였다. 소자 특성을 고려한 시뮬레이션 결과 값을 도출해내어 실제 시스템의 파형 분석 및 비교를 통해 그 결과 값을 검증하였다. 소자 특성을 고려하기 위하여 PSIM의 Thermal Module을 사용하여 시뮬레이션을 진행하였으며, 그 결과로 턴온 손실 0.6W, 턴 오프 손실 20.6W로 전체 스위칭 손실은 22.2W로 나타났다. 시작품 실험을 통하여 분석한 결과 턴온 손실 0.608W, 턴 오프 손실 21.62W로 전체 스위칭 손실 22.228W의 결과 값을 도출하였고, 두 결과 값의 비교로 실험 방법의 타당성을 입증하였다. 또한 최대 효율 94.58%의 고효율을 달성하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.397-397
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• 2013

The electrical, electronic, optical properties and the local structure of Nickel Oxide (NiO) thin film have been investigated by X-ray photoelectron spectroscopy (XPS), Reflection Electron Energy Loss Spectroscopy (REELS), UV-spectrometer,Hall Effect measurement and X-ray absorption spectroscopy (XAS). The XPS results show that the Ni 2p spectra for all films consist of $Ni2p_{3/2}$ at around 854.5 eV which indicate the presence of Ni-O bond from NiO phase and for the annealed film at temperature above $200^{\circ}C$ shows the coexist Ni oxide and Ni metal phase. The REELS spectra showed that the band gaps of the NiO thin films were abruptly decreased with increasing temperature. The values of the band gaps are consistent with the optical band gaps estimated by UV-Spectrometer. The optical transmittance spectra shows that the transparency of NiO thin films in the visible light region was deteriorated with higher temperature due to existence of $Ni^0$. Hall Effect measurement suggest that the NiO thin films prepared at relatively low temperatures (RT and $100^{\circ}C$) are suitable for fabricating p-type semiconductor which showed that the best properties was achieved at $100^{\circ}C$, such as a low resistivity of $7.49{\Omega}.cm$. It can be concluded that the annealing process plays a crucial role in converting from p type to n type semiconductor which leads to reducing electrical resistivity of NiO thin films. Furthermore, the extended X-ray absorption fine structure (EXAFS) spectrum at the Ni K-edge was used to address the local structure of NiO thin films. It was found that the thermal treatments increase the order in the vicinity of Ni atom and lead the NiO thin films to bunsenite crystal structure. Moreover, EXAFS spectra show in increasing of coordination number for the first Ni-O shell and the bond distance of Ni-O with the increase of substrate temperature.