• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.9
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• pp.1652-1657
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• 2010

This paper analyzes optimal stirrer parameter to improve field uniformity in a mode-stirred reverberation chamber. Stirrer parameter is varied about stirrer height and stirrer angle. Also we analyze quality factor, number of excited modes and stirrer efficiency that affect field uniformity. The results show good performance as higher as stirrer height. Isotropic field distribution is formed at $45^{\circ}$ stirrer angle. When stirrer angle varies, scattering characteristic of incident wave are changed. So electric field distribution in a mode-stirred reverberation chamber is also changed. Therefore, it affect field uniformity. The results expect to help that designs stirrer for get better field uniformity. Immunity test performed designed mode-stirred reverberation chamber for semiconductor that categorized by technology. Test result shows that good recurrence compared wave-guide immunity test.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.309-313
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• 2006

Pad surface characteristics such as roughness, groove and wear rate of pad have a effect on the within wafer non-uniformity(WIWNU) in chemical mechanical polishing(CMP). Although WIWNU increases as the uniformity of roughness(Rpk: Reduced peak height) becomes worse in an early stage of polishing time, WIWNU decreases as non-uniformity of the Rpk value. Also, WIWNU decreases with the reduction of the pad stiffness, though original mechanical properties of pad are unchanged by the grooving process. In addition, conditioning process causes the inequality of pad wear during in CMP. The profile of pad wear generated by the conditioning process has a significant effect on the WIWNU. These experiments results could help to understand the effect of pad surface characteristics in CMP.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.1
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• pp.74-79
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• 2007

Most studies on copper Chemical Mechanical Planarization (CMP) have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to various factors related to uniformity in Cu CMP is essential to elucidate the Cu CMP mechanism as well. The main purpose of the experiment reported here was to investigate and mechanically analyze the roles of slurry components in the formation of the uniformity in Cu CMP. In this paper, Cu CMP was performed using citric acid($C_{6}H_{8}O_{7}$), hydrogen peroxide($H_{2}O_{2}$), colloidal silica, and benzotriazole($BTA,\;C_{6}H_{4}N_{3}H$) as a complexing agent, an oxidizer, an abrasive, and a corrosion inhibitor, respectively. All the results of this study showed that within-wafer non-uniformity(WIWNU) of Cu CMP could be controlled by the contents of slurry components.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.160-160
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• 2008

In practical etching process, etch ant is sprayed on the metal-deposited panel through nozzles collectively connected to the manifold and that panel is usually composed of many PCB(printed circuit board)'s. The etching uniformity, the difference between individual PCB's on the same panel, has become one of most important features of etching process. In this paper, the prediction of nozzle trajectory has been performed by the combination of algebraic formula and numerical simulation. With the pre-determined geometrical factors of nozzle distribution, the trajectories of individual nozzles were predicted with the change of process operational factors such as panel speed, nozzle swing frequency and so on. As results, two dimensional distribution of impulsive force of etchant spray which could be considered as a key factor determining the etching performance have been successfully obtained. Though only qualitative prediction of etching uniformity have been predicted by the process developed in this study, the expansion to the quantitative prediction of etching uniformity is expected to be apparent by this study.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1436-1439
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• 2005

A novel current-type data driver for active matrix organic light emitting diode (AMOLED) is proposed for current uniformity enhancement among its output channels. New architecture is composed of shadow DACs that precharge output stages, a single-real DAC that correct the output level to a real target current level and output stages that operate in 3 states of sampling, correcting and driving. Simulation results show that the proposed driving method and circuits improve the current uniformity among output channels of a current-type driver IC.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1685-1688
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• 2004

I propose a modeling of a mechanism for weight fire uniformity measurement of a tire and a way I interpret a Sampling signal by Loadcell through an analysis, and to measure fire uniformity in this study. Correct a weight fire uniformity measurement was possible through the production of conversion and influence factor of a signal with a basis with the model who was an oscillation mechanics enemy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.73-73
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• 2008

In this work, the study on the $SiO_2$ film non-uniformity by PECVD (Plasma Enhanced Chemical Vapor Deposition) was performed. Plasma diagnostics was analyzed by a DLP(Double Langmuir Probe) and a probe-type QMS(Quadrupole Mass Spectrometer) in order to investigate the spatial distribution of the plasma species in the chamber. The relationship between the plasma species and the depositing rate of the films was examined. On the basis of this work, it was confirmed that O radical density mainly contributed to the increase in the depositing rate of the $SiO_2$ films and the electron temperature in the plasma had a main effect on the formation of the oxygen radicals.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.38-41
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• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.10
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• pp.929-935
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• 2005

In this paper, synthetic conditions of titania nanparticle was investigated to enhance its uniformity of the particle size as a child particle on organic mother particle of liquid powder type electronic paper. The physical properties are very important to improve the uniformity of electrical charging properties Concentration of titania raw material ($C_9H_{19}NO_4Ti$) in the ethanol solvent, pH, and concentration of the solution in the D.I. water were selected as parameters. As a result, ultrafine and well crystallized titania nanoparticle with good uniformity could be synthesized as the concentration of the $C_9H_{19}NO_4Ti$ in the ethanol solvent, pH of the solution, and the amount of the D.I. water were increased. Using the optimized conditions, the titania nanparoticle with uniformly ultrafime size of 10 nm could be synthesized.