• 제목/요약/키워드: Electroforming

검색결과 126건 처리시간 0.021초

CoP나노선재의 자기적 성질에 미치는 미세구조와 크기 효과 (Variation of the Magnetic Properties of Electrodeposited CoP Nanowire Arrays According to Their Size and Microstructure)

  • 김이진;이관희;정원용;김광범
    • 전기화학회지
    • /
    • 제6권3호
    • /
    • pp.208-211
    • /
    • 2003
  • 본 연구에서는 CoP나노선재의 미세구조 및 크기에 따른 자기적 성질의 변화를 고찰하였다. 우선 나노선재를 제조하기 위하여 기공의 직경이 각각 20nm, 200nm인 알루미나 형틀을 제조하였고, 이 형틀을 이용하여 전기도금 방법으로 CoP나노선재를 제조하였다. 직경이 20nm인 나노선재의 경우 나노선재의 길이방향으로의 각형성 및 보자력이 각각 0.8, 2600 Oe으로서 지금까지 보고된 나노선재들에 비해 우수한 자기적 성질을 나타내었고 전기도금 시 전류밀도의 영향이 거의 없었다. 그러나 직경이 200nm인 나노선재는 나노선재의 길이방향으로 각형성 및 보자력이 각각 0.15, 1200 Oe으로 20nm나노선재보다 현격하게 감소하였으며 나노선재의 자기적 성질이 전류밀도에 따라 많은 영향을 받고 있음을 확인하였다 즉, 상대적으로 낮은 전류밀도에서 제조된 나노선재일 수록 나노선재와 평행한 방향으로 자화용이축이 배향되어 길이방향으로 각형성 및 보자력이 증가하였다.

Improvement of Reliability by Using Fluorine Doped Tin Oxide Electrode for Ta2O5 Based Transparent Resistive Switching Memory Devices

  • Lee, Do Yeon;Baek, Soo Jung;Ryu, Sung Yeon;Choi, Byung Joon
    • 한국신뢰성학회지:신뢰성응용연구
    • /
    • 제16권1호
    • /
    • pp.1-6
    • /
    • 2016
  • Purpose: Fluorine doped tin oxide (FTO) bottom electrode for $Ta_2O_5$ based RRAM was studied to apply for transparent resistive switching memory devices owing to its superior transparency, good conductivity and chemical stability. Methods: $ITO/Ta_2O_5/FTO$ (ITF) and $ITO/Ta_2O_5/Pt$ (ITP) devices were fabricated on glass and Si substrate, respectively. UV-visible (UV-VIS) spectroscopy was used to examine transparency of the ITF device and its band gap energy was determined by conventional Tauc plot. Electrical properties, such as electroforming and voltage-induced RS characteristics were measured and compared. Results: The device with an FTO bottom electrode showed good transparency (>80%), low forming voltage (~-2.5V), and reliable bipolar RS behavior. Whereas, the one with Pt electrode showed both bipolar and unipolar RS behaviors unstably with large forming voltage (~-6.5V). Conclusion: Transparent and conducting FTO can successfully realize a transparent RRAM device. It is concluded that FTO electrode may form a stable interface with $Ta_2O_5$ switching layer and plays as oxygen ion reservoir to supply oxygen vacancies, which eventually facilitates a stable operation of RRAM device.

