• Korean Journal of Materials Research
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• v.13 no.5
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• pp.303-308
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• 2003

Amorphous carbon nitride films deposited on Si(001) substrates by a plasma enhanced chemical vapor deposition (PECVD) technique using CH$_4$and $N_2$as reaction gases were thermally annealed at various temperatures under$ N_2$atmosphere, then their physical properties were investigated particularly as a function of annealing temperature. Above $600^{\circ}C$ a small amount of crystalline $\beta$-$C_3$$N_4$ phase evolves, while the film surface becomes very rough due to agglomeration of fine grains on the surface. As the annealing temperature increases, both the hardness and the $sp^3$ bonding nature are enhanced. In contrast to our expectation, higher annealing temperature results in a relatively higher friction mainly due to big increase in roughness at that temperature.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.260-260
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• 2010

In recent years, polymer/clay nanocomposites have generated a great interest, both in industry and in academia, because they often exhibit remarkable improvement in material properties when compared with the virgin polymer or conventional micro and macro-composites. Among these properties are stiffness, strength, dimensional stability and permeability. [1-3] The dispersion of hydrophilic silicates in a hydrophobic matrix like Polyethylene (PE) is difficult because of the difference in character between PE and Montmorillonite (MMT). Therefore, it is necessary to modify PE with polar groups, which can increase the hydrophilicity of PE. In this study, High density polyethylene (HDPE)/$Mg(OH)_2$/Montmorillonite (MMT) nanocomposites having a various compositions were prepared by a melt blending technique with an internal mixer and properties namely mechanical, morpology, rheological and thermal properties were investigated

• Electrical & Electronic Materials
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• v.7 no.3
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• pp.187-199
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• 1994

In order to find an effect of structural changes due to variation of addition ratio of anhydride hardener and postcuring herat-treatments upon electrical properties of epoxy composites, the dielectric properties over a frequency range from 30[Hz] to l[MHz] were investigated in the temperature range of 20-180[.deg. C]. From the dielectric properties, the a peaks related with glass-transition phenomena of epoxy network appeared near 130[.deg. C], the conduction loss in high temperature region above 150[.deg. C] due to thermal dissociation of hardener started off with the low frequency side and the .betha. peak concerned with contribution of movable unreacted terminal epoxy groups and curing agents in the glass states concurred with the high-frequency side below 20[.deg. C]. And an effect of an hydride hardener upon structural changes and of postcuring heat treatments upon structural stability in epoxy composites would be explained through the estimation of the distribution of relaxation times and the activation energy for a .alpha. peak according to the WLF equations.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1510-1515
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• 2006

A self-priming and photosensitive aqueous-basedevelopable benzocyclobutene (BCB)-based dielectric material curable in air is described. Patterned films have high resolution. Whether cured in nitrogen or in air, the formulation produces a film with optical, electrical, thermal, and mechanical properties desired for many microelectronic applications, such as a planarization layer or insulation layer in display applications. A self-priming, air-curable nonphoto- sensitive BCB material is also described.

• Nuclear Engineering and Technology
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• v.51 no.5
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• pp.1373-1380
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• 2019

Besides promising implications as fertile nuclear materials, thorium carbonitrides are of great interest owing to their peculiar physical and chemical properties, such as high density, high melting point, good thermal conductivity. This paper reports first-principles simulation results on the structural, electronic and magnetic properties of cubic thorium carbonitrides $ThC_xN_{(1-x)}$ (X = 0.03125, 0.0625, 0.09375, 0.125, 0.15625) employing formalism of density-functional-theory. For the simulation of physical properties, we incorporated full-potential linearized augmented plane-wave (FPLAPW) method while the exchange-correlation potential terms in Kohn-Sham Equation (KSE) are treated within Generalized-Gradient-Approximation (GGA) in conjunction with Perdew-Bruke-Ernzerhof (PBE) correction. The structural parameters were calculated by fitting total energy into the Murnaghan's equation of state. The lattice constants, bulk moduli, total energy, electronic band structure and spin magnetic moments of the compounds show dependence on the C/N concentration ratio. The electronic and magnetic properties have revealed non-magnetic but metallic character of the compounds. The main contribution to density of states at the Fermi level stems from the comparable spectral intensity of Th (6d+5f) and (C+N) 2p states. In comparison with spin magnetic moments of ThSb and ThBi calculated earlier with LDA+U approach, we observed an enhancement in the spin magnetic moments after carbon-doping into ThN monopnictide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.245-245
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• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.633-637
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• 2023

Recently, with the development of the smart device market, the integration of high-functional devices has increased the heat density, causing overload of the device, and resulting in various problems such as shortened lifespan, performance degradation, and failure. Therefore, research on heat dissipation materials is being actively conducted to realize next-generation electronic products. The heat dissipation material is characterized in that it is easy to dissipate heat due to its high thermal conductivity and minimizes leakage current flowing through the heat dissipation material due to its low electrical conductivity. In this study, flower-shaped Al₂O₃ and BN composites were engineered with a simple hydrothermal synthesis approach, and their thermal conductivity characteristics were compared and evaluated for each synthesis condition for the application to a heat dissipation material. Spherical BN and flower-shaped Al₂O₃ were easily obtained, and SEM/EDS analyses confirmed the uniform presence of BN between the Al₂O₃, and it can be expected that these shapes can affect the thermal conductivity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.99-99
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• 2010

Polymer nanocomposite has been attracting much attention as a new insulation material, since homogeneous dispersion of nm-sized inorganic fillers can improve various properties significantly. In this paper, various kinds of epoxy based nanocomposites were made and AC breakdown strength of Nano-TiO2 and micro-silica filler mixture of epoxy based composites were studied by sphere to sphere electrode. Moreover, nano- and micro-filler combinations were adopted as an approach toward practical application of nanocomposite insulation materials. Nano-TiO2 particle size is about 10nm and composites ratio was resin (100) : hardener (82) : accelerator (1.5). AC breakdown test was performed at room temperature (25 [$^{\circ}C$], 80 [$^{\circ}C$] and 100 [$^{\circ}C$] in the vicinity of Tg (90[$^{\circ}C$]). And thermal conductivity were measured by ASTM-D5470.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.94-97
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• 2002

Phase transitions of the $Sm_{2}(MoO_{4})_{3}$ single crystal were studied through thermal analysis, x-ray methods and SEM/EDS. $Sm_{2}(MoO_{4})_{3}$ undergoes the ferroelastic and ferroelectric phase transition at $198^{\circ}C$. With increasing temperature, the second phase transition occurs at $928^{\circ}C$. From TG analysis, the mass loss of $Sm_{2}(MoO_{4})_{3}$ exhibits an anomalous behavior at about $650^{\circ}C$ and the curves increased monotonically to $1132^{\circ}C$. SEM and EDS show that the escape of ${MoO_{4}^{2-}$ tetrahedra from the lattice of $Sm_{2}(MoO_{4})_{3}$ increase above $928^{\circ}C$, so $Sm_{2}(MoO_{4})_{3}$ has a very rough surface and internal cracks.