• 대한기계학회논문집A
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• 제20권11호
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• pp.3538-3548
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• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.7-8
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• 2006

The effects of heat treatment on the electrical properties of SGOI were examined. We proposed the optimized heat treatments for improving the interfacial electrical properties in SGOI-MOSFET. By applying the additional pre-RTA(rapid thermal annealing) before gate oxidation and post-RTA after dopant activation, the driving current, the transconductance, and the leakage current were improved significantly.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.281-281
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• 2007

Low Temperature Co-fired Ceramic (LTCC) technology has been used in electronic device for various functions. LTCC technology is to fire dielectric ceramic and a conductive electrode such as Ag or Cu thick film below the temperature of $900^{\circ}C$ simultaneously. The glass-ceramic has been widely used for LTCC materials due to its low sintering temperature, high mechanical properties and low dielectric constants. To obtain the high strength, addition of filler, the microstructure should have various crystals and low pores in a composite. In this study, two glass frits were mixed with different alumina size(0.5, 2, 3.7um) and sintered at the range of $850{\sim}950^{\circ}C$. The microstructure, crystal phases, thermal and mechanical properties of the composites were investigated using FE-SEM, XRD, TG-DTA, Dilatomer. When the particle size of $Al_2O_3$ filler increased, the starting temperatures for the densification of the sintered bodies, onset point of crystallization, peak crystallization temperature in the glass-ceramic composites decreased gradually. After sintered at $900^{\circ}C$, the glass frits were crystallized as $CaAl_2Si_2O_8\;and\;CaMgSi_2O_6$. The purpose of our study is to understand the relationship between the $Al_2O_3$ particle size and thermal properties in composites.

• 마이크로전자및패키징학회지
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• 제31권1호
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• pp.7-15
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• 2024

유연신축성 전자 디바이스의 다기능화, 소형화 및 고출력화 추세에 따라 우수한 열 전달 특성을 갖춘 재료나 구조가 이슈로 부상하고 있다. 기존의 열계면 소재는 급격한 구부림, 비틀림, 신축 등을 겪어야 하는 유연신축성 전자 디바이스의 방열 요구성능을 충족시키지 못한다. 이러한 문제를 해결하기 위하여 높은 열전도성과 신축성을 동시에 갖는 열계면 소재 개발이 요구된다. 본 논문에서는 Liquid metal, Carbon, Ceramic 기반 신축성 열계면 소재의 연구동향을 살펴보고 열적, 기계적 특성 향상을 위한 효과적 전략을 알아보고자 한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.133-137
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• 2004

In this paper, we investigated impurities content, absorption properties, and thermal properties showing by changing the content of carbon black which is semiconductive materials for underground power transmission. Specimens were made of sheet form with the three of existing resins and the nine of specimens for measurement. Impurities content of specimens and absorption properties were measured by ICP-AES (Inductively Coupled Plasma Atomic Emission Spectrometer) and Karl Fisher. And high temperature, heat degradation initiation temperature, and heat weight loss were measured by TGA (Thermogravimetric Analysis). The dimension of measurement temperature was 0$[^{\circ}]$ to 800$[^{\circ}]$, and rising temperature was 10$[^{\circ}/min]$. Impurities content was highly measured according to increasing the content of carbon black from this experimental result also absorption amount was increased according to these properties. Specially, impurities content values of the A1 and A2 of existing resins were measured more than 4000[ppm]. Heat degradation initiation temperature from the TGA results was decreased according to increasing the content of carbon black. All over, heat stabilities were EEA>EBA>pEVA. That is, heat stabilities of EVA containing the weak VA(vinyl acetate) against heat was measured the lowest.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.481-483
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• 1998

The problem of production of new materials based on polyheteroarylenes and other polymers combining good mechanical and dielectric properties. radiation and chemical stability with heat- and thermal stability is related with the development of efficient synthesis technique of starting low-molecular compounds. Alicyclic dianhydrides are believed to be the promising monomers to synthesize various polymers.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.481-484
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• 2004

A form of measured temperature distribution to estimate condition of a electrical apparatus is a absolute reference for condition of the apparatus, time rate of transition, and difference between reference and currently temperature. Because passive thermography which has not injection of external thermal stimulation shows difference of temperature being on surface of a structure and temperature difference between the structure and back ground, the result could apply only to estimation or monitor for condition of terminal relaxation and overload related with temperature rising. However, a thermal flow in active thermography is differently generated by structure and condition of surface and subsurface. This paper presents the nondestructive testing using the properties and includes the results by heat injection and cooling to the apparatus. The buried discontinuity of subsurface could be detected by these techniques.

• 한국전기전자재료학회논문지
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• 제21권8호
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• pp.766-769
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• 2008

Zinc oxide (ZnO) nanowires were prepared on Si substrates by a thermal evaporation method at different temperatures and $O_2$ pressure. Microstructural analysis of the obtained ZnO nanowires was performed by using transmission electron microscopy(TEM) and scanning electron microscopy(SEM). Phase analysis was done using X-ray diffraction(XRD). As the deposition temperature and oxygen pressure were increased, the diameter and length of ZnO nanowires had a tendency to increase. Based on TEM and XRD analyses, the nanowires are single crystalline in nature and consist of a single phase. According to the measurements, the ZnO nanowires grown at 1100$^{\circ}C$, Ar 50 sccm, $O_2$ 10 sccm have good properties.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.67-67
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• 2012

Graphene, two-dimensional one-atom-thick planar sheet of carbon atoms densely packed in a honeycomb crystal lattice, exhibits fascinating electrical properties, such as a linear energy dispersion relation and high mobility in addition to a wide-range optical absorption and high thermal conductivity. Graphene's outstanding tensile strength allows graphene-based electronic and photonic devices to be flexible, bendable, or even stretchable. Recently many groups have reported high performance electronic and optoelectronic devices based on graphene materials, i.e. field-effect transistors, gas sensors, nonvolatile memory devices, and plasmonic waveguides, in which versatile properties of graphene materials have been incorporated into a flexible electronic or optoelectronic platform. However, there are several fundamental or technological hurdles to be overcome in real applications of graphene in electronics and optoelectronics. In this tutorial we will present a short introduction to the basic material properties and recent progresses in applications of graphene to electronics and optoelectronics and discuss future outlook of graphene-based devices.

• 전기학회논문지
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• 제65권9호
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• pp.1504-1510
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• 2016

The aim of this study is to improve properties both glass transition temperature($T_g$) and coefficient of thermal expansion(CTE) using epoxy/micro-nano alumina composites with adding glycerol diglycidyl ether (GDE:1,2,3,5g). This paper deals with the effects of GDE addition for epoxy/micro alumina contents (40, 50, 60wt%)+surface modified nano alumina(1_phr) composites. 20 kinds specimen were prepared with containing micro, nano alumina and GDE as a micro composites(10, 20, 30, 40, 50, 60, 70wt%) or a nano/micro alumina composites(1phr/40, 50, 60wt%). Average particle size of nano and micro alumina used were 30nm and $1{\sim}2{\mu}m$, respectively. The micro alumina used were alpha phase with Heterogeneous and nano alumina were gamma phase particles of spherical shape. The glass transition temperature and coefficients of thermal expansion was evaluated by DSC and TMA. The glass transition temperature decreased and coefficients of thermal expansion become smaller with filled contents of epoxy/micro alumina composites. On the other hand, $T_g$ and CTE as GDE addition variation(1,2,3,5g) of epoxy/micro-nano alumina composites decreased and increased respectively.