• Journal of the Korean Society of Safety
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• v.12 no.3
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• pp.45-51
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• 1997

To evaluate the elastic-plastic fracture toughness by this modified offset method, the origin of J-R curve is set with drawing the blunting line on the maximum point of the negative crack growth and R curve is modified by adding the blunting factor of the experimented point on the R curve. The elastic-plastic fracture toughness $J_{IC]$ of A5083-H112 material by the modified offset method we 44kN/m on the smooth CT specimens.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.5
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• pp.1601-1610
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• 1991

본 연구에서는 3차원 스트레칭 문제의 2차원화가 가능한 주요 단면에 대해서 박막요소와 적층 셸(degenerated shell) 요소를 혼합하여 사용하는 선택적 M/S 방법을 이용하여 2차원 문제로 해석하였다. M/S변환 조건으로는 변형형상의 기하학적 조건 을 고려하였다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.245-248
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• 1999

Explicit dynamic finite element analysis has been used widely in the field of sheet metal forming. However in using the analysis technique there are some parameters which are not clearly defined so that engineers may obtain inaccurate solutions In the present study parameters such as time step damping ratio penalty constant and punch speed were investigated on their influence to the solution behavior. Considered forming processes are plane stain bending by a punch and axisymmetric deep drawing.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.210-212
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• 2003

Finite element analysis of welding processes, which entail phase evolution, heat transfer and deformation, is considered in this paper. Attention focuses on numerical implementation of the thermo-elastic-plastic constitutive equation proposed by Leblond et al in consideration of the transformation plasticity. Based upon the multiplicative decomposition of deformation gradient, hyperelastic formulation is employed for efficient numerical integration, and the algorithmic consistent moduli for elastic-plastic deformations including transformation plasticity are obtained in the closed form. The convergence behavior of the present implementation is demonstrated via a couple of numerical example.

• Proceeding of KASS Symposium
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• 2006.05a
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• pp.165-169
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• 2006

This study presents a new stress analysis method to be substituted for the elastic analysis in such a plastic design procedure. This method is accompanied by an efficient mathematical tool which can be easily handled by personal computer. The method also easily accepts arbitrary strategies by the designer for selection member size.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.05a
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• pp.2-7
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• 1994

The dynamic fatigue life equation is applied to uniaxial tensile test. The resultant equations far the surface energy and fracture toughness are calculated with the data from the tensile test and compared with the ones from ASTM E399 test. During the crack propagation under model loading, the material of the crack tip undergoes the process of the elastic-plastic deformation in the uniaxial tensile test. The surface energy per unit area is proportional to the ratio of plastic and elastic elongations. The calculated fracture toughness of the metals are very well coincident to the ASTM E399's test results.

• Transactions of Materials Processing
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• v.10 no.1
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• pp.23-29
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• 2001

In this study, the optimized initial hole shape for T-branch forming was proposed to obtain effective welding region. Design variables were determined by approximation analysis using volume constant condition. We performed 3D elastic-plastic FEM(Finite Element Method) analysis to simulate T-branch forming process. The variation of height and thickness of T-branch with various hole shapes was investigated. The optimized initial hole shape equation was obtained by using results for the numerical analysis.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.183-188
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• 2007

In this paper, we propose a 2D-FE model in single impact with combined physical factors to obtain a unique residual stress by shot peening. Applied physical parameters include elastic-plastic deformation of shot ball, material damping coefficients, strain rate, dynamic friction coefficients. Single impact FE model consists of 2D axisymmetric elements. The FE model with combined factors showed converged and unique distributions of surface stress, maximum compressive residual stress and deformation depth. Further, in contrast to the FE models with rigid shot and elastic deformable shot, FE model with plastic deformable shot produces residual stresses very close to experimental solutions by X-ray diffraction. We therefore validated the 2D FE model with combined peeing factors and plastic deformable shot. This FE model will be a base of the 3D FE model for residual stresses by multi-impact shot peening.

• Transactions of Materials Processing
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• v.9 no.5
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• pp.486-493
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• 2000

Extrusion die-lip buildup has direct and negative impact on the properties of the final product. At the present time there is no absolute method of die-lip prevention. However, a Periodical shut down of extrusion line for the removal has been the general practice throughout the industry in concern. In this study the die-lip buildup was Investigated with a particular attention paid to the influence of die exit geometry and dimensions on the stresses produced at the point of die exit. To demonstrate the relationship between the stress state and the magnitude of the die-lip buildup, a method of virtual manufacturing was performed, assuming elastic-plastic material behavior for the high-density polyethylene under investigation. The overall numerical results suggested that the longer the die-land and/or the smaller the areal reduction of the die would reduce the tendency for the die-lip formation. Similarly, haying a fillet around the circumferential edge of the die exit would be favorable in decreasing the die-lip buildup.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.