• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3289-3291
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• 1999

The vibration and impact hinders the movement of micro dynamic system. The controllable micro damper is a solution for this problem. In this paper, the controllable micro damper for MR(Magneto - Rheological) Fluid is designed and fabricated using bulk micromachining process and organic bonding technique. The damping constant of micro MR damper changes according to input magnetic field. The response of the micro MR damper is measured and the experimental results are compared.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1914-1916
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• 2003

최근 PDMS를 이용한 미세구조물의 제작을 통한 LOC(lap-on-a-chip) 개발에 대한 연구가 많이 진행되고 있다. 본 연구에서는 PDMS와 여러기판(유리와 실리콘) 사이의 접합 공정에 관한 연구를 하였으며, 특히 PDMS 표면의 물리적, 화학적 변화와 접합 특성과의 관계를 고찰하였다. $O_2$ 플라즈마를 사용하여 표면 처리된 기판의 표면에너지를 접촉각 측정방식으로 측정하였다. 또한 XPS를 이용하여 표면의 화학조성 변화 관찰하였으며, AFM으로 플라즈마 도즈량에 따른 표면 거칠기를 조사하였다.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1920-1922
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• 2003

We have fabricated the pyrex glass microlens using thermal reflow process. Fabricated microlens is the plano convex refractive type and was fabricated with pyrex glass-Si anodic bonding wafer. The etched circle or cylindrical pyrex glass pattern was melted in a furnace $800^{\circ}C$ to $900^{\circ}C$ for about 15min. The surface roughness of the microlenses was measured by the AFM and average surface roughness of the microlenses was below 15min. The radius of curvature of the microlens was measured with phase shift interferometer.

• Proceedings of the KIEE Conference
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• 2003.11a
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• pp.171-173
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• 2003

This paper presents a new fault location algorithm for 3 phase underground cable based on distributed parameter circuit analysis, by which we establish the basic equations for each of core and sheath currents and voltages considering cross-bonding sheaths. The proposed algorithm need simulate by EMTP, and then the EMTP data need be compared with the calculation result in Matlab.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1738-1740
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• 2003

This paper deals with the characteristic analysis of multi-grounding system. In order to assess the effectiveness of bonding two grounding systems, the scale model grounding simulation system and grid grounding conductors which were downsized as a scale factor of 100:1 were designed and fabricated. A profile of GPR(Grounding Potential Rise) of each case was measured. Also the measured results were compared with the analysis results.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1641-1643
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• 2003

Transient GPR characteristics of two different grounding systems were measured in this paper. The scale model method was used to analyze the effectiveness of bonding two grounding grids systems. Also the measured results were verified by comparing with Pspice analysis results.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1180-1182
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• 1993

In this paper, studing for the formative characterizations, bonding structures and hydrogen atom content in layer that oxynitride films deposited by Plasma CVD was investigated adaptive possibility for intemediate layer or final passivation layer of ULSI semiconductor devices.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.251-253
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• 2002

We have fabricated a novel Vertical Trench Hall-Effect Device sensitive to the magnetic field parallel to the sensor chip surface for non-contact angular position sensing applications. The Vertical Trench Hall-Effect Device is built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 150 V/AT is measured.

• Smart Structures and Systems
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• v.5 no.6
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• pp.633-644
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• 2009

A simple method has been developed to detect the bonding condition of active fiber composites (AFC) adhered to the surface of a host structure. Large deformation actuating capability is one of important features of AFC. Edge delamination in adhesive layer due to large interfacial shear stress at the free edge is typically resulted from axial strain mismatch between bonded materials. AFC patch possesses very good flexibility and toughness. When an AFC patch is partially delaminated from host structure, there remains sensing capability in the debonded part. The debonding size can be determined through axial resonance measured by the interdigitated electrodes symmetrically aligned on opposite surfaces of the patch. The electrical impedance and modal response of the AFC patch in part adhered to an aluminum plate were investigated in a broad frequency range. Debonding ratio of the AFC patch is in inverse proportion to the resonant frequency of the fundamental mode. Feasibility of in-situ detecting the progressive delamination between AFC patch and host plate is demonstrated.

• Journal of Sensor Science and Technology
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• v.28 no.3
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• pp.152-156
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• 2019

An ultraviolet (UV) image sensor is an extremely important optoelectronic device used in scientific and medical applications because it can detect images that cannot be obtained using visible or infrared image sensors. Because photodetectors and transistors are based on different materials, conventional UV imaging devices, which have a hybrid-type structure, require additional complex processes such as a backside etching of a GaN epi-wafer and a wafer-to-wafer bonding for the fabrication of the image sensors. In this study, we developed a monolithic GaN UV passive pixel sensor (PPS) by integrating a GaN-based Schottky-barrier type transistor and a GaN UV photodetector on a wafer. Both individual devices show good electrical and photoresponse characteristics, and the fabricated UV PPS was successfully operated under UV irradiation conditions with a high on/off extinction ratio of as high as $10^3$. This integration technique of a single pixel sensor will be a breakthrough for the development of GaN-based optoelectronic integrated circuits.