• Corrugated packaging logistics
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• no.47 s.10
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• pp.125-135
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• 2003

• The monthly packaging world
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• s.101
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• pp.135-151
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• 2001

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.1-5
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• 2012

The quality and performance of electronic parts and equipment are affected by various types of stresses. Thermal stress caused by changes in the ambient usage environment and mechanical stress from vibration shock during transportation can degrade both quality and performance. This paper gives an overview about recent researches for measuring market environmental conditions of electronic equipments.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.1-7
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• 2012

Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.315-315
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• 2010

휴대용 전자 기기는 얇고 가벼우면서 빠른 대용량을 처리하는 속도와 다기능이 필요한 추세로 가고 있다. 기기 크기가 작아짐에 따라서 내장 되는 칩 또한 소형화, 고집적화, 고성능화가 요구되므로 이에 상응하는 발전된 패키징 기술이 필요하게 되었고, 이에 대응하기위해서 embedded components device 패키징 기술이 필요로 하게 되었다. 본 연구에서는 $21{\Omega}$ 의 저항 값을 갖는 1005 수동 소자를 prepreg를 이용하여 PCB기판에 내장 한 후 micro via를 이용하여 무전해 구리 도금으로 전기적인 연결을 하여 기판을 제작하였다. 제작되어진 기판으로 Reflow, Aging 테스트 후 칩과 계면간의 금속화합물 반응을 관찰하였다. 또한 Reflow외 시효처리를 끝마친 기판을 사용하여 drop test를 실시한 후 fail 발생 시 저항 값의 변화와 접합부의 미세조직을 관찰하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.317-317
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• 2010

전자기기의 수요 증가와 함께 기기의 소형화, 고집적화가 요구되어짐에 따라 packaging 기술 개발에서 필요한 소재에 관한 연구가 활발히 진행되고 있다. 이에 따라 우수한 절연특성, 낮은 열팽창계수와 낮은 흡습도를 갖고 있으며 무엇보다도 플렉시블하여 3차원 조립이 가능한 LCP가 차세대 기판 부품소재로 많이 거론되고 있다. 그러나 LCP는 구리 동박을 열 압착하여 패턴을 형성하므로 미세 패턴제작이 어려운 문제점이 있다. 본 연구에서는 LCP의 열가소성 특성을 이용하여 seed 구리 도금 층을 형성하여 열 압착 후 패턴 도금 법으로 $10{\mu}m$ 이하의 패턴을 형성하였으며 구리층과 LCP 간의 접합강도를 열 압착 온도 별로 측정하였다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.1-5
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• 2015

In high temperature aircraft electronics, aluminium based brazing filler is the prime choice today. Aluminium and its alloys have compatible properties like weight minimization, thermal conductivity, heat dissipation, high temperature precipitation hardening etc. suitable for the aerospace industry. However, the selection of brazing filler for high temperature electronics requires high temperature joint strength properties which is crucial for the aerospace. Thus the selection of proper brazing alloy material, the composition and brazing method play an important role in deciding the final reliability of aircraft electronic components. The composition of these aluminium alloys dependent on the addition of the various elements in the aluminium matrix. The complex shapes of aluminium structures like enclosures, heat dissipaters, chassis for electronic circuitry, in avionics are designed from numerous individual components and joined thereafter. In various aircraft applications, the poor strength caused by the casting and shrinkage defects is undesirable. In this report the effect of various additional elements on Al based alloys and brazing fillers have been discussed.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.175-183
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• 2000

The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-$SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1541_1542
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• 2009

본 논문에서는 바이오/환경센서 응용을 위해 실리콘 기판위에 나노 동공구조 백금 전극을 작동전극으로 갖는 소형화된 용존산소센서를 설계 및 제작하고 그 특성을 분석하였다. 제작된 용존산소 센서는 15 mm $\times$ 8 mm $\times$ 0.6 mm의 소형화된 크기를 가졌으며, -0.9 V의 인가전위 시에 각각 산소 포화 상태와 무산소 상태에서 2.14 mA와 0.8 mA의 환원전류 특성을 보였다. 또한, 다양한 산소 농도상태에서 각기 다른 전류응답 차이를 보였다. 이를 통해서 다양한 산소농도에 대한 센싱특성을 검증하였다. 한편, 제작된 용존산소 센서는 전극제작에 사용된 나노 동공구조 백금 전극의 높은 촉매 특성에 기인하여 90% 전류응답시간이 7초 이내로 기발표된 다른 연구들에 비해 현저히 향상된 응답특성을 보였다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.8 no.2
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• pp.230-239
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• 1996

A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.