• 제목/요약/키워드: Electro-Deposition Coating

검색결과 44건 처리시간 0.098초

정전압에 따른 클린룸 벽체에서의 입자침착 특성 (Characteristics of Particle Deposition onto the Cleanroom Wall Panel with Electrostatic Voltages)

  • 노광철;손영태;김종준;오명도
    • 설비공학논문집
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    • 제18권12호
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    • pp.1033-1038
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    • 2006
  • We carried out the experiments on particle deposition onto the cleanroom wall panels. And then we investigated the particle deposition characteristic coefficients for electrostatic voltages and particle size. It was found that there is little difference in characteristics of the particle deposition between the steel panel and the anti-static coating panel. In case of that the particle size is under $1.0{\mu}m$, the particle deposition characteristic coefficient becomes larger as the electrostatic voltage induced to the cleanroom wall panel is increasing. Where in case of that the particle size is over $3.0{\mu}m$, the particle deposition characteristic coefficients do not show any differences with the electrostatic voltages. It is due to that the electrostatic force is the major particle transport mechanism for submicron particles, while the gravitational settling is the major particle transport mechanism for overmicron particles when the electro-static voltages are induced to the cleanroom wall panel.

열교환기에서 부식이 열전달에 미치는 영향에 관한 연구 (A Study of The Effect of Corrosion on Heat Transfer in a Heat Exchanger)

  • 권현민;권정태
    • 한국산학기술학회논문지
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    • 제20권9호
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    • pp.227-232
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    • 2019
  • 심층수와 표층수의 온도 차이를 이용하는 히트펌프 시스템이나 해수열원 발전시스템(OTEC)의 열교환기는 해수의 염분에 의하여 발생하는 열교환기의 표면 위에서의 부식 현상에 의하여 열전달 성능이 저하된다. 본 연구는 이중관식 열교환기 실험을 통하여 부식시간에 따른 열전달저하를 실험하고 분석한 내용을 제시한다. 이러한 연구는 고가의 티타늄 열교환기를 대체하기 위하여 알루미늄에 전착 코팅을 하여 제작된 코팅 관을 통해 수행되었다. 코팅 두께 10, 15, $20{\mu}m$의 알루미늄 관 및 티타늄 관을 각각 6주, 12주, 18주씩 가속 부식시킨 후에 이중관 열교환기 실험을 통하여 코팅 두께 및 부식 시간에 따른 열전달의 변화를 측정하고 분석하였다. 코팅이 얇을수록 더 빠르게 블리스터 현상이 발생하였다. $15{\mu}m$의 코팅 관의 경우 12주 부식까지는 좋은 열전달 성능을 보였으나, 18주 부식의 경우에서 열전달 성능의 감소를 보였다. 연구결과로부터 본 실험 조건에서는 $20{\mu}m$의 두께로 코팅된 알루미늄관이 티타늄을 대체할 수 있는 열전달 성능을 가질 수 있음을 확인하였다. 또한, 부식 시간에 따른 부식 열저항의 증가에 대한 고찰을 통하여 향후 부식 열저항 모델 개발의 방법론을 제시하였다.

ESD 기법을 이용한 투명전도막 형성 기술 (Transparent Electrode Forming Technology using ESD Coating Methode)

  • 김정수;김동수
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 추계학술대회 논문집
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    • pp.348-348
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    • 2009
  • The conductive coating method is used for various industrial fields. For example, Sputtering process is used to coat ITO layer in LCD or OLED panel manufacture process and fabricate a base layer of substrate of an electric printing device. However, conventional coating processes (beam sputtering, spin coating etc.) has a problems in the industrial manufacturing process. These processes have a very high cost and critical manufacturing environment as a vacuum process. Recently, many researchers have proposed various printing process instead of conventional coating processes. In this paper, we propose an ESD printing process in ITO coating layer and apply to fabricate a conductive coating film. Furthermore, the effect of the nozzle and also the applied voltage on different configuration of the nozzle head was also studied for better understanding of the Electro Static deposition process.

