• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.97-100
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• 2003

Globally, the various machine components, as in electronics and communications, are demanded to being high-performance and micro-scale with abrupt development of the fields of computers, mobile communications. As this current tendency, production of the parts that must have high accuracy, so called milli-structure, are accomplished by the method of top-down, differently as in the techniques of MEMS, NANO. But, in the case of milli-structure, production procedure is highly costs, difficult and demands more accurate dimension than the conservative forming, processing technique. In this paper, forming analysis of the micro-former as the milli-structure are performed and then calculate the punch force etc. This information calculated is applied to decide the forming capacity of micro-former and design the process of forming stage, dimension of dies in another forming bodies. And, for the better precise forming analysis, elasto-plastic analysis is to be performed, then the consideration about effect of elastic recovery when punch and die are unloaded, have to be discussed in change of dimensions.

• Journal of Mechanical Science and Technology
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• v.16 no.12
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• pp.1687-1692
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• 2002

The problem analyzed here is a sheet metal forming process which requires a drawbead. The drawbead provides the sheet metal enough tension to be deformed plastically along the punch face and consequently, ensures a proper shape of final products by fixing the sheet to the die. Therefore, the optimum design of drawbead is indispensable in obtaining the desired formability. A static-explicit finite element analysis is carried out to provide a perspective tool for designing the drawbead. The finite element formulation is constructed from static equilibrium equation and takes into account the boundary condition that involves a proper contact condition. The deformation behavior of sheet material is formulated by the elastic-plastic constitutive equation. The finite element formulation has been solved based on an existing method that is called the static-explicit method. The main features of the static-explicit method are first that there is no convergence problem. Second, the problem of contact and friction is easily solved by application of very small time interval. During the analysis of drawbead processes, the strain distribution and the drawing force on drawbead can be analyzed. And the effects of bead shape and number of beads on sheet forming processes were investigated. The results of the static explicit analysis of drawbead processes show no convergence problem and comparatively accurate results even though severe high geometric and contact-friction nonlinearity. Moreover, the computational results of a static-explicit finite element analysis can supply very valuable information for designing the drawbead process in which the defects of final sheet product can be removed.

• Transactions of Materials Processing
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• v.25 no.2
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• pp.116-123
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• 2016

Press-brake bending is used to shape flat and thick plates into a targeted circular configuration without excessive localized thinning or thickening. A brake bending press called 'a knife press bending apparatus' has been widely adopted to manufacture thick, large and long pipe from initially thick plate. Submerged Arc Welded (SAW) pipes are also produced by employing press-brake bending. These pipes are mainly used for oil, natural gas and water pipelines. The principal process variables for press-brake bending can be summarized as stroke of the press-brake knife, the distance between both roll in the lower die, and the feeding length of the plate. Many combinations of these process variables are available, thus various pipe diameters can be realized. In the current study, a series of repetitive numerical simulations by feeding a thick plate with initial thickness of 25.4mm were conducted with the consideration of elastic recovery. Furthermore, an index for SAW pipe production is proposed which can be widely used in industry.

• Korea-Australia Rheology Journal
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• v.13 no.1
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• pp.37-45
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• 2001

Numerical simulation of coextrusion process of viscoelastic fluids within a die has been carried out. In the coextrusion process velocity profile at the outflow boundary is not known a priori, which makes it difficult to impose the proper boundary condition at the outflow boundary. This difficulty has been avoided by using the open boundary condition (OBC) method. In this study, elastic viscous stress splitting (EVSS) formulation with streamline upwind (SU) method has been used in the finite element method. In order to test the validity of the OBC method, comparison between the results of fully developed condition at the outlet and those of OBC has been made for a Newtonian fluid. In the case of upper convected Maxwell (UCM) fluid, the effect of outflow boundary condition on the interface position has been investigated by using two meshes having different downstream lengths. In both cases, the results with the OBC method showed reasonable interface shape. In particular, for the UCM fluid the interface shape calculated with OBC was independent of the downstream length, while the results with the zero traction condition showed oscillation of interface position close to the outlet. Viscosity difference was found to be more important than elasticity difference in determining the final interface position. However, the overshoot of interface position near the con-fluent point increased with elasticity.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.6_2
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• pp.1047-1053
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• 2022

