• Journal of Soil and Groundwater Environment
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• v.14 no.5
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• pp.29-40
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• 2009

In general, understanding groundwater flow in fractured bedrock is critical during tunnel and underground cavern construction. In that case, borehole data may be useful to examine groundwater flow properties of the fractured bedrock from pre-excavation until completion stages, yet sufficient borehole data is not often available to acquire. This study evaluated groundwater discharge rate into Jikri tunnel in Gyeonggi province using hydraulic parameters, groundwater level data in the later stage of tunneling, national groundwater monitoring network data, and electrical resistivity survey data. Groundwater flow rate into the tunnel by means of analytical method was estimated $7.12-74.4\;m^3/day/m$ while the groundwater flow rate was determined as $64.8\;m^3/day/m$ by means of numerical modeling. The estimated values provided by the numerical modeling may be more logical than those of the analytical method because the numerical modeling could take into account spatial variation of hydraulic parameters that was not possible by using the analytical method. Transient modeling for a period of one year from the tunnel completion resulted in the recovery of pre-excavation groundwater level.

• Journal of the Korean GEO-environmental Society
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• v.22 no.12
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• pp.15-24
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• 2021

In Korea, which is mostly mountainous, the proportion of tunnel and underground space development are increasing. Although the ground is reinforced by applying the ground improvement method during underground space development, accidents still occur frequently in Korea. In the grouting method, a representative ground reinforcement method, the effect was judged by comparing the total amount of injection material with the amount of injection material used during the actual grouting construction. However, it is difficult to determine whether the ground reinforcement is properly performed during construction or within the target ground. In order to solve this problem, it is necessary to study a new method for quality control during or after construction by measuring electrical resistivity after performing grouting by mixing carbon fiber, which is a conductive material, and microcement, which is a grout material. In this study, as a basic study, a cement specimen mix ed with 0%, 3%, 5%, 7% of carbon fiber was prepared to evaluate the performance of the grout material mixed with carbon fiber, which is a conductive material. The prepared specimens were wet curing for 3 days, 7 days, and 28 days under 99% humidity, and then compression wave velocity and shear wave velocity were measured. As a result of the compression wave velocity and shear wave velocity measurement, it showed a tendency to increase with the increase in the compounding ratio of carbon fibers and the number of days of age, and it was confirmed that the elastic modulus and shear modulus, which are the stiffness of the material, also increased.

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.339-344
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• 2011

The Ohmic contact of Ti/Au metals on n-type ZnO thin film deposited on c-plane sapphire substrates by pulsed laser deposition was investigated by TLM (transfer length method) patterns. The Ti/Au metal films with thickness of 35 nm and 90 nm were deposited by electron-beam evaporator and thermal evaporator, respectively. By using the photo-lithography method, the $100{\times}100{\mu}m^2$ TLM patterns with $6{\sim}61{\mu}m$ gaps were formed. To improve the electrical properties as well as to decrease an interface states and stress between metal and semiconductor, the post-annelaing process was done in oxygen ambient by rapid thermal annealing system at temperature of $100{\sim}500^{\circ}C$ for 1 min. In this study, it appeared that the minimum specific contact resistivity shows about $1.1{\times}10^{-4}{\Omega}{\cdot}cm^2$ in $300^{\circ}C$ annealed sample, which may be originated from formation of oxygen vacancies of ZnO during an oxidation of Ti metal at the interface of Ohmic contacts.

• Journal of Korean Tunnelling and Underground Space Association
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• v.6 no.4
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• pp.327-343
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• 2004

During tunnel construction, ground failures often occur due to existence of weak zones, such as faults, joints, and cavities, ahead of tunnel face. It is hard to detect effectively weak zones, which can lead underground structure to fail after excavation and before supporting, by using conventional characterization methods. In this study, an enhanced analytical method of predicting weak zones ahead of tunnel face is developed to overcome some problems in the conventional geophysical exploration methods. The analytical method is based on Coulomb's and Gauss' laws with considering the characteristics of electric fields subjected to rock mass. Using the developed method, closed form solutions are obtained to detect a spherical shaped zone and an oriented fault ahead of tunnel face respectively. The analytical results suggest that the presence of weak zones and their sizes, location, and states can be accurately predicted by combining a proper inversion process with resistance measured from several electrodes on the tunnel face. It appears that the skin depth or resistivity in rock mass is affected by the diameter of tunnel face, natural electric potential and noises induced by experimental measurement and spatial distribution of uncertain properties. The developed analytical solution is verified through experimental tests. About 1800 concrete blocks of 5cm by 5cm by 5cm in size are prepared and used to model a joint rock mass around tunnel face. Weak zones are simulated ahead of tunnel face with a material which has relatively higher conductivity than concrete blocks. Experimental results on the model test show a good agreement with analytical results.

