• Journal of the Korean institute of surface engineering
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• v.26 no.5
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• pp.263-270
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• 1993

The effects of surfactants on electorless copper plating bath for PCB was studied. Basic bath composition was cuplic sulfate 10g/l, EDTA.2Na 40 g/l, formalin$ 3m\ell$/l and sodium hydroxide solution for pH adjust. After addition of accelerators, stabilizers and surfactants, the polarization curves in plating bath were carried out for presumption of the plating rate. From the plating rate in bath with the various concentration of additives, the optimum condition for manufacturing the electroless copper plating bath was confirmed. It was found that the addition of $\alpha$.$\alpha$'-dipyridyl, pyridine and polyxyethylene octylphenylether was good as stabilizer, accelerator and surfactants, respectively. With this additives, the maximum plating rate of $12\mu\textrm{m}$/h at $65^{\circ}C$ and $2\mu\textrm{m}$/h at $25^{\circ}C$ was obtained.

• Journal of the Korean Ceramic Society
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• v.52 no.4
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• pp.264-268
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• 2015

Cu films were plated in an eco-friendly electroless bath (No-Formaldehyde) on Ni/screen printed Ag pattern/PET substrate. For electroless Cu plating, we used sodium-phosphinate ($NaH_2PO_2{\cdot}H_2O$) as reducing agent instead of Formaldehyde. All processes were carried out in electroless solution of pH 7 to minimize damage to the PET substrate. According to the increase of sodium-phosphinate, the deposition rate, the granule size, and rms roughness of the electroless Cu film increased and the Ni content also increased. The electroless Cu films plated using 0.280 M and 0.575 M solutions of sodium-phosphinate were made with Cu of 94 at.% and 82 at.%, respectively, with Ni and a small amount P. All electroless Cu plated films had typical FCC crystal structures, although the amount of co-deposited Ni changed according to the variation of the sodium-phosphinate contents. From these results, we concluded that a formation of higher purity Cu film without surface damage to the PET is possible by use of sodium-phosphinate at pH 7.

• Journal of the Korean institute of surface engineering
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• v.28 no.1
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• pp.3-13
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• 1995

Electroless Ni and Cu platings were conducted on $B_4C$ and SiC. In the electroless Ni plating, the deposition rate on $B_4C$ was higher than on SiC. However, the electroless Cu deposition occured with high deposition rate regardless of the carbide substrates used in this study. Uniformity of the deposits was better in the electroless Cu deposition than in the electroless Ni deposition. In the topographies of the electroless depositions, Ni deposits have grown as colony, whereas Cu deposits have grown as fine individual grains.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.686-686
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• 2013

Crystalline silicon solar cell is a semiconductor device that converts light into electrical energy. Screen printing is commonly used to form the front/back electrodes in silicon solar cell. Screen printing method is convenient but usually shows high resistance and low aspect ratio, which cause the efficiency decrease in crystalline silicon solar cell. Recently the plating method is applied in c-Si solar cell to reduce the resistance and improve the aspect ratio. In this paper, we investigated the effect of additional electroless Ag plating into screen-printed c-Si solar cell and compared their electrical properties. All wafers used in this experiment were textured, doped, and anti-reflection coated. The electrode formation was performed with screen-printing, followed by the firing step. Aften then we carried out electroless Ag plating by changing the plating time in the range of 20 sec~5 min and light intensity. The light I-V curve and optical microscope were measured with the completed solar cell. As a result, the conversion efficiency of solar cells was increased mainly due to the decreased series resistance.

• Korean Journal of Materials Research
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• v.25 no.11
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• pp.622-629
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• 2015

Cu circuits were successfully fabricated on flexible PET(polyethylene terephthalate) substrates using wettability difference and electroless plating without an etching process. The wettability of Cu plating solution on PET was controlled by oxygen plasma treatment and $SiO_x$-DLC(silicon oxide containing diamond like carbon) coating by HMDSO(hexamethyldisiloxane) plasma. With an increase of the height of the nanostructures on the PET surface with the oxygen plasma treatment time, the wettability difference between the hydrophilicity and hydrophobicity increased, which allowed the etchless formation of a Cu pattern with high peel strength by selective Cu plating. When the height of the nanostructure was more than 1400 nm (60 min oxygen plasma treatment), the reduction of the critical impalement pressure with the decreasing density of the nanostructure caused the precipitation of copper in the hydrophobic region.

• Journal of the Korean Society of Clothing and Textiles
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• v.32 no.2
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• pp.319-327
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• 2008

The purpose of this study is to propose the development of high quality electromagnetic wave shielding fabrics. Silver nitrate is used for polyester fabric as an electromagnetic wave shielding material. The effects of activators and electroless silver plating condition on the evenness and adhesion of silver to fabrics, are observed through the SEM micrographs. Surface morphology and wash-ability are measured using SEM. The results are as follows: The optimum weight loss by alkaline hydrolysis of polyester fabrics is about 20%. The optimum concentration of $SnCl_2$ and $PdCl_2$in catalyst reaction using $PdCl_2$ as an activator is 2.5g/L and 0.5g/L, respectively. The optimum concentration of dextrose to improve adhesion between the silver plating and fabrics is 45g/L. The optimum concentration of silver nitrate in the catalyst reaction, using $PdCl_2$ as an activator is 56g/L, respectively. The optimum plating temperature and time are $15^{\circ}C$ and 30minutes, respectively.

• Journal of the Korean institute of surface engineering
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• v.40 no.2
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• pp.70-76
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• 2007

Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at $300^{\circ}C$ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.

• Laser Solutions
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• v.3 no.2
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• pp.25-33
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• 2000

One of perspective direction of microfabrication is direct laser writing technology that allows to create metal, semiconductive and dielectric micropatterns on substrate surface. In this work, a two step method, the combination of seed forming process, in which metallic Al seed was selectively generated on AlN ceramic substrate by direct writing technique using a pulsed Nd : YAG laser and subsequent electroless Ni plating on the activated Al seed, was presented. The effects of laser parameters such as pulse energy, scanning speed and pulse frequency on shape of Alseed and conductor line after electroless Ni plating were investigated. The nature of the laser activated surface is analyzed from XPS data. The line width of this metallic Al and Ni is analyzed using SEM. As a results, Al seed line with 24㎛ width and 100㎛ isolated line space is obtained. Finally, laser direct writing can be applied in the field between thin and thick film technique in electronic industry.

• Laser Solutions
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• v.2 no.3
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• pp.52-61
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• 1999

The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.403-406
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• 2003

Poyethylene(PE) films could be modified by radiation grafting of N-vinyl pyrollidone(NVP) using radiation. FTIR spectra was used to confirm the modification of PE films. The modified films were activated by one-step or two-step methods for electroless Cu plating. Morphology of metallized films has been investigated. Electroless Cu plating onto the modified films depends mainly on the grafting degree and activation type. The electrical conductivity and adhesion of the metallized films has been investigated and tested in regard of grafting degree of samples.