MATERIAL RELIABILITY OF Ni ALLOY ELECTRODEPOSITION FOR STEAM GENERATOR TUBE REPAIR

  • Kim, Dong-Jin;Kim, Myong-Jin;Kim, Joung-Soo;Kim, Hong-Pyo
    • Nuclear Engineering and Technology
    • /
    • 제39권3호
    • /
    • pp.231-236
    • /
    • 2007
  • Due to the occasional occurrences of stress corrosion cracking(SCC) in steam generator tubing(Alloy 600), degraded tubes are removed from service by plugging or are repaired for re-use. Since electrodeposition inside a tube does not entail parent tube deformation, residual stress in the tube can be minimized. In this work, tube restoration via electrodeposition inside a steam generator tubing was performed after developing the following: an anode probe to be installed inside a tube, a degreasing condition to remove dirt and grease, an activation condition for surface oxide elimination, a tightly adhered strike layer forming condition between the electro forming layer and the Alloy 600 tube, and the condition for an electroforming layer. The reliability of the electrodeposited material, with a variation of material properties, was evaluated as a function of the electrodeposit position in the vertical direction of a tube using the developed anode. It has been noted that the variation of the material properties along the electrodeposit length was acceptable in a process margin. To improve the reliability of a material property, the causes of the variation occurrence were presumed, and an attempt to minimize the variation has been made. A Ni alloy electrodeposition process is suggested as a primary water stress corrosion cracking(PWSCC) mitigation method for various components, including steam generator tubes. The Ni alloy electrodeposit formed inside a tube by using the installed assembly shows proper material properties as well as an excellent SCC resistance.

표면처리방법에 따른 전기성형금속의 도재결합강도 (SHEAH BOND STRENGTH OF VENEERING CERAMIC TO ELECTROFORMED GOLD WITH THREE DIFFERENT SURFACE TREATMENT)

  • 김철;임장섭;전영찬;정창모;정희찬
    • 대한치과보철학회지
    • /
    • 제43권5호
    • /
    • pp.599-610
    • /
    • 2005
  • Purpose: The success of the bonding between electroformed gold and ceramic is dependent on the surface treatment of the pure gold coping. The purpose of this study was to evaluate the bonding strength between the electroformed gold and ceramic with varying surface treatment. Materials and methods: A total of 32 disks,8 were using conventional ceramometal alloy, 24 were using electroforming technique as recommended by manufacturer, were prepared. 24 electroformed disks were divided 3 groups according to surface treatment, i.e. 50 microns aluminium oxide sandblasting(GES-Sand), gold bonder treatment(GES-Bond) and $Rocatec^{TM}$ system(GES-Rocatec). For control group of conventional alloy 50 microns aluminium oxide treatment was done(V-Supragold). Energy dispersive x-ray analysis and scanning electron microscope image were observed. Using universal testing machine, shear bond strength and bonding failure mode at metal-porcelain interface were measured. Results and Conclusion: The following conclusions were drawn: 1. In the energy dispersive x-ray analysis, the Au was main component in electroformed gold(99.9wt%). After surface treatment, a little amount of $Al_2O_3(2.4wt%)$ were found in GES-Sand, and $SiO_2(4wt%)$ in GES-Bond. In GES-Rocatec, however, a large amount of $SiO_2(17.4wt%)$ were found. 2. In the scanning electron microscopy, similar pattern of surface irregu larities were observed in V-Supragold and GES-Sand. In GES-Bond, surface irregularities were increased and globular ceramic particles were observed. In GES-Rocatec, a large amount of silica particles attached to metal surface with increased surface irregularities were observed. 3. The mean shear bond strength values(MPa) in order were $22.9{\pm}3.7(V-Supragold),\;22.1{\pm}3.8(GES-Bond),\;20.1{\pm}2.8(GES-Rocatec)\;and\;13.0{\pm}1.4(GES-Sand)$. There was no significant difference between V-Supragold, GES-Bond, and GES-Rocatec. (P>0.05) 4. Most bonding failures modes were adhesive type in GES-Sand. However, in V-Supragold, GES-Bond and GES-Rocatec, cohesive and combination failures were commonly observed. From the result, with proper surface treatment method electroformed gold may have enough strength compare to conventional ceramometal alloy.

