• 제목/요약/키워드: Electron beam lithography

검색결과 168건 처리시간 0.043초

Direct Synthesis of Width-tailored Graphene Nanoribbon on Insulating Substrate

  • 송우석;김수연;김유석;김성환;이수일;전철호;박종윤
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.564-564
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    • 2012
  • Graphene has been emerged as a fascinating material for future nanoelectronic applications due to its extraordinally electronic properties. However, their zero-bandgap semimetallic nature is a major problem for applications in high performance field-effect transistors (FETs). Graphene nanoribbons (GNRs) with narrow widths (${\geq}10nm$) exhibit semiconducting behavior, which can be used to overcome this problem. In previous reports, GNRs were produced by several approaches, such as electron beam lithography patterning, chemically derived GNRs, longitudinal unzipping of carbon nanotubes, and inorganic nanowire template. Using these methods, however, the width distribution of GNRs was a quiet broad and substantial defects were inevitably occurred. Here, we report a novel approach for fabricating width-tailored GNRs by focused ion beam-assisted chemical vapor deposition (FIB-CVD). Width-tailored phenanthrene ($C_{14}H_{10}$) templates for direct growth of GNRs were prepared on $SiO_2$/Si substrate by FIB-CVD. The GNRs on the templates were synthesized at $900-1,050^{\circ}C$ with introducing $CH_4$ $(20sccm)/H_2$ (10 sccm) mixture gas for 10-300 min. Structural characterizations of the GNRs were carried out using Raman spectroscopy, scanning electron microscopy, and atomic force microscopy.

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Influence of Ne-Xe Gas Mixture Ratio on the Extreme Ultraviolet (EUV) Emission Measurement from the Coaxially Focused Plasma

  • Lee, Sung-Hee;Hong, Young-June;Choi, Duk-In;Uhm, Han-Sup;Choi, Eun-Ha
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.220-220
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    • 2011
  • The Ne-Xe plasmas in dense plasma-focus device with coaxial electrodes were generated for extreme ultraviolet (EUV) lithography. The influence of gas mixture ratio, Ne-Xe (1, 10, 15, 20, 25, 30, 50%) mixture gas, on EUV emission measurement, EUV intensity and electron temperature in the coaxially focused plasma were investigated. An input voltage of 4.5 kV was applied to the capacitor bank of 1.53mF and the diode chamber was filled with Ne-Xe mixture gas at a prescribed pressure. The inner surface of the cylindrical cathode was lined by an acetal insulator. The anode was made of tin metal. The EUV emission signal of the wavelength in the range of 6~16 nm has been detected by a photo-detector (AXUV-100 Zr/C, IRD). The visible emission line was also detected by the composite-grating spectrometer of the working wavelength range of 200~1100 nm (HR 4000CG). The electron temperature is obtained by the optical emission spectroscopy (OES) and measured by the Boltzmann plot with the assumption of local thermodynamic equilibrium (LTE).

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Measurement of EUV Emission and its Plasma Parameters Generated from the Coaxial Plasma Focus of Mather and Hypocycloidal Pinched Electrodes

  • Lee, Sung-Hee;Lee, Kyung-Ae;Hong, Young-June;Uhm, Han-Sup;Choi, Eun-Ha
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.332-332
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    • 2011
  • The extreme ultraviolet (EUV) radiation, whose wavelength is from 120 nm down to 10 nm, and the energy from 10 eV up to 124 eV, is widely utilized such as in photoelectron spectroscopy, solar imaging, especially in lithography and soft x-ray microscopy. In this study, we have investigated the plasma diagnostics as well as the debris characteristics between the two types of dense plasma focusing devices with coaxial electrodes of Mather and hypocycloidal pinch (HCP), respectively. The EUV emission intensity, electron temperature and plasma density have been investigated in these cylindrical focused plasma along with the debris characteristics. An input voltage of 5 kV has been applied to the capacitor bank of 1.53 uF and the diode chamber has been filled with Ar gas at pressure ranged from 1 mTorr and 180 mTorr. The inner surface of the cathode was covered by polyacetal insulator. The central anode electrode has been made of tin. The wavelength of the EUV emission has been measured to be in the range of 6~16 nm by a photo-detector (AXUV-100 Zr/C, IRD). The visible emission has also been measured by the spectrometer with the wavelength range of 200~1,100 nm. The electron temperature and plasma density have been measured by the Boltzmann plot and Stark broadening methods, respectively, under the assumption of local thermodynamic equilibrium (LTE).

