• Journal of Korean Society of Environmental Engineers
• /
• v.38 no.1
• /
• pp.1-7
• /
• 2016

In order to treat electrolysis nickel plating pickling wastewater to meet the effluent limit less than 3.0 mg/L, the electrolysis process by using soluble and insoluble electrode were studied. Electrolysis using soluble electrodes has a characteristic of easy elution from the electrode which the insoluble electrodes close not release metal from the electrode. For these reasons, there exist different characteristics in nickel removal efficiency, purity of nickel sludge. With this connection, the feasibility test were concluded to develop optimal conditions for the treatment of pickling wastewater electrolysis by using soluble electrodes, insoluble electrodes. Optimal condition of current density, pH were derived from the pickling wastewater using insoluble electrodes. It was concluded the highest removal efficiency of nickel at the operation condition of at pH 9, current density of $15mA/cm^2$. At these conditions, 95.3% purity of nickel sludge was achieved, iron content was 2.9%. Optimal condition when using soluble electrodes was derived current density of $10mA/cm^2$, pH 9. Purity of nickel sludge was 77.3%, iron content was 21.0%. 50.7% and 24.2% of operating cost can be saved by the use of soluble electrodes and the use of insoluble electrodes, respectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.83-90
• /
• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.118-121
• /
• 2003

The electrochemical behaviors of UBM nickel were investigated. Electrode potential has been changed with the surface composition. Zinc is dissolved into the solution immediately after immersion. Electrode potential has three distinct regions: Zinc dissolution region, transient region and nickel plating region. The effects additives on electrode potential and polarization curves were also investigated. The addition of suppressor lowered the current density which is related with deposition rate.

• Journal of the Korean institute of surface engineering
• /
• v.28 no.3
• /
• pp.123-132
• /
• 1995

While a nickel mesh and an expanded nickel sheet are used as current collectors for supporting active anode materials in rechargeable batteries, a porous nickel substrate is studied extensively for its 3-dimensional structure which has high capabilities for active materials and current collection. Optimum plating conditions were studied by polarization measurement. Scanning Electron Microscopy (SEM) showed that both electroless-and electro-plated nickel on an urethane substrate were highly porous and consisted of nearly spherical pores. The diameter and the channel size of the pores were found to be 300~500 $\mu\textrm{m}$ and 50~200$\mu\textrm{m}$, respectively. The shape of skeleton resembled a triangular prism with length extending about 50~100 $\mu\textrm{m}$.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.1
• /
• pp.49-54
• /
• 2023

Recently, System in Packaging(SIP) technology needs to meet high frequency (5G and more) communication technology and fine pitch surface treatment. The conventional Electroless Ni/Immersion Au plating(ENIG) is not suitable for high frequency range because of magnetic properties are increasing the transmission loss. Without nickel plating layer, the pattern and pad reliability level must be meet the condition. In this review paper, we investigated research trends on Ni-less surface treatment technology for high-frequency communication and frequency characteristics according to materials.

• Applied Chemistry for Engineering
• /
• v.27 no.2
• /
• pp.210-216
• /
• 2016

In this paper, the electrical and resistance heating properties of carbon fiber heating elements with different electroless Ni-P plating times for car seat were studied. The specific resistance and specific heat of the carbon fibers were determined using 4-point probe method and differential scanning calorimetry (DSC), respectively. The surface morphology and temperature of carbon fibers were measured by scanning electron microscope (SEM) and thermo-graphic camera, respectively. From experimental results, the nickel layer thickness and surface temperature of carbon fibers increased with increasing the plating time. However, the specific heat and specific resistance decreased with respect to the increased plating time. In conclusion, the electroless Ni-P plating could improve the resistance heating and electrical properties of carbon fiber heating elements for car seat.

• Korean Journal of Materials Research
• /
• v.8 no.5
• /
• pp.444-449
• /
• 1998

There are various shielding materials that have been considered; the use of a metallic plate or the layering of a conductive material on a plastic surface and the insertion of filler in plastics. All of these methods have shown their merits and weakness. Therefore, many studies have concentrated on developing materials that effectively cut down EMI without increase in weights of housing materials. In these respects, this study has focused on investigations of the shielding effect of materials that have electroless nickel plating on the lamella structured micro particles surface with low specific gravity. When a film of electroless nickel were plated on a micro particle surfaces and then mixed with paint, the electromagnetic shielding effects were measured as 63dB. Although these effects were less than that 90dB of the copper plate, trials in a series of 6 times increased the shielding effect by IOdB and is applicable to wide range of EMI shielding.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.07a
• /
• pp.95-99
• /
• 2001

Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.55-62
• /
• 2001

With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.3
• /
• pp.63-71
• /
• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.