• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.775-777
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• 2003

Several methods are available for the fabrication of electrode pattern for the plasma display panel(PDP) including screen printing and photolithographic method. Piezo type ink-jet printing method is considered to the method of choice for electrode patterning in manufacturing of PDP. Both silver ink and absorbent layer paste formulation were developed for ink-jet printing of electrode pattern. The ink-jet printing of silver electrode with preformed absorbent layer was especially suitable for the patterning of address electrode for high resolution PDP.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.962-965
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• 1999

We designed and fabricated a travelingwave CPW(coplanar waveguide) electrode for LiNbO$_3$ optical modulator. To Investigate the variation of microwave refractive index of these electrodes, we prepared the CPW electrode samples as a function of electrode thickness and measured the TDR and S-parameter. From this results, we could know the electrode conditions of index matching to 2.20 for 1550nm optical wave index for applying LiNbO$_3$ optical modulator and described. Also, we discussed the some properties of CPW electrode for applying LiNbO$_3$ optical modulator.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1865-1868
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• 2003

This paper provides a new method for hybrid machining, particularly suited to micro fabrication applications such as micro point, micro line, micro structure, micro partition and so on. Developed micro fabrication process by electrical discharge machining (EDM) and electrical discharge deposition (EDD) with metal powder (Ti, Fe) has been studied to build TiC or FeC structure. Titanium powder or iron powder is supplied from working fluid (kerosene or de-ionized water with powder) and adheres on a workpiece by the heat and electric power caused by the electrical discharge. The use of a tool electrode is expected to keep powder concentration high in the gap between a workpiece and a tool electrode and to accrete powder material on the workpiece. The deposition is tried under various electrical conditions (workpiece. tool electrode, working fluid, discharge current, voltage and powder etc.). On the other hand. using electrical discharge machining (EDM) with the same tool electrode, it can be used as a removal process (cutting) by electro erosion at the same time. Therefore. this new method can do a hybrid machining to build up and down a structure with the workpiece.

• International Journal of Precision Engineering and Manufacturing
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• 제9권2호
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• pp.75-80
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• 2008

The fabrication of complex three-dimensional electrodes for micro electrical discharge machining (micro-EDM) is an important issue in the field of micromachining Localized electrochemical deposition (LECD) is a simple and inexpensive technique for fabricating micro-EDM electrodes. This study presents a new process for manufacturing electrodes with complex cross-sections using masks of different shapes, In this process, a non-conductive mask is placed between an anode and cathode that are immersed in a plating solution of acidified copper sulfate. The LECD is achieved by applying a pulsed voltage between the anode and cathode, which are separated by a small distance. In this setup, the cathode is placed above the anode and the mask, so that the deposited electrode can be used directly for EDM without changing the tool orientation. We found that the microstructure of the deposited electrode is influenced by the concentration of the plating solution and organic additives. Moreover, the values of the voltage, frequency, and duty cycle of the pulsed input have significant effects on the microstructure of the fabricated electrode. Finally, the optimum values of the voltage, frequency, and duty cycle were determined for the most effective fabrication of complex-shaped electrodes.

• Transactions on Electrical and Electronic Materials
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• 제3권1호
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.146-150
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• 2004

We researched carbon nanotube(CNT) cartridge as a CNT sample for the fabrication of nanotweezer which is composed of a couple of single CNT tip. Our CNT cartridge was made by dielectrophoretic methods, a kind of micromanipulation technique using electric field. Therein we intended to fabricate the CNT cartridge with just conventional function generators and a set of simple electrode. A knife edge and a flat metal electrode were employed as a couple of electrode, and these electrode pair faced each other with the gap. When the gap is filled with CNT suspension, we induced AC electric field into the gap. Then CNTs was attached on the sharp edge in knife edge by dielectrophoresis. This knife edge with attached CNTs is called as the CNT cartridge.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.347-350
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• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

• 한국세라믹학회지
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• 제36권6호
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• pp.583-589
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• 1999

In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.191-193
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• 2005

This study has investigated the effects of the etching method of a Ti substrate for a metal oxide electrode on the electrochemical characteristics of the electrode. The HCl etching develops a fine and homogeneous roughness on the Ti substrate. Fabrication and material properties of the catalytic oxide electrode, which is known to be so effective to destruct refractory organics in aqueous waste, were studied. A method to enhance the fabrication reproducibility of the oxide electrode was tested for Ru, Zr, Sn oxide on the Ti substrate using SEM, XRD, Cyclic voltammetry.

• 한국전기전자재료학회논문지
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• 제28권8호
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• pp.524-530
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• 2015

We propose a three-electrode type electronic paper display and its fabrication process to realize single color at the same display panel. We establish a fabrication process with the mixing of electronic ink, loading of this ink, electronic ink assembly, packaging and driving. Also, we discuss an operating principle of this panel and the induced image reversal phenomenon by electric field area of the lower electrodes. This phenomenon is not occurred for the panel having $10{\mu}m$ electrode space. By this pixelation structure like this three-electronic paper display, a single color realization without color filter is possible and various kind of color is defined by a dye selection for charged particles and electrically neutral fluid.