• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.133-134
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• 2008

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.261-266
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• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.3
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• pp.571-576
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• 2007

In this paper, we have investigated chemical, mechanical and structural properties by changing the content of carbon nanotube, Which is a component part of semiconductive shield in underground power transmission cable. The multi luminescence spectrometer MLA-GOLDS was used to investigate chemical properties of specimens. Also, the density meter EW-200SG was used to investigate the mechanical properties of specimens, and the FE-SEM S-4300 in Hitachi was used for dispersion of CNT(Carbon nanotube). As a result, the cl intensity, which show the effect of oxidation, was decreased by CNT of 1 [wt%], and the density of semiconductive shield materials with CNT and EEA(Ethylene Ethyl Acrylate) is lower than that for commercial semiconductive shield materials. Also, the properties of dispersion showed an increase according to an increase in the ratio of CNT, and the properties were the best at 5 wt%. Therefore, excellent chemical, mechanical and structural properties can be improved with the small amount of CNT.

• Korean Journal of Materials Research
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• v.20 no.2
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• pp.104-110
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• 2010

The characteristics of all polymer composites containing carbon materials are determined by four factors: component properties, composition, structure and interfacial interactions. The most important filler characteristics are particle size, size distribution, specific surface area and particle shape. As a consequence, in this paper we discuss the aspects of the mechanical, electrical and thermal properties of composites with different fillers of carbon black, carbon nanotube (CNT), graphene and graphite and focus on the relationship between factors and properties, as mentioned above. Accordingly, we fabricate rubber composites that contain various carbon materials in carbon black-based and silica based-SBR matrixes with dual phase fillers and use scanning electron microscopy, Raman spectroscopy, a rhometer, an Instron tensile machine, and a thermal conductivity analyzer to evaluate composites' mechanical, fatigue, thermal, and electronic properties. In mechanical properties, hardness and 300%-modulus of graphene-composite are sharply increased in all cases due to the larger specific surface. Also, it has been found that the thermal conductivity of the CNT-composite is higher than that of any of the other composites and that the composite with graphene has the best electrical properties.

• Steel and Composite Structures
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• v.22 no.4
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• pp.745-752
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• 2016

An investigation has been done to study the evolution of the microstructure, mechanical and electrical properties of AlMgSi alloy destined for the transport of electric energy, in function of the deformation caused by the cold drawing process. We identified that drawing of aluminum wire causes development of a fibrous texture of type <111> and <100>. We notice also that the electrical resistivity and mechanical resistance increases with the increasing of the deformation level. Characterization methods used in this work is: The Electron Back Scattered Diffraction EBSD, X-Ray diffraction, Vickers microhardness, Tensile test, Measuring electrical resistivity, the Scanning Electron Microscope (SEM) and Energy Diffraction Spectrum (EDS).

• Journal of the Korean Chemical Society
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• v.29 no.3
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• pp.319-327
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• 1985

The effect of titanate coupling agents on the electrical and mechanical properties of conductive poly (vinyl chloride)-nickel composite was studied as functions of filler concentration, the variation of the amount of titanate coupling agents and the type of titanate coupling agents. It was found that the electrical and mechanical properties of PVC-Ni system were improved by the treatment of titanate coupling agents, but the excessive use of titanate coupling agents influenced to give worse properties.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.10
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• pp.923-930
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• 2003

We jointed Bi(Pb)-Sr-Ca-Cu-O multifilament tapes and evaluated their electrical and mechanical properties. In order to improve connectivity of multifilaments, one or two single-filament tape was inserted between two multifilament tapes. The critical current ratio(CCR) and n-value of the jointed tapes were evaluated as a function of uniaxial pressure. It was observed that critical current ratio and n-value were 24.8-29.0% and 2.5-2.8 for MM lap-jointed tape. On the other hand, the corresponding values were improved to 24.7-53.9% and 3.1-4.2 for MSM jointed tape, and 63.4-76.0% and 3.4-5.1 for double MS:vr lap-jointed tape, respectively. The highest electrical properties of double MSM lap-jointed tape are considered to be owing to the presence of single core, causing better interconnections of multifilaments between the two tapes. The mechanical property of jointed tape was evaluated and correlated to the microstructural evolution. The strength of jointed tapes was 44-64% less than that of the unjoined tape. The strain tolerance of jointed tape was also reduced compared to that of the unjoined tape. These lower mechanical properties of jointed tape are probably due to the induced nonuniform microstructure such as the existence of cracks and Ag-intrusion in the joined region.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.368-369
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• 2008

This paper describes the mechanical properties of poly(polycrystalline) 3C-SiC thin film with various doping concentration, in which poly 3C-SiC thin film's mechanical properties according to the n-doping concentration 1%$(9.2\times10^{15}cm^{-3})$, 3%$(5.2\times10^{17}cm^{-3})$, and 5%$(6.8\times10^{17}cm^{-3})$ respectively was measured by nano indentation. In the case of $9.2\times10^{15}^{-3}$ n-doping concentration, Young's Modulus and hardness were obtained as 270 GPa and 30 GPa, respectively. When the surface roughness according to n-doping concentrations was investigated by AFM(atomic force microscope), the roughness of poly 3C-SiC thin film doped by 5% concentration was 15 nm, which is also the best of them.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.2
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• pp.77-87
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• 1994

Roles of fundamental and additional hardening precipitates on the changes of mechanical properties and electrical resistivity during precipitation decomposition in binary Al-Li, ternaty Al-Li-Cu and multi-Li-Cu-Mg-Zr alloys have been investigated by the detailed measurement of electrical resistivity, hardness and tensile strength and the observation of transmission electron micrographs. Peek hardness and tensile strength in multi-component Al-Li-Cu-Mg-Zr Alloy had higher than that of the other alloys and the results of measurement of hardness, strength and electrical resistivity in each alloys aged at 90 and $190^{\circ}C$, precipitation behaviors and mechanical properties in binary, ternary and multi-component Al-Li alloys were contributed to the ${\delta}^{\prime}$ precursory phase of ${\delta}^{\prime}$, $T_1$, G.P.B. zone and S' phases, repectively.