• 제목/요약/키워드: Electro-Chemical Process

검색결과 173건 처리시간 0.034초

Hyper Functionalized Nanoparticle Technology and their Applications

  • Lee, Sun-Jong;Jung, Yeon-Jae;Lee, Jung-Min;Lee, Jun-Young;Kim, Jung-Hyun
    • 한국고분자학회:학술대회논문집
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    • 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
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    • pp.83-84
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    • 2006
  • In aqueous phase, we directly prepared conducting and photoluminescent nano-structured particles by oxidation polymerization. Thiophene(PT) was initiated by $FeCl_{3}/H_{2}O_{2}$ (catalyst/oxidant) combination system. And, polydispersed core-shell poly(styrene/thiophene) and polyaniline(PANI)-coated multi core-shell polystyrene latex particles were successfully prepared by oxidative and radical polymerization. The resulting latex particles have fine improved luminescence and conductive efficiency and dispersion state due to the PT and PANI shell. Hyper functionalized nanoparticle would be expected to increase the processibility in various electrical and electro-optical fields.

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Treatment of High Concentration Organic Wastewater with a Sequencing Batch Reactor (SBR) Process Combined with Electro-flotation as a Solids-liquid Separation Method

  • Choi, Younggyun;Park, Minjeong;Park, Mincheol;Kim, Sunghong
    • Environmental Engineering Research
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    • 제19권4호
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    • pp.395-399
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    • 2014
  • Operation characteristics of the sequencing batch reactor (SBR) process with electro-flotation (EF) as a solid liquid separation method (EF-SBR) were investigated. EF-SBR process showed excellent solid-liquid separation performance which enabled to separate biosolids from liquid phase within 30 min and to extend cyclic reaction time. Although influent organic loading rate was increased stepwise from 5 to 15 g COD/day, food to microorganisms (F/M) ratio could be maintained about 0.3 g COD/g VSS/day in EF-SBR because biomass concentration could be easily controlled at desired level by EF. However, it was impossible to increase biomass concentration at the same level in control SBR (C-SBR) process because solid-liquid separation by gravity settling showed a limitation at higher mixed liquor suspended solids (MLSS) concentration with 60 min of settling time. Total chemical oxygen demand (TCOD) removal efficiency of EF-SBR process was not decreased although influent organic loading rate became 3 times higher than initial value. However, it was seriously deteriorated in C-SBR process after increasing the rate over 10 g COD/day, which was accounted for insufficient organic removal by relatively higher food to microorganisms (F/M) ratio as well as biosolids wash-out by a limitation of gravity sedimentation.

전기 펜톤-유사 반응을 이용한 Rhodamine B의 색 제거 (Decolorization of Rhodamine B by Electro Fenton-like Reaction)

  • 김동석;박영식
    • 한국환경과학회지
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    • 제17권1호
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    • pp.37-44
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    • 2008
  • The electro-chemical decolorization of Rhodamine B (RhB) in water has been carried out by electro Fenton-like process. The effect of distance, material and shape of electrode, NaCl concentration, current, electric power, $H_2O_2$ and pH have been studied. The results obtained that decrease of RhB concentration of Fe(+)-Fe(-) electrode system was higher than that of other electrode system. The decrease of RhB concentration was not affected electrode distance and shape. Decolorization of electro Fenton-like reaction, which was added $H_2O_2$ onto the electrolysis using electrode was higher than electrolysis. Addition of NaCl decreased the electric consumption. The lower pH is, the faster initial reaction rate and reaction termination time observed.

Synthesis of Gold Nanoparticles by Electro-reduction Method and Their Application as an Electro-hyperthermia System

  • Yoon, Young Il;Kim, Kwang-Soo;Kwon, Yong-Soo;Cho, Hee-Sang;Lee, Hak Jong;Yoon, Chang-Jin;Yoon, Tae-Jong
    • Bulletin of the Korean Chemical Society
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    • 제35권6호
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    • pp.1806-1808
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    • 2014
  • We report the successful preparation of gold nanoparticles (Au NPs) using a novel electroreduction process, which is simple, fast, and environmentally friendly (toxic chemicals such as strong reducing agents are not required). Our process allows for the mass production of Au NPs and adequate particle size control. The Au NPs prepared show high biocompatibility and are non-toxic to healthy human cells. By applying radio-frequency (RF) ablation, we monitored the electro-hyperthermia effect of the Au NPs at different RFs. The Au NPs exhibit a fast increase in temperature to $55^{\circ}C$ within 5 min during the application of an RF of 13 MHz. This temperature rise is sufficient to promote apoptosis through thermal stress. Our work suggests that the selective Au NP-mediated electro-hyperthermia therapy for tumor cells under an RF of 13 MHz has great potential as a clinical treatment for specific tumor ablation.

