• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.958-962
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• 2002

This paper reports on the fabrication of free-standing microstructures by DRIE (deep reactive ion etching). SOI (Si-on-insulator) structures with buried cavities are fabricated by SDB (Si-wafer direct bonding) technology and electrochemical etch-stop. The cavity was formed the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the formed cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing (100$0^{\circ}C$, 60 min.), the SDB SOI structure with a accurate thickness and a good roughness was thinned by electrochemical etch-stop in TMAH solution. Finally, it was fabricated free-standing microstructures by DRIE. This result indicates that the fabrication technology of free-standing microstructures by combination SDB, electrochemical etch-stop and DRIE provides a powerful and versatile alternative process for high-performance bulk micromachining in MEMS fields.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.23-24
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• 2011

• Journal of the Korean Society for Precision Engineering
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• v.30 no.6
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• pp.638-643
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• 2013

Laser beam machining (LBM) is fast, contactless and able to machine various materials. So it is used to cut metal, drill holes, weld or pattern the imprinted surface. However, after LBM, there still leave burrs and recast layers around the machined area. In order to remove these unwanted parts, LBM process often uses electrochemical etching (ECE). But, the total thickness of workpiece is reduced because the etching process removes not only burrs and recast layers, but also the entire surface. In this paper, surface coating was performed using enamel after LBM on metal. The recast layer can be selectively removed without decreasing total thickness. Comparing with LBM process only, the surface quality of enamel coating process was better than that. And edge shape was also maintained after ECE.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1888-1891
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• 2003

In this paper, we proposed a new method to control the length of carbon nano tube in the single CNT probe. A single CNT probe was composed of a tungsten tip made by the electrochemical etching and carbon nano tube which was grown by CVD and prepared through the sonication. The two components were attached with the carbon tape. Since the length of CNT can not be controlled during the manufacturing, the post process is needed to shorten the CNT. In this paper, we proposed the method of electrochemical process. The process was done under the optical microscope and the results were checked by SEM. The diameter of the carbon nano tube used in this paper was about 130nm because the above process had to be done with the optical microscope. Using the method proposed in this paper, we can control the length of the nano tube tip.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.145-150
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• 2000

Micro punching is one of general methods to fabricate simple holes such as permanent ink-jet printer nozzles. A thin punch, that is need for micro punching, usually has been obtained by mechanical machining. There are some method to obtain a thin punch from a cylindrical rod, e.g., microgrinding and WEDG (Wire Electro-Discharge Grinding). Inefficiently, only one punch can be obtained from these machining methods. In contrast with these methods, many punches can be fabricated simultaneously by electrochemical process. Electrochemical process has usually aimed to obtain very sharp probe for atomic force microscopy (AFM) or scanning tunneling microscopy (STM), and it has not been considered the whole shape of a probe in spite of good merits. In this paper, an ultrathin punch with a tapered shape and a cylindrical tip is newly fabricated by electrochemical process.

• Journal of Environmental Science International
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• v.22 no.9
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• pp.1073-1078
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• 2013

This paper presents the results of the electrochemical treatment of chemical oxygen demand(COD) and total nitrogen(T-N) compounds in the wastewater generated from flue gas desulfurization process by using a lab-scale electrolyzer. With the increase in the applied current from 0.6 Ah/L to 1.2 Ah/L, the COD removal efficiency rapidly increases from 74.5% to 96%, and the T-N removal efficiency slightly increases from 37.2% to 44.9%. Therefore, it is expected that an electrochemical treatment technique will be able to decrease the amount of chemicals used for reducing the COD and T-N in wastewater of the desulfurization process compared to the conventional chemical treatment technique.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.515-520
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• 2005

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. Also CMP process got into key process for global planarization in the chip manufacturing process. In this study, potentiodynamic polarization was carried out to investigate the influences of $H_2O_2$ concentration and metal oxide formation through the passivation on tungsten and titanium. Fortunately, the electrochemical behaviors of tungsten and titanium are similar, an one may expect. As an experimental result, electrochemical corrosion of the $5\;vol\%\;H_2O_2$ concentration of tungsten and titanium films was higher than the other concentrations. According to the analysis, the oxidation state and microstructure of surface layer were strongly influenced by different oxidizer concentration. Moreover, the oxidation kinetics and resulting chemical state of oxide layer played critical roles in determining the overall CMP performance. Therefore, we conclude that the CMP characteristics tungsten and titanium metal layer including surface roughness were strongly dependent on the amounts of hydrogen peroxide oxidizer.

• Journal of Korean Society on Water Environment
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• v.22 no.5
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• pp.851-855
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• 2006

The aim of this study was to investigate characteristics of formation of mixed oxidants and some aspects of the performance of electrochemical process as an alternative disinfection strategy for water purification. The study of electrochemical process has shown free chlorine to be produced, but smaller amounts of stronger oxidants, such as ozone, hydrogen peroxide and OH radicals, were also generated. The formation of ozone and hydrogen peroxide increased with increasing electric conductivity, but was limited at conductivities greater than 0.6 mS/cm. Also, formation of OH radical was enhanced as electric conductivity was increased to 0.9 mS/cm and The stead-state concentrations of OH radical were calculated at $1.1{\sim}6.4{\times}10^{-14}M$. Using E. coti, inactivation kinetic studies were performed. With the exception of free chlorine, the role of mixed oxidants, especially OH radical, was investigated for enhancement of the inactivation rate.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• Journal of the Korean institute of surface engineering
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• v.56 no.4
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• pp.250-258
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• 2023

Ceramic oxide layer was formed on the surface of high silicon aluminum alloy by using PEO (plasma electrolytic oxidation) process. The microstructure of the oxide layer was analyzed using scanning electron microscopy (SEM) and x-ray diffraction patterns (XRD). The high silicon aluminum alloy prior to PEO process consists of Al, Si and Al₂Cu phases in XRD analysis, whereas Al₂Cu phase selectively disappeared after PEO treatment. Considerable decrease of relative intensity in most of peaks in XRD results of the high silicon aluminum alloy treated by PEO process was observed. It may be attributed to the formation of amorphous phases after PEO treatment. The corrosion behavior of the high silicon aluminum alloy treated by PEO process was investigated using electrochemical impedance spectroscopy (EIS) and other electrochemical techniques (i.e., open circuit potential and polarization curve). Electroanalytical studies indicated that the high silicon aluminum alloy treated by PEO process shows greater corrosion resistance than that untreated by PEO process.