• 대한치과기공학회지
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• 제27권1호
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• pp.189-192
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• 2005

• 대한치과보철학회:학술대회논문집
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• 대한치과보철학회 2000년도 춘계학술대회
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• pp.34-34
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• 2000

• 대한치과보철학회:학술대회논문집
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• 대한치과보철학회 2000년도 춘계학술대회
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• pp.35-35
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• 2000

• 대한치과보철학회:학술대회논문집
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• 대한치과보철학회 2000년도 춘계학술대회
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• pp.36-36
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• 2000

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2001년도 춘계연구발표회 논문개요집
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• pp.20-21
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• 2001

• 대한심미치과학회지
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• 제13권1호
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• pp.41-49
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• 2004

• 대한심미치과학회지
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• 제13권1호
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• pp.57-63
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• 2004

• 대한치과보철학회:학술대회논문집
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• 대한치과보철학회 2000년도 추계학술대회
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• pp.30-31
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• 2000

• 기계와재료
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• 제14권1호통권51호
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• pp.88-98
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• 2002

• 대한치과보철학회지
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• 제38권3호
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• pp.328-335
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• 2000

Statement of the problem. Recently an innovative method of fabricating indirect restorations by gold electroforming has been developed. But the bond quality and strength of the gold coping to the porcelain is uncertain. Purpose of study. The purpose of this study is to analyze and evaluate the electroformed gold surface for mechanical bonding between the gold and the ceramic veneering. Methods/material. Electroformed disks were made using electroforming technique. And the surface of the electroformed coping was analyzed after sandblasting, heat-treatment, bonding agent application, opaque porcelain firing with scanning electron microscopy and energy dispersive x-ray analysis. Results. In the analysis with SEM, Sandblasting made the sharp edges and undercuts on the electroformed surface, and after bonding agent application, net-like structure were created on the electroformed surface. In the energy dispersive x-ray analysis it is confirmed that electroformed surface contains some impurities. Conclusion. With the use of sandblasting and bonding agent, electroformed surface seems to be enough to bond with veneering porcelain.