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이종 레지스트 패터닝을 이용한 테라헤르츠용 쇼트키 다이오드 개발 (Development of Schottky Diode for THz Applications using Heterogeneous Resist Patterning)

  • 한민;최석규;이상진;백태종;고동식;김정일;김근주;전석기;윤진섭;이진구
    • 대한전자공학회논문지SD
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    • 제49권8호
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    • pp.47-54
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    • 2012
  • 본 논문에서는 테라헤르츠 시스템에 적용 가능한 쇼트키 다이오드를 이종 레지스트 패터닝 기술을 이용하여 제작 하였다. 제작된 쇼트키 다이오드는 전자선묘화공정(electron beam lithography)과 포토리소그래피(photolithography)를 사용하여 양극 및 양극 패드의 연결을 동시에 패터닝 하여 공정을 단순화 시켰다. 측정결과 제작된 쇼트키 다이오드의 직렬 저항은 $11.2{\Omega}$, 접합용량은 25.96 fF, 이상 계수(ideality factor)는 1.25를 얻었으며, 차단 주파수는 547.6 GHz를 얻었다.

Fabrication and Electrochemical Analysis of Back-gate FET Based on Graphene for O2 Gas Sensor

  • 김진환;최현광;김종열;임기홍;전민현
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.271-271
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    • 2014
  • 본 연구에서는 최근 다양한 전자 소자로써의 연구가 진행되고 있는 그라핀을 SiO2/Si 기판 위에 전자빔 식각(Electron-Beam Lithography)을 이용하여 후면 게이트 전극 구조의 그라핀 채널을 갖는 삼단자 소자를 형성하고 가스 유입이 가능한 진공 Probe Measurement System을 이용하여 금속 전극과 그라핀 간의 접촉저항 (Rc) 및 길이가 다른 채널저항(Rch)를 구하고, 채널 길이, 가스 유량, 온도, 게이트 전압에 따른 I-V 변화를 측정함으로써, 후면 게이트 전극 구조의 그라핀 채널을 갖는 삼단자 소자의 가스 센서로서의 가능성을 연구하였다. 후면 게이트 전극 구조의 그라핀 채널을 갖는 삼단자 소자는 전자빔 식각(Electron-Beam Lithography)에 의해 패턴을 제작하고 Evaporator를 이용하여 전극을 증착 하였다. 소자의 소스 (Source)와 드레인 (Drain)은 TLM (Transfer Length Method)패턴을 이용하여 인접한 두 개의 전극간 범위를 변화시키는 형태로 제작함으로써 소스-드레인간 채널 길이가 다르게 하였다. 이 때 전극의 크기는 가로, 세로 각각 $20{\mu}m$, $40{\mu}m$이며 전극간 간격은 $20/30/40/50/60{\mu}m$로 서로 다르게 배열 하였다. 제작된 그라핀 소자는 진공 Probe Measurement System 내에서 게이트 전압(VG)를 변화시킴으로써 VG 변화에 따른 소자의 특성을 평가하였는데, mTorr 상태의 챔버 내로 O2 가스를 주입하여 그라핀의 Dangling bond 및 Defect site에 결합 된 가스로 인한 전기적 특성의 변화를 측정하고, 이 때 가스의 유량을 50 sccm에서 500 sccm 까지 변화시킴으로써 전기적 특성 변화를 측정하여 센서 소자의 민감도를 평가하였다. 또한, 서로 다르게 배열한 소스-드레인 간의 채널 길이로 인하여 채널과의 접촉 면적에 따른 센서 소자의 민감도 또한 평가할 수 있었다. 그리고 챔버 내 온도를 77 K에서 400 K까지 변화시킴으로써 온도에 따른 소자의 작동 범위를 확인하고 소자의 온도의존성을 평가하였다.

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Poly Vinyl Alcohol 몰드를 이용한 Nano Transfer Printing 기술 및 이를 이용한 Mo 나노 패턴 제작 기술 (Fabrication of Mo Nano Patterns Using Nano Transfer Printing with Poly Vinyl Alcohol Mold)

  • 양기연;윤경민;한강수;변경재;이헌
    • 한국재료학회지
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    • 제19권4호
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    • pp.224-227
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    • 2009
  • Nanofabrication is an essential process throughout industry. Technologies that produce general nanofabrication, such as e-beam lithography, dip-pen lithography, DUV lithography, immersion lithography, and laser interference lithography, have drawbacks including complicated processes, low throughput, and high costs, whereas nano-transfer printing (nTP) is inexpensive, simple, and can produce patterns on non-plane substrates and multilayer structures. In general nTP, the coherency of gold-deposited stamps is strengthened by using SAM treatment on substrates, so the gold patterns are transferred from stamps to substrates. However, it is hard to apply to transfer other metallic materials, and the existing nTP process requires a complicated surface treatment. Therefore, it is necessary to simplify the nTP technology to obtain an easy and simple method for fabricating metal patterns. In this paper, asnTP process with poly vinyl alcohol (PVA) mold was proposed without any chemical treatment. At first, a PVA mold was duplicated from the master mold. Then, a Mo layer, with a thickness of 20 nm, was deposited on the PVA mold. The Mo deposited PVA mold was put on the Si wafer substrate, and nTP process progressed. After the nTP process, the PVA mold was removed using DI water, and transferred Mo nano patterns were characterized by a Scanning electron micrograph (SEM) and Energy Dispersive spectroscopy (EDS).

