• Journal of Mechanical Science and Technology
• /
• 제17권12호
• /
• pp.1928-1937
• /
• 2003

Effect of elastic modulus mismatch on the contact crack initiation is investigated to find major parameters in designing desirable surface-coated system. Silicon nitride coated soft materials with various elastic modulus mismatch, E$\_$c//E$\_$s/＝1.06∼356 are prepared for the analysis. Hertzian contact test is conducted for producing contact cracks and the acoustic emission detecting technique for measuring the critical load of crack initiation. The implication is that coating thickness and material strength are controllable parameters to prevent the initiation of contact cracks resulted from the elastic modulus mismatch in the hard ceramic coating layer on the soft materials.

• Journal of Mechanical Science and Technology
• /
• 제17권11호
• /
• pp.1638-1649
• /
• 2003

A study is made on the characterization of damage tolerance by spherical indentation in hardly coated layer structure with modest elastic modulus mismatch. A hard silicon nitride is prepared for the coating material and silicon nitride with 5wt% of boron nitride composites for underlayer. Hot pressing to eliminate the effect of interface delamination during the fracture makes strong interfacial bonding. The elastic modulus mismatch between the layers is not only large enough to suppress the surface crack initiation from the coating layer but sufficiently small to prevent the initiation of radial crack from the interface. The strength degradation of the layer structure after sphere contact indentation does not significantly occur, while the degradation of silicon nitride-boron nitride composite is critical at a high load and high number of contacts.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2005년도 춘계학술발표대회 논문집
• /
• pp.195-198
• /
• 2005

The role of elastic/plastic mismatch on the contact crack initiation is investigated for designing desirable surface-coated asymmetric layered composites. Various layered composites such as $Si_3N_4$ ceramics on $Si_3N_4+BN$ composite, soda-lime glass on various substrates with different elastic modulus for the analysis. Spherical indentation is conducted for producing contact cracks from the surface or interface between the coating and the substrate layer. A finite element analysis of the stress fields in the loaded layer composites enables a direct correlation between the damage patterns and the stress distributions. Implications of these conclusions concerning the design of asymmetric layered composites indicate that the elastic modulus mismatch is one of the important parameter for designing layered composite to prevent the initiation of contact cracks.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 추계학술대회
• /
• pp.297-301
• /
• 2004

The optimum design against contact crack initiation is investigated to find major parameters in designing desirable surface-coated asymmetric layered components. Hard ceramic coated soft materials with various elastic modulus mismatch are prepared for the analysis. Spherical indentation is conducted for producing contact cracks from the surface or interface between the coating and the substrate layer. A finite element analysis of the stress fields in the loaded layer components enables a direct correlation between the damage patterns and the stress distributions. Implications concerning the design of asymmetric layered components indicate that the coating thickness and the elastic modulus mismatch are important parameters for designing layered component to prevent the initiation of contact cracks.

• 한국세라믹학회지
• /
• 제52권6호
• /
• pp.417-422
• /
• 2015

In this study, we investigate the effect of porous $Al_2O_3$ substrate on the strengths of asymmetric structures after we prepare such a structure consisting of a dense $Li_2ZrO_3$ top layer and porous $Al_2O_3$ substrate layer. The porosity and elastic modulus of the substrate layer are controlled by sintering temperature, which has three values of 1150, 1250 and $1350^{\circ}C$. The porosity is controlled in the range of ~ 30-50 vol%, elastic modulus is ~80-120 GPa and elastic mismatch $E_s/E_c$ is ~ 0.6-1.0. Indentation stress-strain curves are obtained and analyzed to evaluate the yield stress of the asymmetric structure by concentrated local loading of WC balls. Conventional flexural strengths are also obtained to evaluate the strength of the asymmetric structure. The results indicate that the local yield strength of the asymmetric structure has mid-values between the top and the substrate layer; however, the flexural strength of the asymmetric structure are mainly influenced by elastic modulus and strength of the substrate.

• The Korean Journal of Ceramics
• /
• 제5권4호
• /
• pp.400-403
• /
• 1999

The mechanical and electrical properties of hot-pressed and annelaed $\beta$-SiC+39vol.% $ZrB_2$ electroconductive ceramic composites were investigated as a function of the liquid forming additives of $Al_2O_3+Y_2O_3$(6:4 wt%). In this microstructures, no reactions and elongated $\alpha$-SiC grains with equiaxed $ZrB_2$ grains were observed between $\beta$-SiC and $ZrB_2$. The properties of the $\beta$-SiC+39vol.%$ZrB_2$ composites with 4wt% $Al_2O_3+Y_2O_3$ at R.T. are as follows: fracture toughness is 6.37 MPa.m1/2, electical resistivity is $1.51\times10^{-4}\Omega \cdot\textrm{cm}$ and the relative density is 98.6% of the theoretical density. The fracture toughness of the $\beta$-SiC+39 vol.% $ZrB_2$ composites were weakly decreased with increasing amount of $Al_2O_3+Y_2O_3$ additives. Internal stresses due to the difference of $\beta$-SiC and $ZrB_2$ thermal expansion coefficient and elastic modulus mismatch appeared to contribute to fracture toughening in $\beta$-SiC+39vol.%$ZrB_2$ electroconductive ceramic composites.

• Journal of Mechanical Science and Technology
• /
• 제18권1호
• /
• pp.12-19
• /
• 2004

Using LSM (laser scanning method) , the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10％ at 100$^{\circ}C$ and 20% at 150$^{\circ}C$ for two hours.

• 마이크로전자및패키징학회지
• /
• 제11권4호
• /
• pp.49-53
• /
• 2004

고분자 재료가 전자산업분야에서 절연재료나 접착제로 널리 사용되고 있다. 실리콘 기판위에 증착된 고분자 층에는 기판과의 열팽창계수 차이로 인해 열응력이 발생할 수 있다 고분자 층과 기판사이의 열적 성질의 차이로 인해 큰 잔류응력이 야기된다. 본 연구에서는 레이저 주사법을 이용하여 열적변형으로 인한 곡률변화를 측정한 후, 해석적 방법을 적용하여 수정된 박막 물성을 구하는 방법을 제시하고 있다.

• 한국재료학회지
• /
• 제8권8호
• /
• pp.744-750
• /
• 1998

마이크로 머신 소자는 일반전자 소자와 달리 소자 자체에 미세한 기계적 구조물을 갖고 있으며, 이의 구동을 통하여 센서 또는 엑츄에이터의 기능을 갖게 된다. 이 소자들은 그 작동 요구특성에 따라 패키지의 기계적, 환경적 격리를 요구하거나 분위기조절이 요구되는 등 까다로운 패키지 특성을 필요로 한다. 또한 미세한 작동소자들로 인하여 열 및 열응력에 매우 민감하며, 패키지방법에 따라 구동부위의 작동 특성이 크게 변화할 수 있다. 본 연구에서는 마이크로 머신 소자가 패키지 상에 접촉되어 패키지 될 때, 소자의 접촉 재료 및 공정온도, 크기 등이 마이크로 머신 소자에 미치는 열응력을 연구하였다. 유한요소해석법을 사용하여 소자에 미치는 열응력과 이로 인한 마이크로머신 소자의 물리적 변형을 예측하고, 이를 통하여 마이크로 머신 소자 패키지에 최소한의 열응력을 미치는 소자접속 재료의 선별과 패키지 설계의 최적화를 이루고자 하였다.

• Macromolecular Research
• /
• 제12권1호
• /
• pp.78-84
• /
• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.