• 한국표면공학회지
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• 제27권4호
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• pp.193-206
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• 1994

A wear behavior of electroless (Ni-P-X, X: SiC, $Al_2O_3$, Diamond) composite coating layers, formed under various conditions on commerical grade low carbon steel, has been investigated using Taber abrasion tester and scanning electron microscope. Several factors, which are type of particles, co-deposited content, particle size, distribution of particles and heat-treatment, influenced the wear resistance. The wear resistance of the composited coating layers after heat-treatment at $400^{\circ}C$ for 1 hr was increased 70 times with diamond, 15 times with SiC and 8 times with $Al_2O_3$, compared with the electroless nickel plating layer without heat-treatment.

• 폴리머
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• 제27권1호
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• pp.52-60
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• 2003

본 연구에서는 탄소섬유 강화 에폭시 수지 복합재료의 충격 특성 향상을 위해 탄소섬유표면에 전해 및 무전해 니켈도금처리를 하였으며, 이때 각각의 니켈도금법에 따른 충격 특성을 비교 고찰하였다. 도금된 탄소섬유의 표면 특성은 XRD, SEM, 그리고 접촉각 측정을 통해 관찰하였고, 탄소섬유 강화 복합재료의 충격 특성은 Izod형의 충격시험기를 이용하여 분석하였다. 실험결과, 무전해 니켈도금층에는 전해도금층과는 달리 Ni-P 합금이 포함된 것이 XRD를 통하여 확인되었으며, 전해 니켈도금된 탄소섬유가 무전해 니켈도금된 것보다 표면자유에너지가 큰 것이 접촉각 측정을 통해 관찰되었다. 한편, 무전해 니켈도금된 탄소섬유 강화 에폭시 수지 복합재료는 충격강도가 크게 증가하였으나, 전해 니켈도금된 복합재료의 경우는 충격강도가 증가하지 않았다. 이러한 결과는 각각의 도금법에 따른 젖음성의 차이가 탄소섬유 강화 복합재료의 연성을 변화시켜 충격강도 증가에 주요하게 작용되었기 때문으로 사료된다.

• 한국수소및신에너지학회논문집
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• 제20권4호
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• pp.291-299
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• 2009

Ni-plated polytetrafluoroethylene(Ni-PTFE) particles($25{\mu}m$, $500{\mu}m$) were prepared by using nickel electroless plating. The Ni content in Ni-PTFE particles increased with increasing the amount of reduction agent. At about 53 wt% Ni content, $25{\mu}m$ Ni-PTFE particles showed conductivity of 320S/m. The Ni-PTFE particles were formed into the Ni-PTFE plate using heat treatment at $350^{\circ}C$ under $10{\sim}1000kg/cm^2$. The Ni-PTFE plate displayed the high conductivity of 5100S/m due to the formation of 3-dimentional Ni network. The plate was used as an electrode in an alkaline fuel cell(AFC). In terms of the current density, the Ni-PTFE electrode having higher Ni content(53 wt%) showed improved performance.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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• pp.67-71
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• 2000

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 춘계학술발표회 초록집
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• pp.15-16
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• 2000

• 한국재료학회:학술대회논문집
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• 한국재료학회 1993년도 추계 학술발표 강연 및 논문 개요집
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• pp.132-132
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• 1993

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 춘계 학술발표 강연 및 논문 개요집
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• pp.89-89
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• 1994

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 추계학술발표회 초록집
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• pp.5-6
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• 1998

• Transactions on Electrical and Electronic Materials
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• 제14권3호
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• pp.133-138
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• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.