• Journal of Mechanical Science and Technology
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• v.17 no.12
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• pp.1928-1937
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• 2003

Effect of elastic modulus mismatch on the contact crack initiation is investigated to find major parameters in designing desirable surface-coated system. Silicon nitride coated soft materials with various elastic modulus mismatch, E$\_$c//E$\_$s/＝1.06∼356 are prepared for the analysis. Hertzian contact test is conducted for producing contact cracks and the acoustic emission detecting technique for measuring the critical load of crack initiation. The implication is that coating thickness and material strength are controllable parameters to prevent the initiation of contact cracks resulted from the elastic modulus mismatch in the hard ceramic coating layer on the soft materials.

• Journal of Mechanical Science and Technology
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• v.17 no.11
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• pp.1638-1649
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• 2003

A study is made on the characterization of damage tolerance by spherical indentation in hardly coated layer structure with modest elastic modulus mismatch. A hard silicon nitride is prepared for the coating material and silicon nitride with 5wt% of boron nitride composites for underlayer. Hot pressing to eliminate the effect of interface delamination during the fracture makes strong interfacial bonding. The elastic modulus mismatch between the layers is not only large enough to suppress the surface crack initiation from the coating layer but sufficiently small to prevent the initiation of radial crack from the interface. The strength degradation of the layer structure after sphere contact indentation does not significantly occur, while the degradation of silicon nitride-boron nitride composite is critical at a high load and high number of contacts.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.195-198
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• 2005

The role of elastic/plastic mismatch on the contact crack initiation is investigated for designing desirable surface-coated asymmetric layered composites. Various layered composites such as $Si_3N_4$ ceramics on $Si_3N_4+BN$ composite, soda-lime glass on various substrates with different elastic modulus for the analysis. Spherical indentation is conducted for producing contact cracks from the surface or interface between the coating and the substrate layer. A finite element analysis of the stress fields in the loaded layer composites enables a direct correlation between the damage patterns and the stress distributions. Implications of these conclusions concerning the design of asymmetric layered composites indicate that the elastic modulus mismatch is one of the important parameter for designing layered composite to prevent the initiation of contact cracks.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.297-301
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• 2004

The optimum design against contact crack initiation is investigated to find major parameters in designing desirable surface-coated asymmetric layered components. Hard ceramic coated soft materials with various elastic modulus mismatch are prepared for the analysis. Spherical indentation is conducted for producing contact cracks from the surface or interface between the coating and the substrate layer. A finite element analysis of the stress fields in the loaded layer components enables a direct correlation between the damage patterns and the stress distributions. Implications concerning the design of asymmetric layered components indicate that the coating thickness and the elastic modulus mismatch are important parameters for designing layered component to prevent the initiation of contact cracks.

• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.417-422
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• 2015

In this study, we investigate the effect of porous $Al_2O_3$ substrate on the strengths of asymmetric structures after we prepare such a structure consisting of a dense $Li_2ZrO_3$ top layer and porous $Al_2O_3$ substrate layer. The porosity and elastic modulus of the substrate layer are controlled by sintering temperature, which has three values of 1150, 1250 and $1350^{\circ}C$. The porosity is controlled in the range of ~ 30-50 vol%, elastic modulus is ~80-120 GPa and elastic mismatch $E_s/E_c$ is ~ 0.6-1.0. Indentation stress-strain curves are obtained and analyzed to evaluate the yield stress of the asymmetric structure by concentrated local loading of WC balls. Conventional flexural strengths are also obtained to evaluate the strength of the asymmetric structure. The results indicate that the local yield strength of the asymmetric structure has mid-values between the top and the substrate layer; however, the flexural strength of the asymmetric structure are mainly influenced by elastic modulus and strength of the substrate.

• The Korean Journal of Ceramics
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• v.5 no.4
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• pp.400-403
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• 1999

The mechanical and electrical properties of hot-pressed and annelaed $\beta$-SiC+39vol.% $ZrB_2$ electroconductive ceramic composites were investigated as a function of the liquid forming additives of $Al_2O_3+Y_2O_3$(6:4 wt%). In this microstructures, no reactions and elongated $\alpha$-SiC grains with equiaxed $ZrB_2$ grains were observed between $\beta$-SiC and $ZrB_2$. The properties of the $\beta$-SiC+39vol.%$ZrB_2$ composites with 4wt% $Al_2O_3+Y_2O_3$ at R.T. are as follows: fracture toughness is 6.37 MPa.m1/2, electical resistivity is $1.51\times10^{-4}\Omega \cdot\textrm{cm}$ and the relative density is 98.6% of the theoretical density. The fracture toughness of the $\beta$-SiC+39 vol.% $ZrB_2$ composites were weakly decreased with increasing amount of $Al_2O_3+Y_2O_3$ additives. Internal stresses due to the difference of $\beta$-SiC and $ZrB_2$ thermal expansion coefficient and elastic modulus mismatch appeared to contribute to fracture toughening in $\beta$-SiC+39vol.%$ZrB_2$ electroconductive ceramic composites.

• Journal of Mechanical Science and Technology
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• v.18 no.1
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• pp.12-19
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• 2004

Using LSM (laser scanning method) , the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10％ at 100$^{\circ}C$ and 20% at 150$^{\circ}C$ for two hours.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.49-53
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• 2004

Polymeric materials are widely used in the electronic industry as a common dielectric material or adhesive. The polymeric layer coated on Si substrate can be subjected to thermal stresses due to difference in thermal expansion coefficients. The mismatch in thermal properties between the polymeric layer and the substrate results in significant residual stresses. In this study, the thermal deformation is measured by a curvature measurement method using laser scanning, and the elastic modulus is calculated by an analytic model.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.