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Ni-Al2O3 복합코팅의 마이크로 경도에 대한 공정변수의 영향 (Effect of Process Parameters on Microhardness of Ni-Al2O3 Composite Coatings)

  • 진영준
    • 한국산업융합학회 논문집
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    • 제25권6_2호
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    • pp.1037-1045
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    • 2022
  • In this study, nanoscale Al2O3 ceramic particles were used due its exceptionally high hardness characteristics, chemical stability, and wear resistance properties. These nanoparticles will be used to investigate the optimal process conditions for the electro co-deposition of the Ni-Al2O3 composite coatings. A Watts bath electrolytic solution of a controlled composition along with a fixed agitation speed was used for this study. Whereas the current density, the pH value, temperature and concentration of the nano Al2O3 particles of the electrolyte were designated as the manipulative variables. The experimental design method was based on the orthogonal array to find the optimum processing parameters for the electro co-deposition of Ni-Al2O3 composite coatings. The result of confirmation experimental based on the optimal processing condition through the analysis of variance ; EDX analysis found that the ratio of alumina increased to 8.65 wt.% and subsequently the overall hardness increased to 983 Hv. Specially, alumina were evenly distributed on Nickel matrix and particles were embedded more firmly and finely in Nickel matrix.

정전분무법으로 제작된 열경화성 Phenol-formaldehyde resin 코팅층의 1차원적 미세구조 형성 메카니즘 (1-D Microstructure Evolution of Electrostatic Sprayed Thermosetting Phenol-formaldehyde Resin Coating)

  • 김백현;배현정;고유민;권도균
    • 한국재료학회지
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    • 제26권9호
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    • pp.472-477
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    • 2016
  • Microstructure evolutions of thermosetting resin coating layers fabricated by electrostatic spray deposition (ESD) at various processing conditions were investigated. Two different typical polymer systems, a thermosetting phenol-formaldehyde resin and a thermoplastic polyvinylpyrrolidone (PVP), were employed for a comparative study. Precursor solutions of the phenol-formaldehyde resin and of the PVP were electro-sprayed on heated silicon substrates. Fundamental differences in the thermomechanical properties of the polymers resulted in distinct ways of microstructure evolution of the electro-sprayed polymer films. For the thermosetting polymer, phenol-formaldehyde resin, vertically aligned micro-rod structures developed when it was deposited by ESD under controlled processing conditions. Through extensive microstructure and thermal analyses, it was found that the vertically aligned micro-rod structures of phenol-formaldehyde resin were formed as a result of the rheological behavior of the thermosetting phenol-formaldehyde resin and the preferential landing phenomenon of the ESD method.

Magnetron Sputter Coating of Inner Surface of 1-inch Diameter Tube

  • Han, Seung-Hee;An, Se-Hoon;Song, In-Seol;Lee, Keun-Hyuk;Jang, Seong-Woo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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    • pp.135-135
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    • 2015
  • Tubes are of extreme importance in industries as for fluid channels or wave guides. Furthermore, some weapon systems such as cannons use the tubes as gun barrels. To increase the service life of such tubes, a protective coating must be applied to the tubes' inner surface. However, the coating methods applicable to the inner surface of the tubes are very limited due to the geometrical restriction. A small-diameter cylindrical magnetron sputtering gun can be used to deposit coating layers on the inner surface of the large-bore tubes. However, for small-bore tubes with the inner diameter of one inch (~25 mm), the magnetron sputtering method can hardly be accommodated due to the space limitation for permanent magnet assembly. In this study, a new approach to coat the inner surface of small-bore tubes with the inside diameter of one inch was developed. Instead of using permanent magnets for magnetron operation, an external electro-magnet assembly was adopted around the tube to confine the plasma and to sustain the discharge. The electro-magnet was operated in pulse mode to provide the strong axial magnetic field for the magnetron operation, which was synchronized with the negative high-voltage pulse applied to the water-cooled coaxial sputtering target installed inside the tube. By moving the electro-magnet assembly along the tube's axial direction, the inner surface of the tube could be uniformly coated. The inner-surface coating system in this study used the tube itself as the vacuum chamber. The SS-304 tube's inner diameter was 22 mm and the length was ~1 m. A water-cooled Cu tube (sputtering target) of the outer diameter of 12 mm was installed inside of the SS tube (substrate) at the axial position. The 50 mm-long electro-magnet assembly was fed by a current pulse of 250 A at the frequency and pulse width of 100 Hz and 100 usec, respectively. The calculated axial magnetic field strength at the center was ~0.6 Tesla. The central Cu tube was synchronously driven by a HiPIMS power supply at the same frequency of 100 Hz as the electro-magnet and the applied pulse voltage was -1200 V with a pulse width of 500 usec. At 150 mTorr of Ar pressure, the Cu deposition rate of ~10 nm/min could be obtained. In this talk, a new method to sputter coat the inner surface of small-bore tubes would be presented and discussed, which might have broad industrial and military application areas.