광학 그레이팅의 사출성형제작을 위한 전자빔과 무반사 코팅층이 없는 크롬/퀄츠 마스크를 이용한 고종횡비 100nm 급 니켈 스탬퍼의 제작 (Fabrication of High Aspect Ratio 100nm-Scale Nickel Stamper Using E-Beam Writing based on Chrome/Quartz Mask Without Anti-Reflection Layer for Injection Molding of Optical Grating Patterns)

  • 서영호;최두선;이준형;제태진;황경현
    • 대한기계학회논문집A
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    • 제28권11호
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    • pp.1794-1798
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    • 2004
  • We present a fabrication method of high aspect ratio 100nm-scale nickel stamper using e-beam writing for the injection molding of optical grating patterns. Conventional nickel stamper is fabricated by nickel electroplating process which is followed by seed layer deposition. In this paper, we have used chrome coated blank mask without anti-reflection layer of CrON in order to simplified electroplating process. In experimental study, we have optimized electron-beam dosage for 100nm-scale optical grating patterns with 2.5-aspect ratio, and fabricated nickel stamper using above grating patterns as PR mold. Fabricated nickel stamper have showed height of 240$\pm$20nm and width of 116$\pm$6nm.

Thermal embossing 공정을 이용한 PDMS mold 제작에 관한 연구 (A study on PDMS mold fabrication using thermal embossing method)

  • 김동학;유홍진;김창교;장석원;김태완
    • 한국산학기술학회논문지
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    • 제5권3호
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    • pp.223-226
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    • 2004
  • 나노 패턴을 갖는 미세 구조물을 낮은 비용으로 생산하기 위해서는 플라스틱 재료를 이용하는 것이 필수적이고, 대량생산이 가능한 가공방법으로 사출성형 공정기술이 유망하다. 본 연구에서는 e-beam 리소그라피로 제작된 석영원판 내의 100-500nm크기의 선과 점 형상을 간단한 thermal embossing 공정을 이용하여 액상 PDMS를 고형화 시킨 후에 원판과 분리시켜 PDMS 몰드를 제작하였다. 실험결과, 원판에 있는 나노 크기의 다양한 패턴들은 PDMS 몰드에 균일하게 전사되었고, 이 몰드는 사출성형용 스탬퍼 제작에 유용하게 이용될 수 있을 것으로 사료된다.

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Optical Properties of Long Wave Infrared Spoof Plasmon using Hexagonal Periodic Silver Hole Arrays

  • Lee, Byungwoo;Kwak, Hoe Min;Kim, Ha Sul
    • Applied Science and Convergence Technology
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    • 제25권2호
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    • pp.42-45
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    • 2016
  • A two-dimensional metal hole array (2DMHA) structure is fabricated by conventional photo-lithography and electron beam evaporation. The transmittance of the 2DMHA is measured at long wave infrared (LWIR) wavelengths (${\lambda}{\sim}10$ to $24{\mu}m$). The 2DMHA sample shows transmittance of 70 and 67% at $15.4{\mu}m$ due to plasmonic resonance with perforated silver and gold thin films, respectively, under surface normal illumination at LWIR wavelengths. The measured infrared spectrum is separated into two peaks when the size of the hole becomes larger than a half-pitch of the hole array. Six degenerated plasmon modes (1,0) at the metal/Si surface split to three modes at an incident beam angle of $45^{\circ}$ with respect to the surface normal direction, and wavelength shifts of the transmitted spectrum are observed in a red shift and blue shift at the same time.

플라즈마 공정을 이용한 전자빔 리소그래피 (E-beam Lithography using Plasma Processes)

  • 김성오;이진;이경섭;이덕출
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.575-577
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    • 1999
  • In this study, the PPPI(Plasma Polymerized Phenyl Isothiocyanate) resist thin film was manufactured in accordance with the plasma polymerization method and after exposing it to an electron beam, a pattern was formed by plasma etching. With the FT-IR(Fourier transform-infrared spectrometry) analysis, it was confirmed that the PI(Phenl Isothiocyanate) monomer was successsfully produced into a thin film by the plasma. The polymerization rate of the thin film was 450~ 1012($\AA$/min) to 100-200(W) discharge power and 120-12($\AA$/min) to 0.1 ~0.4[torr] system pressure.

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