• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.14-20
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• 1998

This paper describes a computer-aided die design system of progressive die for making CPT grid. An approach to the development of the automatic design system is based on knowledge-based rules. The developed system is designed by considering several factors, such as grid geometry and punch profile. Grid, a key component of electronic gun, is formed through a sequence of many operations, among which the pilot piercing, beading, notching, bending, swaging and slotting etc. Using the developed system, design parameters are determined and output is generated in graphic forms. Therefore the developed system provides part drawing and the assembly drawing of die set.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.7
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• pp.573-577
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• 2002

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++on Windows NT with easily usable GUI. Using this system, we can automatically measure and inspect the quality of all feeders in production process by analyzing the measurement results statistically.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.11
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• pp.1885-1895
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• 1997

As track density needs to increase to the order of 10, 000 tpi, the suspension has become a critical component in hard disk drives. One of the main obstacles to attain high track density is the structural resonances of the suspension in lateral direction. We investigate the suspension dynamics through the experimental modal analysis and the finite element method. An LDV (Laser Doppler Vibrometer) is employed to measure the response of the suspension which is excited by a shaker and an inpulse hammer for the free condition and the loaded condition, respectively. After comparing the experimental and numerical results, we study how the initial geometry of the bend region affects the suspension dynamics. It is found that the natural frequency of the sway mode decreases as the bend ratio and the bend angle increase. The shape of torsional mode changes as the mass of a slider increases, resulting in a local decrease in the natural frequency.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.552-554
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• 1995

In long-haul high speed optical communications, the distance between a transmitter and a receiver depends on the amount of light coupled to a single mode optical fiber from the laser diode(LD) as well as the LD characteristic itself. And the transmitter module must have long lifetime. high reliability, and even simple structure. Such points have induced laser welding technique to be a first choice in opto-electronic module packaging because it can provide strong weld joint in a short time with very small coupling loss. In this paper, packaging considerations and characteristics for high speed LD modules are discussed. They include optical path design factors for larger aligning tolerance, and novel laser welding processes for component assembly. For low coupling loss after laser welding processes, the optical path for optimum coupling of a single mode optical fiber into the LD chip was designed with the GRIN lens system providing sufficiently large aligning tolerance both in the radial and axial directions. The measured sensitivity of the LD module was better than -33.7dBm(back to back) at a BER of $10^{-10}$ with a 2.5Gbps NRZ $2^{23}-1$ PRBS.

• Journal of the Korean Institute of Intelligent Systems
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• v.14 no.1
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• pp.20-27
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• 2004

We propose the character recognition system for Gerber files. The Gerber file is the vector-formatted drawing file for PCB manufacturing, which includes various symbols, figures and characters. Also, the characters are written in horizontal, vertical, and reverse-vortical directions. In this paper, we newly propose the Gerber-character recognition system to recognize all of component names located in PCB. To improve the performance, we develop the multiple recognizers by neural networks and the verifier considering the structural features. The developed system has been installed to the auto-programming software for PCB assembly and inspection machines.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.261-267
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• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.5
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• pp.87-92
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• 2019

This study is the analysis of causes of printed circuit board (PCB) in collective protection equipment failure and quality improvement. The equipment is a component of the weapon system currently in operation and serves to defend against enemy chemical and biological attack as well as heating and cooling functions. However, during operation in the military, fans of condensate assembly failed to operate. The cause of the failure is the burning of PCB. It was found that the parts were heated according to the continuous cooling operation under the high temperature environmental conditions. Accordingly, the electronic components exposed to high temperature were deteriorated and destroyed. To solve this problem, PCB apply to heatsink. The performance test of improved PCB has been completed. Futhermore system compatibility, positive pressure maintenance and noise test were performed. This improvement confirmed that no faults have occurred in PCB so far. Therefore, the quality of the equipment has improved.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.8
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• pp.759-769
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• 2013

Electronic equipment has been applied to virtually every area associated with commercial, industrial, and military applications. Specifically, electronics have been incorporated into avionics components installed in aircraft. This equipment is exposed to dynamic loads such as vibration, shock, and acceleration. Especially, avionics components installed in a helicopter are subjected to simultaneous sine and random base excitations. These are denoted as sine on random vibrations according to MIL-STD-810F, Method 514.5. In the past, isolators have been applied to avionics components to reduce vibration and shock. However, an isolator applied to an avionics component installed in a helicopter can amplify the vibration magnitude, and damage the chassis, circuit card assembly, and the isolator itself via resonance at low-frequency sinusoidal vibrations. The objective of this study is to investigate the dynamic characteristics of an avionics component installed in a helicopter and the structural dynamic modification of its tray plate without an isolator using both a finite element analysis and experiments. The structure is optimized by dynamic loads that are selected by comparing the vibration, shock, and acceleration loads using vibration and shock response spectra. A finite element model(FEM) was constructed using a simplified geometry and valid element types that reflect the dynamic characteristics. The FEM was verified by an experimental modal analysis. Design parameters were extracted and selected to modify the structural dynamics using topology optimization, and design of experiments(DOE). A prototype of a modified model was constructed and its feasibility was evaluated using an FEM and a performance test.

• Journal of Technology Innovation
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• v.26 no.3
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• pp.37-68
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• 2018

Since the 20th century, automobiles, which are the most common means of transportation, have been evolving as the use of electronic control devices and automotive semiconductors increases dramatically. Automotive semiconductors are a key component in automotive electronic control devices and are used to provide stability, efficiency of fuel use, and stability of operation to consumers. For example, automotive semiconductors include engines control, technologies for managing electric motors, transmission control units, hybrid vehicle control, start/stop systems, electronic motor control, automotive radar and LIDAR, smart head lamps, head-up displays, lane keeping systems. As such, semiconductors are being applied to almost all electronic control devices that make up an automobile, and they are creating more effects than simply combining mechanical devices. Since automotive semiconductors have a high data rate basically, a microprocessor unit is being used instead of a micro control unit. For example, semiconductors based on ARM processors are being used in telematics, audio/video multi-medias and navigation. Automotive semiconductors require characteristics such as high reliability, durability and long-term supply, considering the period of use of the automobile for more than 10 years. The reliability of automotive semiconductors is directly linked to the safety of automobiles. The semiconductor industry uses JEDEC and AEC standards to evaluate the reliability of automotive semiconductors. In addition, the life expectancy of the product is estimated at the early stage of development and at the early stage of mass production by using the reliability test method and results that are presented as standard in the automobile industry. However, there are limitations in predicting the failure rate caused by various parameters such as customer's various conditions of use and usage time. To overcome these limitations, much research has been done in academia and industry. Among them, researches using data mining techniques have been carried out in many semiconductor fields, but application and research on automotive semiconductors have not yet been studied. In this regard, this study investigates the relationship between data generated during semiconductor assembly and package test process by using data mining technique, and uses data mining technique suitable for predicting potential failure rate using customer bad data.