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ESD 스프레이를 이용한 OPV 제작 기법 (Fabrication Method of OPV using ESD Spray Coating)

  • 김정수;조정대;김동수
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.84.2-84.2
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    • 2010
  • PEMS (printed electro-mechanical system) is fabricated by means of various printing technologies. Passive and active components in 2D or 3D such as conducting lines, resistors, capacitors, inductors and TFT, which are printed with functional materials, can be classified in this category. And the issue of PEMS is applied to a R2R process in the manufacturing process. In many electro-devices, the vacuum process is used as the manufacturing process. However, the vacuum process has a problem: it is difficult to apply toa continuous process as a R2R printing process. In this paper, we propose an ESD (electro static deposition) printing process has been used to apply an organic solar cell of thin film forming. ESD is a method of liquid atomization by electrical forces, anelectrostatic atomizer sprays micro-drops from the solution injected into the capillary, with electrostatic force generated by electric potential of about tens of kV. ESD method is usable in the thin film coating process of organic materials and continuous process as a R2R manufacturing process. Therefore, we experiment the thin films forming of PEDOT:PSS layer and Active layer which consist of the P3HT:PCBM. The result of experiment, organic solar cell using ESD thin film coated method is occurred efficiency of about 1.4%. Also, the case of only used to ESD method in the active layer coating is occurred efficiency of about 1.86% as the applying a spin coating in the PEDOT:PSS layer. We can expect that ESD method is possible for continuous process to manufacture in the organic solar cell or OLED device.

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Sn-modified Platinized Ti 전극 제조를 위한 Ti의 백금 도금 특성 (Characteristics of Ti Platinization for Fabrication Sn-modified Platinized Ti Electrode)

  • 김광욱;김성민;이일희
    • Korean Chemical Engineering Research
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    • 제45권2호
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    • pp.124-132
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    • 2007
  • 본 논문에서는 Ti 모재에 대한 Pt 도금 특성 연구를 통하여 안정한 platinized Ti 전극의 제조 방법이 제시되었으며, Sn이 흡착된 platinized Ti 전극의 질산염 이온에 대한 전기화학적 특성이 연구되었다. 에칭된 Ti 모재 표면에 전착된 Pt 도금 층 내에 적당하게 공간적 틈을 갖도록 도금하는 것은 도금 후 표면에 잔존하는 도금 용액 오염원을 제거하는데 효과적이며, 또 용액과 접하게 되는 전극의 실제 표면적을 최대화할 수 있었다. 제작된 platinized Ti 전극을 끓이는 과정과 전해 세정 과정을 통해 안정적이며 재현성 있게 만드는 것은 Sn-modified platinized Ti 전극에서 표면의 Sn 덮힘율을 정량화하는데 있어 매우 중요하였다. 전해 세정 과정은 전극 표면에 형성된 솜털과 같은 미세한 돌기들이 없어지면서 전극 표면을 안정화된 구조로 변화시켰다. 본 연구의 경우 질산염 이온의 환원을 목적으로 하는 Sn-modified platinized Ti 전극은 약 30분 도금 시간을 통해 제조한 경우가 가장 좋았다.

Syntheses of Cu-In-Ga-Se/S nano particles and inks for solar cell applications

  • Jung, Duk-Young
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.295-295
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    • 2010
  • Nanoparticles of the compound semiconductor, Cu(In, Ga)Se2 (CIGS), were synthesized in solution under ambient pressure below $100^{\circ}C$ and characterized by powder X-ray diffraction (XRD), scanning electron microscopy (SEM), optical absorption spectroscopy and energy-dispersive X-ray (EDX) analyses. These materials have chalcopyrite crystal structures and the particle sizes less than 100 nm. Synthetic conditions were studied for the crystallized CIGS nanoparticles formation to prevent from side products of Cu2Se, Cu2-xSe, and CuSe etc. The single phase CIGS nanoparticles were applied to coating of thin films photovoltaic cells. The electro deposition of CIGS thin films is also a good non-vacuum technology and under investigation. In aqueous solutions, the different chemical compositions of CIGS thin films were obtained, depending on pH, concentration of starting materials and deposition potentials. The surface morphology of the prepared CIGS thin films depends on the complexing ligands to the solutions during the electrochemical deposition.

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