• Journal of the Korean earth science society
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• v.31 no.6
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• pp.563-572
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• 2010

Both multi-channel temperature monitoring and geophysical electric survey were performed together for an embankment to assess the leakage zone. Temperature variation according to space and time on the inner parts of engineering constructions (e.g.: dam and slope) can be basic information for diagnosing their safety problem. In general, as constructions become superannuated, structural deformation (e.g.: cracks and defects) could be generated by various factors. Seepage or leakage of water through the cracks or defects in old dams will directly cause temperature anomaly. This study shows that the position of seepage or leakage in dam body can be detected by multi-channel temperature monitoring using thermal line sensor. For that matter, diverse temperature monitoring experiments for a leakage physical model were performed in the laboratory. In field application of an old earth fill dam, temperature variations for water depth and for inner parts of boreholes located at downstream slope were measured. Temperature monitoring results for a long time at the bottom of downstream slope of the dam showed the possibility that temperature monitoring can provide the synthetic information about flowing path and quantity of seepage of leakage in dam body. Geophysical data by electrical method are also added to help interpret data.

• Proceedings of the KIEE Conference
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• 1988.11a
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• pp.372-375
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• 1988

The III-V ternary alloy semiconductor $In_{l-x}Ga_{x}As$ were grown by the temperature Gradient of $0.60{\leq}x{\leq}0.98$. The electrical properties were investigated by the Hall effect measurement with the Van der Pauw method in the temperature range of $90{\sim}300K$. $In_{l-x}Ga_{x}As$ were revealed n-type and the carrier concentration at 300K were in the range of $9.69{\times}10^{16}cm^{-3}{\sim}7.49{\times}10^{17}cm^{-3}$. The resistivity was increased and the carrier mobility was decreased with increasing the composition ratio. The optical energy gap determined by optical transmission were $20{\sim}30meV$ lower than theoretical valves on the basis of absorption in the conduction band tail and it was decreased with increasing the temperature by the Varshni rule. In the photoluminescence of undoped $In_{l-x}Ga_{x}As$ at 20K, the main emission was revealed by the radiative recombination of shallow donor(Si) to acceptor(Zn) and the peak energy was increased with increasing the composition, X. The diffusion depth of Zn increases proportionally with the square root of diffusion time, and the activation energy for the Zn diffusion into $In_{0.10}Ga_{0.90}As$ was 2.174eV and temperatures dependence of diffusion coefficient was D = 87.29 exp(-2.174/$K_{B}T$). The Zn diffusion p-n $In_{x}Ga_{x}As$ diode revealed the good rectfying characteristics and the diode factor $\beta{\approx}2$. The electroluminescence spectrum for the Zn-diffusion p-n $In_{0.10}Ga_{0.90}As$ diode was due to radiative recombation between the selectron trap level(${\sim}140meV$) and Zn acceptor level(${\sim}30meV$). The peak energy and FWHM of electroluminescence spectrum at 77K were 1.262eV and 81.0meV, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.418-418
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• 2008

