• 한국지구물리탐사학회:학술대회논문집
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• 2001.09a
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• pp.90-93
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• 2001

Various soil remedial technologies have been developed and main effort has been to overcome the limiting factors. Major factors were the geophysical characteristics, especially hydraulic, electrical, and heat conductivities. In this paper, I have reviewed the remedial technologies depending on those. Only with comprehensive understanding and information on those characteristics, selection of the best remedial method can be possible.

• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.34-39
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• 1995

we have studied the possibility of n-type doping in diamond and DLC films. After ion doping of either p-type or n-type, the electrical conductivities were remarkably increased and conductivity activation energies were decreased. The Raman intensity at 1330 cm-1 decreases slightly by ion doping of $7.2\times 10^{16}\; \textrm{cm}^{-2}$. The increase in conductivity by ion doping appears to be arised from the combined effects by substitutional doping and graphitization by ion damage.

• Bulletin of the Korean Chemical Society
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• v.11 no.5
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• pp.371-376
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• 1990

Polyaniline perchlorate (PAP) was synthesized by the chemical oxidation of aniline using ferric perchlorate as a strong oxidant. The electrical conductivity of PAP was measured at temperatures from - 170 to 25$^{\circ}C$. It is suggested from the conductivity measurements that the conduction mechanism for PAP is a polaron hopping conduction. From the dependence of resistivity on the reciprocal temperature, the activation energy was computed to be 0.072 eV. From the comparison of the ESR parameterks and conductivity at 25$^{\circ}C$ for the polyaniline-based conducting polymers, the conductivities of PAP, PATFB and PATS increase with increasing ${\Delta}H_{pp}$, decreasing A/B ratio and decreasing g-value, respectively. It is shown by TGA results for PAP, PATFB and PATS that the maximum weight loss rates (Pr) are 0.185 (at 269$^{\circ}C$ ), 0.366 (at 324$^{\circ}C$) and 0.23 mg/min (at 338$^{\circ}C$), respectively.

• Journal of the Korean institute of surface engineering
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• v.55 no.3
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• pp.133-142
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• 2022

This paper reviews bipolar plate materials and coatings for polymer electrolyte fuel cell. First, six roles and 10 requirements of the bipolar plate are described in detail. Secondly, type of materials for the bipolar plate and their advantages and disadvantages are mentioned. Thirdly, different metallic materials are introduced in terms of electrical and thermal conductivities, corrosion resistance, weight, strength and cost. Finally, various types of coating materials and methods were briefly reviewed.

• Journal of the Korean Ceramic Society
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• v.36 no.1
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• pp.69-76
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• 1999

Electrical characteristics of perovskite phases in the BaCe0.9R0.1O3-$\delta$(R=La, Yb and Al) system have been studied. Electrical conductivities of all specimens in air were higher than those in N2 atmosphers between 600 and 100$0^{\circ}C$. When temperature was elevated, the electrical conductivity difference between both atmospheres increased. Electrical conductivity of Yb3+ doped BaCeO3 specimen was higher than those of the La3+ and Al3+ doped specimens. The BaCe0.0Al0.1O3-$\delta$ showed higher proton transference number than both BaCe0.9Yb0.1O3-$\delta$ and BaCe0.9La0.1O3-$\delta$.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.3
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• pp.448-453
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• 2018

PV module protective film plays an important role in protecting the solar cell from external environment by anti-hydrolysis polyester, UV resistance and mechanical properties. The backsheet was manufactured by using Roll-to-Roll dry laminating process. The backsheet structure is composed of 3 layers, which are PE, PET, and Fluorine polymer films. In this study, we have experimented the variation of thermal conductivities depending on MgO inputs 10% to 25% in order to confirm the dependence of the module efficiencies. High thermal conductive backsheet can increase the module output power efficiency because the heat is dissipated by spreading out the internal heat. Long-term environment weatherability tests were conducted for confirming 25 year reliability in the field such as PCT, UV, and power efficiency degradations. As the evaluation result, high thermal conductivity can be effective for increase of power efficiency of solar panel by using thermal conductive MgO masterbatch.

• Journal of the Korean Ceramic Society
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• v.43 no.7 s.290
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• pp.402-407
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• 2006

NiO/YSZ(70 wt%NiO) composite powders were prepared by ball-milling of 8YSZ and NiO precursors, dried and then followed by calcination. The approach was to combine acidic $Ni(NO_3)_2{\cdot}6H_2O$ and basic $2NiCO_3{\cdot}3Ni(OH)_2{\cdot}4H_2O$ via acid-base reaction as a mixed NiO precursor. Their effects were studied in the aspects of DSC, microstructure, porosity, and electrical conductivity. Ni/YSZ composite of 1N9C (1 mole NiO from the nitrate and 9 moles of NiO from the carbonate) was prepared by consolidation at $1400^{\circ}C$ for 3 h, and then followed by reduction at $1000^{\circ}C$ for 3 h under flowing of 6% $H_2/N_2$. It showed a homogeneous microstructure with ${\sim}20%$ porosity and 1880 S/cm at $1000^{\circ}C$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.5 no.3
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• pp.209-214
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• 1995

Abstract 0.2 wt % $Fe_2O_3$ doped $SrTiO_3$ single crystals were grown by floating zone method in air and Nz atmosphere, respectively. The growth rate was fixed at 5 mm/hr and rotation speed was maintained at 30 rpm. As - grown crystals were cut perpendicular to its growth direction and then, annealed at 900, 1000 and $1100^{\circ}C$ for 2 hours in Nz atmosphere. Resistivities of each samples were measured and then converted into conductivities. By using these conductivity values, the activation energies were calculated and by means of the calculated activation energies, mechanism which contribute to increasing the electrical conductivity were investigated.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.207-212
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• 1992

The defect structure of calcium titanates with CaO excess or $TiO_2$ excess was studied by measuring electrical conductivities as a funcition of oxygen partial pressure at $85O^{\circ}C$ to $1050^{\circ}C$. Execess CaO may divide itself equally between A and B sites, resulting in $Ca_{Ti}$" and Vo", while excess $TiO_2$ form $V_{Ca}$" and Vo". The equilibrium electrical conductivity data indicate that the solubilities of CaO and $TiO_2$ in $CaTiO_3$ are 5000ppm and 2000ppm, respectively. Oxygen vacancies contributed to the ionic conduction which flatten the conductivity minima and did not make any defect association with oppositely charged defects.ely charged defects.