• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Journal of the Korean institute of surface engineering
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• v.26 no.4
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• pp.175-182
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• 1993

Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.88-93
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• 2003

무전해 Ni-P와 Sn의 반응 및 Ni-P의 결정화에 대한 P 함량의 영향을 세 가지 다른 조성의 Ni-P (P 4.6, 9, 13 $wt.\%$)를 이용하여 연구하였다. $300^{\circ}C$까지 열처리한 모든 시편에서 $Ni_3Sn_4$ intermetallic compound (IMC)가 생성되었고 이들 시편을 $450^{\circ}C$까지 열처리한 경우 Sn 두께가 $0.5{\mu}m$로 작을 때 $Ni_3Sn_4$가 모두 $Ni_3Sn_2$로 변화하였다. nanocrystal인 Ni-4.6P는 Ni (111) texture를 유지하며 결정화되었고 Sn과의 반응시 형성되는 $Ni_3Sn_4$ IMC 또한 비정질인 Ni-9P, Ni-13P 경우보다 강한 (111) texture를 가짐이 확인되었다. Ni-P 막의 P 함량이 작은 경우 $Ni_3Sn_4$ IMC는 두껍고 조밀하게 형성되는 반면 P-rich layer 두께는 작아졌다.

• Journal of the Korean Ceramic Society
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• v.26 no.1
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• pp.73-80
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• 1989

Preparation and characteristics of electroless Ni-P and Ni-B systems for semiconducting ceramics have been investigated as a function of deposit rate, reducing agent and pH variation. The effect of DMAB as ruducing agent is greater than that of sodium hypophosphite. The nickel electrode prepared from the nickel-phosphorus system with sodium hypophosphite shows low contact resistance of 0.99ohm compared with the resistance of 10chm in the electrode prepared from the nickel-boron system with DMAB. The contact resistance increases with increasing pH valuein the nickel-phosphorus system with sodium hypophosphite. The ratio of Ni to P is about 76.0/24.0 for the contact resistance of 0.99ohm in the above system.

• Resources Recycling
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• v.21 no.2
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• pp.41-46
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• 2012

An investigation on the recovery of nickel from spent electroless plating solutions has been performed using the electrowinning method. For this aim, nickel in spent electroless plating solutions was separated as nickel hydroxide through the addition of caustic soda. Nickel hydroxide was completely dissolved with sulfuric acid and an electrolysis was performed for electrowinning of nickel from nickel solutions. As a result, it was found that more than 99% of nickel in spent electroless plating solutions could be precipitated as nickel hydroxide above pH 10 with the addition of caustic soda. As far as the current efficiency in electrowinning of nickel was concerned, it was decreased with increase in the current density.

• Polymer(Korea)
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• v.27 no.1
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• pp.52-60
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• 2003

In this work, two types of Ni-plating, namely electrolytical and electroless Ni-platings on carbon fiber surfaces, were carried out to enhance the impact resistance of composites. And the comparison between electrolytical and electroless methods on their impact properties of composite system was studied. The surface properties of carbon fibers were characterized using XRD, SEM, and contact angle measurements. The impact behaviors were investigated using an Izod type impact tester. As experimental results, it was observed that electrolessly plated Ni layers had Ni-P alloys on carbon fiber surfaces as revealed by XRD, and electrolytically Ni-plated carbon fibers showed higher surface free energies than those of the electrolessly Ni-plated carbon fibers. In particular, the impact strengths of electrolessly Ni-plated carbon fibers-reinforced plastics were strongly increased. These results were probably due to the difference of wettabilities according to the different types of Ni-plating methods.

• Journal of the Korean institute of surface engineering
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• v.27 no.2
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• pp.109-117
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• 1994

Effect of ultrasonic agitation on the contact properties was studied in Ni electroless plating and Pd activation. P-type Si bare wafers were used as substrate and DMAB was used as reducing agent due to its good electrical properties, solderability and compatibility to substrate. In activation, high density Pd nuclei of small size were formed during ultra-sonic agitation compared to that of no stirring. In electroless plating, the plating rate was enhanced by 30∼90% by using ultrasonic agitation. In elecrtoless plating, inhibitor is the most effective additives in ultrasonic agitation. In this experi-ment, thiourea was used as inhibitor. The less the amount of the inhibitor, the more ultrasonic agitation efficiency. It is confirmed by SEM that Ni-B films formed by ultrasonic were coarser, less porous, and denser than those of no stirring. In ultrasonic agitation, boron content of the films was more than those of no stirring. In this case, the more DMAB concentration, the higher the temperature, the less pH, the more boron content. Resistivity of the films formed by ultrasonic agitation was higher than that of no strirring. As the content of boron was increased, the resistivity of the films was increased exponentially.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.199-200
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• 2003

• Transactions of Materials Processing
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• v.28 no.2
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• pp.77-82
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• 2019

Corrosion occurs well on surface of roll formed and Zn alloy subsequently electro-deposited on steel bolt under wet condition. In this study, variations in corrosion resistance were investigated through the measurement of polarization curves on steel bolts which were roll formed and subsequently coated with various types of coating methods. According to the measured polarization curve, Ni-P electroless deposits on roll formed steel increased the resistance to corrosion. The corrosion resistance of Zn alloy powder coated steel bolt was found to be better than that of Zn-Ni electro-deposited sample.

• Journal of the Korean institute of surface engineering
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• v.40 no.2
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• pp.70-76
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• 2007

Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at $300^{\circ}C$ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.