고분자 이온교환막의 제조와 이온교환막을 이용한 에너지 공정 (The Fabrication of Ion Exchange Membrane and Its Application to Energy Systems)

  • 김재훈;류승보;문승현
    • 멤브레인
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    • 제30권2호
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    • pp.79-96
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    • 2020
  • 환경오염과 화석연료의 문제로 인한 2차 에너지 변환 및 저장 장치의 개발이 활발하게 진행되고 있다. 이러한 에너지 변환장치들은 전기화학적 시스템을 기본으로 운영되고 있으며 이온교환막은 각 공정의 성능을 결정짓는 중요한 요소이다. 따라서 에너지 시스템의 효율 증대 및 성능 향상을 위해서는 적합한 물성을 갖는 이온교환막 개발이 필요하다. 이러한 이온교환막은 크게 양이온교환막, 음이온교환막, 바이폴라막으로 분류되고 있으며, 이들 막들은 화학적, 물리적, 형태학적 특성에 따라 다양한 용도을 갖고 있다. 본 총설에서는 이온교환막의 주요한 특징과 함께 이들의 제조 방법에 대해 기술했다. 이어서 이온교환막을 이용하여 최근 개발되고 있는 전기화학 시스템에 기반을 둔 역전기 투석, 레독스 흐름 전지, 수전해 공정에 대해서 소개하고, 각 에너지 공정에서 이온교환막이 갖는 역할과 조건에 대해서 설명하였다.

반도체 구리 배선공정에서 표면 전처리가 이후 구리 전해/무전해 전착 박막에 미치는 영향 (Effect of Surface Pretreatment on Film Properties Deposited by Electro-/Electroless Deposition in Cu Interconnection)

  • 임태호;김재정
    • 전기화학회지
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    • 제20권1호
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    • pp.1-6
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    • 2017
  • 본 연구에서는 구리 배선 공정에서 구리 씨앗층 표면에 형성되는 구리 자연산화물을 제거하는 표면 전처리가 후속 구리 전착에 미치는 영향을 살펴보았다. 구리 배선 공정의 화학적 기계적 연마 공정에서 사용하는 citric acid 기반의 용액을 구리 표면 전처리 과정에 적용하여 표면에 존재하는 구리 자연 산화물을 제거하였고, 용액 조성 변화를 통해 산화물 제거의 선택성을 높여 구리 씨앗층의 손실을 최소화하였다. 또한 표면 전처리 후 구리 전해 전착과 무전해 전착을 시도하여 전착한 박막의 비저항, 표면 거칠기 등의 성질을 비교하고, 이를 통해 선택적으로 구리 산화물을 제거한 이후에 전착된 박막의 비저항과 표면 거칠기가 가장 낮게 나타남을 확인하였다.

도전성 탄성공구를 이용한 금형연마 특성에 관한 연구 (A Study on Characteristics of Die Finishing Using Conductive Elastic Tool)

  • 황찬해;임동재;정해도
    • 한국정밀공학회지
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    • 제17권6호
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    • pp.96-102
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    • 2000
  • The finishing process for dies and molds is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But the research about tooling system is not enough and finishing tool must have high machining efficiency and adaptability of curved surface. So, this study investigated the application of conductive elastic tool which is composed of metal-resin bonded pellet and elastic backing material. The metal-resin bonded pellet is used to finish the surface by conventional mechanical grinding or electro-chemial grinding method. And elastic backing material is used to follow the curved surface. So conductive elastic tool has long lifetime, uniform removal rate and adaptability of curved surface.