유기/무기 나노 템플레이트를 이용한 나노 정보소재 합성 연구 (Nano-scale Information Materials Using Organic/Inorganic Templates)

  • 이전국;정원용
    • 한국자기학회지
    • /
    • 제14권4호
    • /
    • pp.149-161
    • /
    • 2004
  • 나노기술과 정보기술의 융합은 이제 성숙 단계에 있는 정보화시대에 중요한 역할을 할 것으로 예상된다. 특히, 한국 산업에서의 정보 기술의 역할을 고려할 때, NT-IT 기술 융합은 매우 중요하다. 나노 소재는 그 크기가 나노미터 크기로 작은 것을 의미하며, 나노 크기에서 독특한 물성을 나타내는 특성을 가지고 있다 자기조립 기술을 활용하여 보텀업 공정을 수행하여 나노 크기의 정보 소재 및 소자를 구현한다. 이러한 기술은 생물체 등에서 일어나는 원자나 분자의 자기 조립 현상과 유사하다. 유기. 무기 템플릿을 이용한 정보 소재 개발 연구는 Guided Self Assembly유기물 나노 템플릿의 개발 및 AAO무기물 나노 템플릿을 활용한 나노 구조물 형성과 이를 응용한 정보기술과의 융합에 관해 연구이다. Nano structuring을 위해 Electroforming, Sol-gel processing, ionized Physical vapor deposition, ion beam implantation 법 등을 사용하며, 정보기술에 필요한 핵심 요소 기술을 개발한다. 형성된 Nano structure의 전기적 특성 평가 및 미세 구조 분석 및 응용을 고려한 소자 특성 평가를 통해서, IT분야에 적용 가능한 정보소재를 개발한다.

금속하부구조물이 도재의 색조에 미치는 영향에 대한 분광측색분석 (SPECTROPHOTOMETRIC ANALYSIS OF THE INFLUENCE OF METAL SUBSTRATE ON THE COLOR OF CERAMIC)

  • 이수옥;우이형;최대균;권긍록
    • 대한치과보철학회지
    • /
    • 제41권2호
    • /
    • pp.148-159
    • /
    • 2003
  • Statement of problem Metal-ceramic restorations have been used extensively by dental clinicians for nearly 40 years. Strength an functional ability of metal-ceramic restorations are proved to be satisfying, However esthetics and biocompatibility of metal alloy which is used in metal-ceramic restoration is not ideal. Using pure gold as an alternative, have advantage of esthetics, biocompatibility over conventional metal alloy. But there had been little article which studied on the color effect of pure gold on fual porcelain color. Purpose The purpose of this study was to spectrophotometrically evaluate the difference between color of metal alloy(Au-Pt, Ni-Cr) and pure gold, during color masking procedure with opaque porcelain and to analyze the differences, Material and Methods Three types of metal - base metal(Ni-Cr), high gold alloy(Au-Pt), pure gold(GES) - specimen were fabricated 1cm in diameter. Four steps were established - after finishing, after pre-coditioning, after application of first opaque porcelain(0.08mm in thickness), after application of second opaque porcelain(0.15mm in thickness)- and tested color with spectrophotometer every each steps and analyzed with $CIEL^*a^*b^*$ color order system. One-Way ANOVA test was used to and out if there were significant differences between groups tested and Shaffe multiple comparison was used to identify where the differences were. Results 1. After finishing and pre-conditioning, pure gold(GES) group showed most high values in $L^*,a^*,b^*$. 2. After application of first opaque porcelain(0.08mm in thickness), after application of second opaque porcelain(0.15mm in thickness), pure gold(GES) group showed the least difference in $L^*,a^*,b^*$ values and the lowest ${\Delta}E$ value(${\Delta}E$=0.63). 3. After application of first opaque porcelain and after application of second opaque porcelain differences that were significant (P<0.05) between groups were found only in $a^*$ values. 4. Base metal alloy group showed the lowest $a^*$ value in test after application of first opaque porcelain and the highest value in test after application of first opaque porcelain Conclusion Pure gold group and high gold group showed higher $a^*$ values than base metal group when tested after 0.08mm thickness of opaque porcelain was applied and pure gold group showed much similar $L^*,a^*,b^*$ values between 0.08mm thickness and 0.15mm thickness of opaque porcelain. This meant that pure gold was more easily masked by opaque porcelain than the other two groups.