• Proceedings of the Korea Air Pollution Research Association Conference
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• 2000.11a
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• pp.87-90
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• 2000

대기 중에 존재하는 화합물의 반응을 연구하는 것은 대기 오염 화합물의 이동이나 소멸, 환경에의 영향을 파악하기 위하여 긴요하다. 특히 입자상 물질과 기체상 화합물과의 반응을 명확히 이해하는 것은 대기 오염물질의 거동을 파악하는데 매우 중요하다. 입자상 물질을 분석하는 방법 중에 EPMA(Electron Probe X-ray Microanalysis)를 이용한 단일 입자 분석법(Single Particle Analysis)은 개개 입자의 형상과 크기 그리고 화학 조성에 대한 정보를 동시에 제공하기 때문에 개개 입자의 생성, 이동, 반응성, 소멸 그리고 환경에의 영향에 대한 자세한 정보를 얻을 수 있다. (중략)

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2003.11a
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• pp.392-393
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• 2003

우리나라의 폐기물 발생총량은 꾸준히 증가추세를 보이는 가운데, 최근 생활폐기물의 처리현황을 보면 재활용이나 소각이 매년 증가하고 있다. 쓰레기 소각율이 높아지고 대형 소각시설이 증가하면서부터 소각 후에 발생하는 도시 소각재의 처리 및 재활용의 문제가 중요한 관심사가 되고 있다. 소각재의 효과적이고 안전한 취급을 위해서는 그것의 화학적 성질에 관한 지식이 중요하다. Kirby and Rimstldt$^{[1]}$ 는 Charlotte (USA)에 소재하는 두 곳의 소각로에서 나온 Municipal Solid Waste (MSW) ash를_체계적으로 분석하여 화학적 조성에 대한 연구를 행한 바 있다. (중략)

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.173.2-173.2
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• 2014

Thin nitride thin films were synthesized by reactive radio-frequency magnetron sputtering in the ultra high vacuum (UHV) chamber. To control the characteristics of thin films, tin nitride thin films were obtained various argon and nitrogen gas mixtures, especially low nitrogen gas ratios. Tin nitride thin films were analyzed with alpha step, scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and 4 point probe measurement. The result of alpha step and SEM showed that the thickness of thin nitride thin films were decreased with increasing nitrogen gas ratios. The metallic tin structure was decreased and the amorphous tin nitride structure were observed by XRD with higher nitrogen gas ratios. The oxidation state of tin and nitride were studied with high resolution Sn 3d and N 1s XP spectra.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.48.1-48.1
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• 2010

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. In this study, we investigated the characteristics of electroplated Cu films according to the variation of concentration of organic additives. The plating electrolyte composed of $CuSO_4{\cdot}5H_2O$, $H_2SO_4$ and HCl, was fixed. The sheet resistance was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the organic additives play an important role in formation of Cu film with lower resistivity by EPD.

• Journal of Surface Science and Engineering
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• v.35 no.6
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• pp.377-382
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• 2002

We investigated the appropriate wet cleaning process for Co-Ti-Si compounds formed on top of cobalt disilicide made from Co/Ti deposition and two rapid thermal annealing (RTA). We employed three wet cleaning processes, WP1 ($H_2$SO$_4$ etchant), WP2 ($NH_4$OH etchant), and WP3 which execute sequentially WP1 and WP2 after the first RTA. All samples were cleaned with BOE etchant after the second RTA. We characterized the sheet resistance with process steps by a four-point probe, the microstructure evolution by a cross detail sectional transmission electron microscope, a Auger depth profiler, and a X-ray diffractometer (XRD). We confirmed WP3 wet cleaning process were the most suitable to remove CoTiSi layer selectively.

• Journal of Surface Science and Engineering
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• v.27 no.6
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• pp.327-334
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• 1994

This work concerns a research for helicon wave plasma generators with applications to materials pro-cessing. For this end, helicon wave plasma source has been designed, constructed and tested. High density plasma was successfully produced and diagnosed with Langmuir probe. The measured maximum plasma de-nsity in this work was $10^{11}cm{-3}$ with 295 gauss of magnetic field and electron temperature was about 3.5eV. The uniformity of plasma densities in the radial direction was excellent with 160 gauss of magnetic field on the cross section which is 10cm apart from the edge of the exciting coil.

• Journal of Photoscience
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• v.4 no.1
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• pp.11-16
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• 1997

We measured, using femtosecond pump-probe experiment, the time evolution of transient absorption in aqueous CdS colloids. The signal rises within the time resolution (= 0.5 ps) of the experiment and decays with two exponential time constants, 4.8 ps and 132 ps. The ultrafast rise of the transient absorption is considered to be for shallowly trapped conduction band electrons after photoexcitation. The amplitude ratio of the two decaying components varies with the pump intensity and the decay times increase in the presence of hole scavengers. Even though a biexponential function fits the decay well, we object hat two independent first order processes (geminate and nongeminate recombinations) are responsible for the decay. A function with an integrated rate equation for second order nongeminate recombination plus a long background fits the decay well. The long background is considered to be for deeply trapped charges at the CdS particle.

• Korean Journal Plant Pathology
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• v.10 no.2
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• pp.136-139
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• 1994

Turnip mosaic virus (TuMV) was isolated from Rorippa islandica showing mild mosaic symptom in growing field of Chinese cabbage and radish. Identification of the virus was based on host range, transmission by aphids, electron micrograph, serological reaction and hybridization detection. The virus systemically infected on Chenopodium quinoa, Nicotiana clevelandii, N. glutinosa, Brassica rapa, B. campestris subsp. pekinensis and Raphanus sativus, whereas showed local infection on C. amaranticolor, Gomphrena globosa and Tetragonia tetragonoides. The virus was transmitted by aphid (Myzus persicae). The virus particle was filamentous with 720$\times$12 nm in length, and reacted positively with an antiserum of TuMV in agar gel double duffusion test. In slot-blot hybridization using the digoxigenin(DIG)-labeled RNA probe, TuMV-RNA could be detected in sap of R. islandica infected with the virus. This is the first report of a natural infection of that virus on R. islandica.

• Transactions of Materials Processing
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• v.8 no.3
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• pp.289-289
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• 1999

This paper describes the investment casting of TiAl alloys. The effects of mold material and mold preheating temperature for the investment casting of TiAl on metal-mold interfacial reaction were investigated by means of optical micrography, hardness profiles and an electron probe microanalyzer. The mold materials examined were colloidal silica bonded ZrO₂, ZrSiO₄, A1₂O₃and CaO stabilized ZrO₂. When compared with conventional titanium a1loy, the high aluminum concentration of TiAl alloys helps to lower their reactivity in the molten state. The A1₂O₃mold is a promising mold material for the investment casting of TiAl in terms of the thermal stability, formability and cost. Special attention need to be paid to thermal stability and mold preheating when developing the investment calling of TiAl alloys.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.322-324
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• 2007

Nd:YAG laser welding of AZ31B-H24 magnesium alloy was carried out using AZ61 filler wire(Mg-6wt%Al-1wt%Zn). Microstructure and mechanical properties of welded joint were examined by optical microscopy, scanning electronic microscopy(SEM), energy dispersive spectroscopy(EDS), electron probe micro analyzer(EPMA) and victors hardness, tensile test at the room and elevated temperature. Test results indicate that the specimens welded with AZ61 filler wire have better tensile strength, elongation and victors hardness at room temperature than those of welded without filler wire. However tensile strength are similar but elongation are quite different at elevated temperature.