The leaf spring for a truck absorbs shocks or vibrations from the road surface while driving with the elastic force of the material and prevents the shock from being transmitted to the vehicle body. It is subjected to cyclic stress, and fatigue fracture occurs frequently. This study analyzes fractured leaf spring from a 25 ton truck that has been operating for about a year. In the fractured portion, which is the origin of crack, inclusions were observed, and fatigue failure was caused by cyclic stress. In the stress calculation and FE analysis, the stress at the center of the leaf spring was obtained to be 54~65% of the yield strength of the base material and damaged material. It is most important to prevent the mixing of impurities in the steel manufacturing for leaf springs. The large stress portion of the leaf spring needs to introduce compressive residual stress by peening etc.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.1585-1593
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• 2015

3D-structured (embossed) aluminum sheets have been used in the heat insulation purpose for automative exhaust parts because of increasing their surface areas and stiffness reinforcement imposed in making the embossing pattern. However, there are many restrictions in press forming of the embossed sheet compared with the flat sheet (non-embossed one) because of its difference in the mechanical properties and the geometrical 3-dimensional shape. In this paper we investigated the deformation characteristic of embossed aluminum sheet in the incremental sheet forming process which has frequently used in the design verification and the trial manufacturing of sheet products. The single point incremental forming (SPIF) experiments for the rectangular cone forming using the CNC machine with a chemical wood-machined die and a circular tool shape showed that the formability of the embossed sheet are better than that of the flat sheet in view of the maximum angle of cone forming. This comes from the fact that the embossed sheet between the tool and the elastic die wall is plastically compressed and the flatted area contributes to increase the plastic deformation. Also the tool path along the outward movement from the center showed a better formability than that of the inward movement from the edge. However the surface quality for the tool path along the outward movement evaluated from the surface deflection is inferior than that of the tool path along the inward movement.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Journal of the Korean Society of Food Science and Nutrition
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• v.42 no.3
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• pp.427-433
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• 2013

This study was designed to examine changes in the physicochemical properties of extruded corn fibers with different amounts of feed moisture (30, 40, and 50%). The screw speed and die temperature were fixed to 200 rpm and $140^{\circ}C$, respectively. The crude ash, fat, and protein in corn fiber decreased from the extrusion process. The insoluble dietary fiber in corn fibers decreased, while soluble dietary fiber increased at a feed moisture of 30%. The specific length of the extruded corn fiber increased while the specific mechanical energy input, density, breaking strength, and elastic modulus decreased. The water absorption index (WAI) and reducing sugar content of the corn fibers did not significantly change, but the water soluble index (WSI) decreased as the feed moisture content of the corn fiber increased. On the other hand, the WAI of de-starched corn fiber decreased while WSI and reducing sugars increased as the feed moisture content of the corn fiber increased.

• Journal of Ocean Engineering and Technology
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• v.22 no.6
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• pp.75-82
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• 2008

Flame bending has been extensively used in the shipbuilding industry for hull plate forming In flame bending it is difficult to obtain the desired shape because the residual deformation dependson the complex temperature distribution and the thermal plastic strain. Mechanical bending such as reconfigurable press forming multi-point press forming or die-less forming has been found to improve the automation of hull plateforming because it can more accurately control the desired shape than line heating. Multi-point forming is a process in which external forces are used to form metal work-pieces. Therefore it can be a flexible and efficient forming technique. This paper presents an optimal approach to determining the press-stroke for multi-point press forming of curved shapes. An integrated configuration of Finite element analysis (FEA) and spring-back compensation algorithm is developed to calculate the strokes of the multi-point press. Not only spring-back is modeled by elastic plastic shell elements but also an iterative algorithm to compensate the spring-back is applied to adjust the amount of pressing stroke. An iterative displacement adjustment (IDA) method is applied by integration of the FEA procedure and the spring-back compensation work. Shape deviation between the desired surface and deform￡d plate is minimized by the IDA algorithm.