• 제목/요약/키워드: Electromagnetic-Thermal Co-Simulation

검색결과 8건 처리시간 0.017초

Evaluation of Co-Frequency Interference with IMT System Caused by Mobile-Satellite Service System

  • Park, Jong-Min;Park, Dong-Chul
    • Journal of electromagnetic engineering and science
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    • 제9권3호
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    • pp.141-145
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    • 2009
  • Interference scenarios involving and a methodology for a terrestrial international mobile telecommunication(IMT) system and mobile-satellite service(MSS) system in a co-channel environment are established. Taking into account a practical deployment situation for both systems, a computational simulation of interference in terms of the ratio of interference power to thermal noise(I/N) is performed in order to evaluate the co-frequency interference with the IMT system caused by the MSS system. The methodology and results could be used for planning an IMT deployment without an unacceptable interference impact caused by the MSS system.

A 3-D Steady-State Analysis of Thermal Behavior in EHV GIS Busbar

  • Lei, Jin;Zhong, Jian-ying;Wu, Shi-jin;Wang, Zhen;Guo, Yu-jing;Qin, Xin-yan
    • Journal of Electrical Engineering and Technology
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    • 제11권3호
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    • pp.781-789
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    • 2016
  • Busbar has been used as electric conductor within extra high voltage (EHV) gas insulated switchgear (GIS), which makes EHV GIS higher security, smaller size and lower cost. However, the main fault of GIS is overheating of busbar connection parts, circuit breaker and isolating switch contact parts, which has been already restricting development of GIS to a large extent. In this study, a coupled magneto-flow-thermal analysis is used to investigate the thermal properties of GIS busbar in steady-state. A three-dimensional (3-D) finite element model (FEM) is built to calculate multiphysics fields including electromagnetic field, flow field and thermal field in steady-state. The influences of current on the magnetic flux density, flow velocity and heat distribution has been investigated. Temperature differences of inner wall and outer wall are investigated for busbar tank and conducting rod. Considering the end effect in the busbar, temperature rise difference is compared between end sections and the middle section. In order to obtain better heat dissipation effect, diameters of conductor and tank are optimized based on temperature rise simulation results. Temperature rise tests have been done to validate the 3-D simulation model, which is observed a good correlation with the simulation results. This study provides technical support for optimized structure of the EHV GIS busbar.

유한요소해석 및 실험에 의한 S45C 시편의 고주파 유도경화에 관한 연구 (A Study on High Frequency Induction Hardening of S45C Specimen by FEA and Experiment)

  • 박관석;최진규;이석순
    • 항공우주시스템공학회지
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    • 제12권5호
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    • pp.1-7
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    • 2018
  • 본 연구에서는 전자기-열 연동 모사를 기반으로 한 고주파 유도경화 해석방법을 제안하였다. 고주파 유도가열 해석 시 온도에 따른 재료의 물성치 변화 및 냉각 요소를 고려한 유한요소해석 및 이를 S45C 시편을 이용한 고주파 유도경화 실험결과와 비교하였다. S45C 시편을 마이크로 비커스를 사용하여 경도를 측정하여 경화깊이를 확인하였고 이를 유한요소해석 결과와 비교하였다. 고주파 유도가열 해석결과 온도는 S45C의 A2변태점인 $750^{\circ}C$도 이상 가열되었으며, 급랭 시 $200^{\circ}C$이하였다. 유한요소해석결과와 실험에 의한 경화깊이 차이는 0.2mm 수준인 것을 확인할 수 있었다.

전자기 유한요소법 전자빔 시뮬레이션을 이용한 정전기장 제거용 연한 X-선관 설계 특성 연구 (Design of Soft X-ray Tube and Simulation of Electron Beam by Using an Electromagnetic Finite Element Method for Elimination of Static Electric Field)

  • 박태영;이상석;박래준
    • 한국자기학회지
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    • 제24권2호
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    • pp.66-69
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    • 2014
  • 유한요소법으로 분할 표시한 연한 X-선 퍼짐관을 설계하였다. 연한 X-선관의 모양설계 및 구체적인 좌표를 설정하고 전자빔 궤적을 OPERA-3D SW 프로그램을 이용하여 시뮬레이션하였다. 음극과 양극인 텅스텐 필라멘트와 타겟에 인가한 전압, 온도, 열전자 일함수 등을 고정하였다. 필라멘트 십자형 모양을 구비한 퍼짐관의 구조에 따른 전자빔의 분포와 초점변화를 분석하여 반도체 공정상의 정전기장 제거용 연한 X-선 퍼짐관 설계를 최적화하였다.

