• 대한금속재료학회지
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• 제48권5호
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• pp.462-468
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• 2010

Carbon Nanotubes (CNTs) have recently emerged as a material with outstanding properties. It has shown promising potential for applications in many engineering fields as electronic devices, thermal conductors, and light-weight composites. Researchers have investigated their use as reinforcements in themetal matrix composites of CNTs. In the present work, we decorated CNTs with Ni particles by electroless plating. The CNTs were wet-ball milled for various milling times with a nickel sulfate solution. The precipitated Ni particles were observed mainly by FESEM. In this study, the dispersion of the CNTs and Ni particles was improved with the addition of the surfactant. Also, as the CNTs were shortened and widened by an increased ball milling time, the size of the precipitated Ni particles increased. It was estimated that the CNTs were deformed and caused some defects on their surface during the ball milling process. Those defects were assumed to be heterogeneous nucleation sites for the Ni particles.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.444-445
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• 2009

The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

• 한국분말재료학회지
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• 제25권5호
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• pp.375-378
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• 2018

Conductive and dielectric SiC are fabricated using electroless plating of Ni-Fe films on SiC chopped fibers to obtain lightweight and high-strength microwave absorbers. The electroless plating of Ni-Fe films is achieved using a two-step process of surface sensitizing and metal plating. The complex permeability and permittivity are measured for the composite specimens with the metalized SiC chopped fibers dispersed in a silicone rubber matrix. The original non-coated SiC fibers exhibit considerable dielectric losses. The complex permeability spectrum does not change significantly with the Ni-Fe coating. Moreover, dielectric constant is sensitively increased with Ni-Fe coating, owing to the increase of the space charge polarization. The improvements in absorption capability (lower reflection loss and small matching thickness) are evident with Ni-Fe coating on SiC fibers. For the composite SiC fibers coated with Ni-Fe thin films, a -35 dB reflection loss is predicted at 7.6 GHz with a matching thickness of 4 mm.

• 한국염색가공학회지
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• 제10권2호
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• pp.8-17
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• 1998

In this study we have examined electroless chemical plating on the plasma grafted poly [ethylene terephathalate］(PET) fabric in order to improve the interfacial adhesion between metal and fiber. The vapour phase of acrylic acid introduced on the PET surface and the graft polymerization was carried out by using cold plasma, resulting in the grafting yield of 0.8-1.3 wt％. The carboxyl group of the plasma grafted was identified by FT-IR-ATR spectra. The Interfacial adhesion was related to the carboxyl group. After electroless chemical plating of nickel, it showed that the more the carboxyl, the better the interfacial adhesion. Comparing to the untreated, the plasma grafted fabric showed fairly good interfacial adhesion(5B grade, ASTM D3359) . The shielding effect of electromagnetic wave showed 95dB. The shielding effect depends on the fabric structure, the surface structure, and the cross sectional shape of fibers. The dense fabric structure, the etched surface like a microcrater, and the trigonal cross sectional shape were prefered.

• 한국표면공학회지
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• 제32권2호
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• pp.172-181
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• 1999

The effect of the DMAB concentration, temperature, deposition time, and stabilizer concentration on the precipitation reaction of the electroless nickel plating using dimethylamine borane (DMAB) as reducing agent was investigated to by the weight gain and electrochemical method. The deposition rate was dependent with DMAB concentration. The polarization resistance of the precipitation reaction was reduced with DMAB concentration. The precipitation reaction rate of Ni-B deposits was controlled by the oxidation rate of DMAB as the source of electron. The boron content of the deposit was constant at about 5.5wt%, even when DMAB concentration in the solution was increased. The effect of temperature and stabilizer ($Pb(NO_3)_2$) concentration on deposition rate was shown to have co-dependent behaviors.

