• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1219_1220
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• 2009

In recent years, the companies of electric power equipment for MV, HV class trend to develop that the eco-friendly insulated(solid, eco-gas, air etc.) switchgear replace with existent SF6 gas insulated switchgear by environmental problems such as global warming and soon. This paper introduces the Solid Insulated Switchgear(SIS) which is the epoxy of eco-friendly insulation material. The characteristic of SIS to introduce in this paper is as following. 1) Eco-friendly. (SF6 gas free) 2) The structure of flexible system. (Expansion) 3) The optimum design. (The Analysis of electrical & mechanical) 4) An Interface treatment between epoxy and insert. (Molding technology) This paper described about some technology for development of SIS.

• 한국자동차공학회논문집
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• 제15권2호
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• pp.101-108
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• 2007

This paper presents an efficient meshless method for analyzing cracked piezoelectric structures subjected to mechanical and electrical loading. The method employs an element free Galerkin (EFG) formulation and an enriched basic function as well as special shape functions that contain discontinuous derivatives. Based on the moving least squares (MLS) interpolation approach, The EFG method is one of the promising methods for dealing with problems involving progressive crack growth. Since the method is meshless and no element connectivity data are needed, the burdensome remeshing procedure required in the conventional finite element method (FEM) is avoided. The numerical results show that the proposed method yields an accurate near-tip stress field in an infinite piezoelectric plate containing an interior hole. Another example is to study a ceramic multilayer actuator. The proposed model was found to be accurate in the simulation of stress and electric field concentrations due to the abrupt end of an internal electrode.

• Structural Engineering and Mechanics
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• 제83권3호
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• pp.293-304
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• 2022

In this work, a novel reliability approach for combined high and low cycle fatigue (CCF) estimation is developed by combining active learning strategy with least squares support vector machines (LS-SVM) (named as ALS-SVM) surrogate model to address the multi-resources uncertainties, including working loads, material properties and model itself. Initially, a new active learner function combining LS-SVM approach with Monte Carlo simulation (MCS) is presented to improve computational efficiency with fewer calls to the performance function. To consider the uncertainty of surrogate model at candidate sample points, the learning function employs k-fold cross validation method and introduces the predicted variance to sequentially select sampling. Following that, low cycle fatigue (LCF) loads and high cycle fatigue (HCF) loads are firstly estimated based on the training samples extracted from finite element (FE) simulations, and their simulated responses together with the sample points of model parameters in Coffin-Manson formula are selected as the MC samples to establish ALS-SVM model. In this analysis, the MC samples are substituted to predict the CCF reliability of turbine blades by using the built ALS-SVM model. Through the comparison of the two approaches, it is indicated that the reliability model by linear cumulative damage rule provides a non-conservative result compared with that by the proposed one. In addition, the results demonstrate that ALS-SVM is an effective analysis method holding high computational efficiency with small training samples to gain accurate fatigue reliability.

• 항공우주시스템공학회지
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• 제10권2호
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• 한국소음진동공학회논문집
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• 제19권12호
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• pp.1347-1355
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• 2009

This paper demonstrates the validity of spectral element analysis for modeling the high-frequency dynamic behaviors of a beam with a surface-bonded piezoelectric wafer through a laboratory test. In the spectral element analysis, the high-frequency electro-mechanical interaction can be considered properly with relatively low computational cost compared to the finite element analysis. In the verification test, a cantilever beam with a surface-bonded piezoelectric wafer is forced to be in steady-state motion by exerting the harmonic driving voltage signal on the piezoelectric wafer. A laser scanning vibrometer is used to obtain the overall dynamic responses of the structure such as resonance frequencies, the associated mode shapes, and frequency response functions up to 20 kHz. Then, these dynamic responses from the test are compared to those computed by the spectral element analysis. A two-dimensional finite analysis is conducted to obtain the asymptotic solutions for the comparison purpose as well.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.531-532
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• 2009

• Steel and Composite Structures
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• 제20권3호
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• pp.513-543
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• 2016

