• 마이크로전자및패키징학회지
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• 제18권4호
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• pp.43-48
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• 2011

탄소 기지상에 니켈도금을 하여 다공성 MCFC의 전극으로 사용하기 위하여 탄소 기지위에 산성용액과 염기성용액을 이용하여 무전해 니켈도금을 하였다. 알칼리 용액에서의 도금속도가 산성용액에서의 도금속도보다 빨랐으며 두가지 용액에서 pH가 증가함에 따라 도금속도가 증가하였다. 산성용액에서의 잔류응력은 압축응력을 보였으며 알칼리용액에서는 높은 인장응력을 보였으며 높은 잔류응력으로 인하여 pH 11 이상에서는 표면균열이 발생하였다. Thiourea를 첨가하였을 경우 0.5 ppm까지의 저농도에서 도금속도가 증가하다가 이후 감소하였으며 1.5 ppm 이상에서 두가지 용액에서 모두 도금이 더 이상 진행되지 않았다. Succine 산을 첨가한 경우 5 g/L까지 속도가 증가하다가 감소하여 일정한 값을 유지하였다.

• 공업화학
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• 제25권3호
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• pp.268-273
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• 2014

본 연구에서는 탄소나노튜브의 전자파 차폐 성능을 향상시키고자 무전해 도금법을 이용하여 다중벽 탄소나노튜브에 니켈을 도입하였다. 니켈 도금된 다중벽 탄소나노튜브의 물리적 특성은 고분해능주사전자현미경, 열중량분석기, 표면저항측정기, 전자파 차폐능 분석기를 이용하여 분석하였다. 니켈 도금된 다중벽 탄소나노튜브의 전자파 차폐 효율은 800 MHz 영역에서 16 dB로 측정되었으며 활성화 처리된 다중벽 탄소나노튜브에 비하여 최대 1.6배 증가하였다. 또한, 평균 표면 저항 역시 $70{\Omega}/sq$로 활성화 처리된 다중벽 탄소나노튜브에 비하여 최대 56% 감소한 수치를 나타내었다. 이러한 결과는 니켈 도금 함량에 비하여 표면의 도금 형태가 전자파 차폐 효율에 더 많은 영향을 끼치기 때문인 것으로 판단된다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 추계학술대회 논문집
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• pp.304-304
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• 2009

In this study, the adsorption behaviors of mercury ions on the electroless Cu-plated activated carbons have been investigated. The amount of copper on activated carbons have been confirmed by atomic absorption spectrophotometer (AAS). The surface properties of the ACs studied have been characterized by using Boehm's titration method and scanning electron microscopy (SEM).Experimental results showed the adsorption capacity of mercury ions was increased as the electroless Cu plating. This was probably due to the introduction of copper on ACs leaded to an increase in the surface basicity.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.29-34
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• 2020

본 연구에서는 무전해 니켈 도금액 pH 변화에 따른 electroless nickel immersion gold (ENIG)/Sn-3.0wt.%Ag-0.5wt.%Cu(SAC305) 솔더 접합부 취성 파괴 거동에 대하여 평가하였다. ENIG 표면처리를 위한 무전해 니켈 도금액의 pH는 4.0에서 5.5로 변화 시켰다. 무전해 니켈 도금 후 Ni-P 표면 관찰 결과, 도금액의 pH가 낮아질수록 Ni-P 층 nodule 표면에 핀홀이 증가하였다. 솔더링 후 접합부 계면에서는 (Cu,Ni)6Sn5 금속간화합물이 형성되었으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 계면 금속간화합물의 두께는 증가하였다. 고속전단 시험을 통하여 ENIG/SAC305 솔더 접합부의 취성파괴 거동을 확인하였으며, 무전해 니켈 도금액의 pH가 증가할수록 솔더접합부의 전단강도는 감소하는 경향을 보였다. 또한, 솔더 접합부의 취성 파괴율은 pH가 5일 때 가장 높은 값을 보였다.

• Corrosion Science and Technology
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• 제3권1호
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• pp.26-29
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• 2004

Metal plated plastics are becoming more prevalent in materials of communication parts. A new technique MmSH is a process of injecting plastics to produce innovated physical properties compared to the conventional injection process. This study involves two ways of coating plastics Ni by electroless plating and varying bath and plasma treatment for improved adhesion strength between plating layer and surface. MmSH injection processed ASS with plasma treated after neutralization showed a superior adhesion force and a gloss and rate of deposition when it was in pH 7.5. On the other hand, conventional injection processed ASS was in pH 6.5.

• Carbon letters
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• 제14권4호
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• pp.243-246
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• 2013

In this work, electroless Ni-plating on polyethylene terephthalate (PET) ultra-fine fibers surfaces was carried out to improve the electric conductivity of the fiber. The surface properties of PET ultra-fine fibers were characterized using scanning electron microscopy, X-ray diffraction, and contact angle analyses. The electric conductivity of the fibers was measured using a 4-point testing method. The experimental results revealed the presence of island-like nickel clusters on the PET ultra-fine fibers surfaces in the initial plating state, and the electric conductivity of the Ni-plated fibers was enhanced with increasing plating time and thickness of the Ni-layers on the PET ultra-fine fibers.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.621-624
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed boards(PCR) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor meta1s, such as Al and Cu and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure. wear resistance, corrosion protection and thermal stability In this study fundamental aspects of electroless nickel deposition were studied with effort of complexeing agents of different kinds. Then the property of electroless deposit are controlled by the composition of the deposition solution the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• 한국표면공학회지
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• 제26권4호
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• pp.175-182
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• 1993

Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.

• 폴리머
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• 제31권3호
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• pp.184-188
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• 2007

산성 도금조에서 차인산나트륨을 환원제로 하는 무전해 도금법을 사용하여 직경 $4{\mu}m$의 PMMA(poly-methylmethacrylate)/HDDA(1,6-hexanedioldiacrylate) 단분산 가교 고분자 미립자에 니켈층을 코팅할 시 1) 전처리 조건변화, 2) 도금조 온도변화, 3) 도금조 pH 변화, 및 4) 초기 도금조 pH 조절 등에 따라서 도금속도, 도금면의 상태 및 도금 재현성을 관찰하였다. 무전해 도금에서의 전처리 과정은 모든 단계가 중요하였으나 특히 conditioning 및 acceleration 과정이 균일한 도금층을 형성하는데 중요하였고, 도금조 온도 및 pH의 상승에 따라서 도금속도가 증가하였으며, 특히 초기 도금조의 pH의 조절이 도금 재현성을 확보하는데 매우 중요하였다.