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용액성장법에서 자외선 조사를 이용한 CdS의 산소함량 제어 (Oxygen Control in CdS Thin Film by UV Illumination in Chemical Bath Deposition)

  • 백현지;오지아;서영은;신혜진;조성욱;전찬욱
    • Current Photovoltaic Research
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    • 제7권2호
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    • pp.33-37
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    • 2019
  • In this paper, we compared the performance of $Cu(In,Ga)(S,Se)_2$ (CIGSSe) thin film solar cell with CdS buffer layer deposited by irradiating 365 nm UV light with 8 W power in Chemcial Bath Deposition (CBD) process. The effects of UV light irradiation on the thin film deposition mechanism during CBD-CdS thin film deposition were investigated through chemical and electro-optical studies. If the UV light is irradiated during the solution process, the hydrolysis of Thiourea is promoted even during the same time, thereby inhibiting the formation of the intermediate products developed in the reaction pathway and decreasing the pH of the solution. As a result, it is suggested that the efficiency of the CdS/CIGSSe solar cell is increased because the ratio of the S element in the CdS thin film increases and the proportion of the O element decreases. This is a very simple and effective approach to control the S/O ratio of the CdS thin film by the CBD process without artificially controlling the process temperature, solution pH or concentration.

적혈구의 산란빔 측정과 마이크로 세포 분석 바이오칩 제작 (The Scattering Beam Measurement of the RBC and the Fabrication of the Micro Cell Biochip)

  • 변인수;권기진;이준하
    • 한국의학물리학회지:의학물리
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    • 제25권2호
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    • pp.116-121
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    • 2014
  • 본 본문은 Bio-MEMS 공정으로 제작한 마이크로 세포 분석 바이오칩을 사용하여 적혈구의 광학적 특성을 전압으로 측정한 실험이다. Bio-MEMS 공정을 이용하여 세포의 원활한 이동과 측정 분석에 사용되는 글라스에 채널 패턴 에칭을 위하여 포토리소그래피(photolithography)와 산화완충식각(BOE: buffered oxide etchant) 공정 조건, 세포 분석과 정보 전달에 사용되는 광섬유의 에칭을 위하여 산화완충식각 공정 조건, 세포나 유체를 칩과 외부의 전달 등에 사용되는 글라스의 홀을 위하여 전기화학방전(ECD: electro chemical discharge) 공정 조건, 글라스 접합을 위한 자외선반응접합(UVSA: ultraviolet sensitive adhesives) 공정 조건을 정립하였다. 또한 유체나 세포의 흐름 제어를 위한 라미나 흐름 조건, 적혈구세포에 대한 산란빔 파형을 측정하였다. 적혈구 실험을 통하여 출력 광섬유의 각도에 따른 산란빔이 출력측의 광섬유각도가 $0^{\circ}$일 때 약 17 V, 각도가 $5^{\circ}$일 때 약 10 V, 각도가 $10^{\circ}$일 때 약 6 V, 각도가 $15^{\circ}$일 때 약 4 V의 전압(Vpp)으로 측정되었다. 따라서 마이크로 세포 분석 바이오칩 제작의 소형화, 단순화, 공정신간 단축, 정량화하였고 적혈구의 광학적 특성을 측정을 측정함으로써 의공학(biomedical), 바이오칩공학(biochip), 반도체공학(semiconductor), 생물정보학(bioinformatics) 등의 응용과학 분야 발전에 기여할 것으로 기대한다.

Studies for ENIG surface behavior of FCBGA through the time by using water dip test method

  • Shin, An-Seob;Kim, Jeom-Sik;Ok, Dae-Yool;Jeong, Gi-Ho;Park, Chang-Sik;Heo, Cheol-Ho;Lee, Kum-Ro
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.412-412
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    • 2008
  • ENIG(Electroless Nickel Immersion Gold)is a surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. ENIG has good diffusion barrier of Ni against solder and good wettability due to Au finish. But when the discoloration occurred on the Au finish of ENIG, some key characteristics related to the quality and reliability of PCB such as bondability, solderability and electrical flowing of packaging process could be deteriorated. In this paper, we have performed the water dip test ($88^{\circ}C$ purified water) which accelerates the galvanic corrosion of Ni diffused from the Ni-P layer. That is, the excessive oxidation of the Ni layer could result in non-wetting of the solder because the flux may not be able to remove excessive oxides. Though Au discoloration have been reported to be caused by Ni oxides in many literature, it is still open to verify and discuss The microstructures and chemical compositions have been investigated using FE-SEM, TEM, FIB, EDS and XPS. As a result, authors have found that the Au discoloration in ENIG type is severely caused by the oxidation of the Ni and the mechanism of Au discoloration can be confirmed through the experiment result of water dip test.

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