Third order shear deformation theory is used to evaluate electro-elastic solution of a sandwich plate with considering functionally graded (FG) core and composite face sheets made of piezoelectric layers. The plate is resting on the Pasternak foundation and subjected to normal pressure. Short circuited condition is applied on the top and bottom of piezoelectric layers. The governing differential equations of the system can be derived using Hamilton's principle and Maxwell's equation. The Navier's type solution for a sandwich rectangular thick plate with all edges simply supported is used. The numerical results are presented in terms of varying the parameters of the problem such as two elastic foundation parameters, thickness ratio ($h_p/2h$), and power law index on the dimensionless deflection, critical buckling load, electric potential function, and the natural frequency of sandwich rectangular thick plate. The results show that the dimensionless natural frequency and critical buckling load diminish with an increase in the power law index, and vice versa for dimensionless deflection and electrical potential function, because of the sandwich thick plate with considering FG core becomes more flexible; while these results are reverse for thickness ratio.

• Journal of Magnetics
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• 제19권3호
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• pp.309-313
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• 2014

This paper presents an eddy current loss analysis of a Mechanical Fixation (MF) made of 6061 aluminum alloy, which is used for an NS type double-rotor single-stator axial flux permanent magnet machine. The prototype MF made of aluminum alloy shows good mechanical performance, but poor electro-magnetic performance, since the machine's efficiency can decrease because of eddy current loss in the MF. In order to prevent efficiency decrease, a modification of the MF structure is also introduced. Three-dimensional finite element analysis (FEA) is used for magnetic field analysis, and eddy current losses are computed. The analysis results are compared to, and verified by the test results.

• 비파괴검사학회지
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• 제25권5호
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• pp.368-376
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• 2005

자동차용 냉각기 호스는 열과 기계적 하중 하에서 공기와 부동액의 접촉 스트레스로 인해 노화와 고장이 일어날 수 있다. 본 연구에서는 냉각기 호스재료인 EPDM(ethylene-propylene diene monomer)고무에 대해 열가속 및 산소 스트레스, 전기화학적 스트레스에 의한 표피층의 노화거동을 비파괴 평가하였다. 열가속 및 산소노화 시험결과 신장률의 저하와 함께 IRHD(International Rubber Hardness Degrees)경도가 증가하였다. 전기화학적 노화(electro-chemical degradation: ECD) 시험에서는 에틸렌글리콜 수용액의 침투로 인해 무게가 증가하였으며 신장률과 경도는 크게 저하되었다 또한 에틸렌글리콜 수용액이 표피층뿐만이 아니라 내부에까지 침투하여 고무내부구조와 미크로경도분포가 깊이에 따라 변화되었다. 즉, 열가속 및 산소노화와 ECD 노화는 미크로 경도와 화학구조분석에 의해 비파괴적 특성 평가가 가능함을 보였다.

• 한국산학기술학회논문지
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• 제11권4호
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• pp.1210-1215
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• 2010

프로브 카드는 반도체 제조 공정 전에 반도체 소자 및 필름의 기능과 성능을 검사하기 위한 테스트 장비이다. 반도체 산업의 급속한 기술 발전과 반도체 소자의 고집적화로 인하여 반도체 소자의 패드 간격과 패드의 수가 증가하고 있다. 따라서 반도체 소자의 크기 및 배열의 형태가 계속 축소됨에 따라 미세 피치를 갖고 검사용 핀의 수가 많은 프로브 카드가 필요하다. 본 논문에서는 수직형 프로브 카드의 적용을 위하여 MEMS 기술을 이용한 프로브 팁을 개발하였다. 프로브 팁의 설계를 위해서 유한요소해석을 이용하여 프로브 팁의 구조 및 기계적 특성에 대한 구조설계를 수행하였다. 또한 구조 설계를 적용한 프로브 팁을 제작하여 유한요소해석의 결과와 실제 시험을 통한 접촉력의 평가를 수행하였다. 이에 따라 피치 간격이 약 $50{\mu}m$이하의 프로브 카드를 제작하였다.