The electrochemical etching of silicon in HF-based solutions is known to form various types of porous structures. Porous structures are generally classified into three categories according to pore sizes: micropore (below 2 nm in size), mesopore (2 ~ 50 nm), and macropore (above 50 nm). Recently, the formation of macropores has attracted increasing interest because of their promising characteristics for an wide scope of applications such as microelectromechanical systems (MEMS), chemical sensors, biotechnology, photonic crystals, and photovoltaic application. One of the promising applications of macropores is in the field of MEMS. Anisotropic etching is essential step for fabrication of MEMS. Conventional wet etching has advantages such as low processing cost and high throughput, but it is unsuitable to fabricate high-aspect-ratio structures with vertical sidewalls due to its inherent etching characteristics along certain crystal orientations. Reactive ion dry etching is another technique of anisotropic etching. This has excellent ability to fabricate high-aspect-ratio structures with vertical sidewalls and high accuracy. However, its high processing cost is one of the bottlenecks for widely successful commercialization of MEMS. In contrast, by using electrochemical etching method together with pre-patterning by lithographic step, regular macropore arrays with very high-aspect-ratio up to 250 can be obtained. The formed macropores have very smooth surface and side, unlike deep reactive ion etching where surfaces are damaged and wavy. Especially, to make vertical microwire or nanowire arrays (aspect ratio = over 1:100) on silicon wafer with top-down photolithography, it is very difficult to fabricate them with conventional dry etching. The electrochemical etching is the most proper candidate to do it. The pillar structures are demonstrated for n-type silicon and the formation mechanism is well explained, while such a experimental results are few for p-type silicon. In this report, In order to understand the roles played by the kinds of etching solution and mask patterns in the formation of microwire arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, dimethyl sulfoxide (DMSO), iso-propanol, and mixtures of HF with water on the structure formation on monocrystalline p-type silicon with a resistivity with 10 ~ 20 $\Omega{\cdot}cm$. The different morphological results are presented according to mask patterns and etching solutions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1129-1136
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• 1999

TIN films were prepared on Si(100) substrate by ICP-CVD(inductive1y coupled plasma enhanced chemical vapor deposition) using TEMAT(tetrakis ethylmethamido titanium : Ti$[\textrm{N}\textrm{(CH)}_{3}\textrm{C}_{2}\textrm{H}_{5}]_{4}$) precursor at various deposition conditions. Phase, microstructure, and the electrical properties of TIN films were characterized by x-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HRTEM) and electrical measurements. Polycrystalline TiN films with B1 structure were grown at temperatures over $200^{\circ}C$. Preferentially oriented along TiN(111) films were obtained at temperatures over $300^{\circ}C$ with the flow rates of 10, 5, and 5 sccm for TEMAT, $\textrm{N}_{2}$ and Ar gas. The TiN/Si(100) interface was flat and no chemical reaction between TIN and $\textrm{SiO}_2$ was found. The resistivity, carrier concentration and the carrier mobility for the TiN sample prepared at $500^{\circ}C$ are 21 $\mu\Omega$cm, 9.5$\times\textrm{10}^{18}\textrm{cm}^{-3}$ and $462.6\textrm{cm}^{2}$/Vs, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.1
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• pp.35-40
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• 2009

Lead free positive temperature coefficient of resistivity (PTCR) ceramics based on $BaTiO_3-(Bi_{0.5}Na_{0.5})TiO_3$ solid solution were prepared by a conventional solid state reaction method. The phase structure was showed single phase with perovskite structure regardless calcinations temperature and $Ba_{1-x}(Bi_{0.5}Na_{0.5})_xTiO_3$ structure was transformed from tetragonal to orthorhombic phase at $x{\geq}0.15$ mole. The XRD peaks with $45^{\circ}{\sim}46^{\circ}$ shifted in right the influence of crystal structure change and the intensity of peak was decreased with additive $(Bi_{0.5}Na_{0.5})TiO_3$. The curie temperature risen with additive $(Bi_{0.5}Na_{0.5})TiO_3$ but disappeared for $(Bi_{0.5}Na_{0.5})TiO_3$ addition more than 0.15 mole in TMA. In relative permittivity, the curie temperature by the transform of ferroelectric phase risen with additive $(Bi_{0.5}Na_{0.5})TiO_3$ but decreased in relative permittivity. Also, the peak of new curie temperature showed the sample containing $0.025{\sim}0.045$ mole of $(Bi_{0.5}Na_{0.5})TiO_3$ near $70^{\circ}C$ caused by phase transform from ferroelectric to ferroelectric and the peak of new curie temperature disappeared at 0.045 mole of $(Bi_{0.5}Na_{0.5})TiO_3$. In our study, it was found that the PTCR in $BaTiO_3-(Bi_{0.5}Na_{0.5})TiO_3$ system was possible for $0{\sim}0.025$ mole of $(Bi_{0.5}Na_{0.5})TiO_3$ and the maximum curie temperature by phase transition showed about at $145^{\circ}C$.