파워테일게이트의 DC모터구동회로에 적용된 EMI 저감기법에 대한 연구 (Study of EMI Suppression Method Applied on DC Motor Driver of Power Tail Gate)

  • 김영식;윤용수;정훈;공준호;이상호
    • 한국자동차공학회논문집
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    • 제16권1호
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    • pp.1-7
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    • 2008
  • This paper presents electromagnetic interference(EMI) suppression method applied on the direct current(DC) motor driver for power tail gate control. EMI noise is generated by the fast switching of power devices connected to electric loads. It has become a matter of concern because of the vast increase in the number and sophistication of electronic system in automotive environment. The proposed EMI reduction method is based on the principle of reducing the transient speed of power devices by changing the parameters of the driver circuit related to the power MOSFET. In this paper, power losses were calculated by loss equations and thermal simulation was used to evaluate the effect on printed circuit board. Based on these results, the DC motor driver was fabricated and tested. The proposed method can help to design a DC motor driver which allows it to obtain an acceptable compromise between power losses and EMI.

Design of a generator control system for small nuclear distributed generation

  • Yoon, Dong-Hee;Jang, Gil-Soo
    • Journal of Electrical Engineering and Technology
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    • 제6권3호
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    • pp.311-318
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    • 2011
  • Small-scale reactors have recently attracted attention as a potential power generation source for the future. The Regional Energy Research Institute for Next Generation is currently developing a small-scale reactor called Regional Energy rX 10 MVA (REX-10). The current paper deals with a power system to be used with small-scale reactors for multi-purpose regional energy systems. This small nuclear system can supply electric and thermal energy like a co-generation system. The electrical model of the REX-10 has been developed as a part of the SCADA system. REX-10's dynamic and electromagnetic performance on the power system is analyzed. Simulations are carried out on a test system based on Ulleung Island's power system to validate REX-10 availability on a power system. RSCAD/RTDS and PSS/E software tools are used for the simulation.

Power Loss Modeling of Individual IGBT and Advanced Voltage Balancing Scheme for MMC in VSC-HVDC System

  • Son, Gum Tae;Lee, Soo Hyoung;Park, Jung-Wook
    • Journal of Electrical Engineering and Technology
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    • 제9권5호
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    • pp.1471-1481
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    • 2014
  • This paper presents the new power dissipation model of individual switching device in a high-level modular multilevel converter (MMC), which can be mostly used in voltage sourced converter (VSC) based high-voltage direct current (HVDC) system and flexible AC transmission system (FACTS). Also, the voltage balancing method based on sorting algorithm is newly proposed to advance the MMC functionalities by effectively adjusting switching variations of the sub-module (SM). The proposed power dissipation model does not fully calculate the average power dissipation for numerous switching devices in an arm module. Instead, it estimates the power dissipation of every switching element based on the inherent operational principle of SM in MMC. In other words, the power dissipation is computed in every single switching event by using the polynomial curve fitting model with minimum computational efforts and high accuracy, which are required to manage the large number of SMs. After estimating the value of power dissipation, the thermal condition of every switching element is considered in the case of external disturbance. Then, the arm modeling for high-level MMC and its control scheme is implemented with the electromagnetic transient simulation program. Finally, the case study for applying to the MMC based HVDC system is carried out to select the appropriate insulated-gate bipolar transistor (IGBT) module in a steady-state, as well as to estimate the proper thermal condition of every switching element in a transient state.

연동해석을 통한 SCM440 환봉의 고주파 유도가열 해석 및 실험 비교분석에 관한 연구 (Comparative Study on Numerical Analysis using Co-simulation and Experimental Results for High Frequency Induction Heating on SCM440 Round Bar)

  • 이인영;탁승민;백인석;이석순
    • 항공우주시스템공학회지
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    • 제11권3호
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    • pp.1-7
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    • 2017
  • 고주파 유도가열은 최근 활발히 연구되고 다양한 산업분야에서 적용 되고있다 본 논문에서는 산업체에서 많이 사용되고 있는 SCM440 시편을 대상으로 유도 가열한다. 시편은 지름 20mm, 길이 160 mm의 환봉으로 제작하였다 유도 가열 전원 공급 장치 모듈을 이용하여 약 85 kHz의 고주파로 환봉을 50초 동안 유도가열 하여 5초 단위로 바닥면에서 150 mm지점의 온도를 얻는다. 이 실험을 총 10회 반복하여 측정한 실험의 중앙값과 전자기-열 연동해석을 통해 환봉의 저항열과 온도에 대한 해석 결과값을 서로비교 분석하였다. 환봉의 해석모델은 표피효과를 고려하여 모델링을 하였고, 50초동안 유도가열을 했을 때의 실험의 중앙값은 $57.65^{\circ}C$ 해석값은 $57.27^{\circ}C$이다. 이 결과로 해석결과는 실험결과와 잘 일치함을 보이고, 본 해석방법으로 유도가열 현상을 수치적으로 예측할 수 있음을 보였다.