• Korean Chemical Engineering Research
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• 제59권2호
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• pp.269-275
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• 2021

메탄의 부분 산화반응을 위해 규칙적인 메조기공을 갖는 실리카를 지지체로 한 니켈 촉매를 제조하였다. 니켈 플레이팅(Nickel plating) 방법을 이용하여 촉매 제조 시 기존 함침 촉매 제조법과 달리 니켈이 실리카 표면에 도포된다. 이때 니켈이 고분산 되어 안정적인 니켈입자를 형성하게 된다. 니켈 플레이팅 촉매의 경우, TEM-EDS 분석에서 니켈이 매우 고분산 된 것을 확인할 수 있었다. 이러한 고분산된 촉매로 메탄 부분산화 반응 시 기존 함침촉매와는 달리 니켈의 소결과 탄소침적이 상대적으로 적어 촉매의 비활성화가 매우 낮았다. 팔라듐은 환원 조촉매로서의 역할을 하여, 메탄 전환율과 생성된 합성가스의 H2/CO 비 관점에서 우수한 반응 성능을 보이는 것을 확인 할 수 있었다.

• 연구논문집
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• 통권22호
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• pp.151-160
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• 1992

The wear resistance of electroless Ni-P-X(X A1203, Diamond) composite coating layers was studied by Taber abrasion test technique. The wear resistance of composite coating layers was particularly relied upon the codeposited content, particle size and distribution of particles, and heat treatment of coating layers, as well as the electroless nickel plating bath employed. In this study, we lay emphasis on the wear resistance of electroless composite coating layers containing A1203 particles(1.2~Im, 6.7hIm, 11.5lIm, 20l1m) or diamond particles (1.5jim, 5gm). From the result of composite coating A1203 and diamond particles, the wear resistance of composite coating layers is as follows.

• Applied Microscopy
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• 제46권3호
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• pp.167-169
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• 2016

Solder/electroless nickel immersion gold (ENIG) joint sample which is comprised of dissimilar materials with different mechanical properties has limited the level of success in preparing thin samples for transmission electron microscopy (TEM). This short technical note reports the operation parameters for ultramicrotomy of solder joint sample and TEM analysis results. The solder joint sample was successfully sliced to 50~70 nm thick lamellae at slicing speed of 0.8~1.2 mm/s using a boat-type $45^{\circ}$ diamond knife. Ultramicrotomy can be applied as a routine sample preparation technique for TEM analysis of solder joints.

• 한국표면공학회지
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• 제32권3호
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• pp.372-376
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• 1999

The deposited Cu film on the ferrite magnet was more deposited comparing with that on the plastic magnet. The Cu film became thicker on the S pole comparing with that on the N pole in the both of magnets. The thickness and texture coefficient of deposited copper film affected with direction of line of magnetic force. The difference of pole had little or no effect to the texture coefficient of deposited nickel film. The reaction rate on ferrite magnet and S pole was faster comparing with that on plastic magnet and N pole.

• 동력기계공학회지
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• 제5권2호
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• pp.71-78
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• 2001

Using sodium hypophosphite as reducing agent, bath composition and plating condition of electroless copper plating on plating rate have been studied. The followings were determined as optimum, bath composition; $CuSO_4\;0.025M,\;NiSO_4\;0.002M,\;NaH_2PO_2\;0.4M$, sodium citrate 0.06M, $H_3BO_3$ 0.6M, thiourea or 2-MBT $0.2mg/{\ell}$, and operation conditions; pH $9{\sim}10$ at bath temperature rage of $60{\sim}70^{\circ}C$. A small amount of nickel ion($Ni^{2+}/Cu^{2+}$=0.002/0.025) to the hypophosphite reduced solution promotes autocatalysis and continuous plating. An additive such as thiourea or 2-MBT of a small amount($0.2mg/{\ell}$) can be used to stabilize the solution without changing plating rate much. The attivation energy between $20^{\circ}C\;and\;70^{\circ}C$ were calculated to be 11.3kcal/mol for deposition weight. Plating reaction had been ceased by the adjustment of pH above 13, temperature higher than $90^{\circ}C\;and\;under\;20^{\circ}C$. Deposited surface became worse in the case of increment of bath temperature above $80^{\circ}C$.