• Journal of Welding and Joining
• /
• v.30 no.5
• /
• pp.64-69
• /
• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Applied Chemistry for Engineering
• /
• v.22 no.6
• /
• pp.672-678
• /
• 2011

In this work, carbon fibers were electrolessly Ni-plated in order to investigate the effect of metal plating on the electromagnetic shielding effectiveness (EMI-SE) of Ni-coated carbon fibers-reinforced epoxy matrix composites. The surfaces of carbon fibers were characterized by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Electric resistance of the composites was tested using a 4-point-probe electric resistivity tester. The EMI-SE of the composites was evaluated by means of the reflection and adsorption methods. From the results, it was found that the EMI-SE of the composites enhanced with increasing Ni plating time and content. In high frequency region, the EMI-SE didn't show further increasing with high Ni content (Ni-CF 10 min) compared to the Ni-CF 5 min sample. In conclusion, Ni content on the carbon fibers can be a key factor to determine the EMI-SE of the composites, but there can be an optimized metal content at a specific electromagnetic frequency region in this system.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.4
• /
• pp.61-68
• /
• 2023

In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn₂ IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni₃Sn₄/FeSn₂/Ni₃Sn₄ was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni₃Sn₄/FeSn₂ interface and then propagated into FeSn₂. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200℃. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.