• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.334-336
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• 2009

An elastic-plasticity model during the austenitic decomposition was derived and implemented to incorporate the two important deformation behaviors observed during the phase transformations: the volumetric strain and transformation induced plasticity due to the temperature change and phase transformation. To obtain transformed phase volume fractions during cooling, the fourth order Runge-Kutta method was used to solve the Kirkaldy's phase kinetics model which is function of temperature, austenitic grain size and chemical composition. The volumetric strain was calculated by considering the densities of constituent phases, while the transformation induced plasticity was based on the micro-plasticity due to the volume mismatch between soft austenitic phase and other harder phases. The constitutive equations were implemented into the implicit finite element software and a simple boundary value problem was chosen as a model problem to validate the effect of transformation plasticity on the deformation behavior of steel under cooling from high temperature. It was preliminary concluded that the transformation plasticity plays a critical role in relaxing the developed stress during forming and thus reducing the magnitude of springback.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.10-14
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• 2002

Structural behavior of high-pressure composite vessels of TYPE 3 (full-wrapped over a seamless aluminum liner) was studied through numerical simulations based on 3D nonlinear finite element method. Under high-pressure loading, a TYPE 3 composite vessel shows material nonlinearity due to elastic-plastic deformation of aluminum liner, and mismatch of deformation at the junction of cylinder and dome causes geometrical nonlinearity. Finite element modeling and analysis technique considering this nonlinearity was presented, and a pressure vessel of 6.8L of internal volume was analyzed. Design specification to satisfy requirements was determined based on analysis results.

• Nuclear Engineering and Technology
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• 제52권12호
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• pp.2949-2957
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• 2020

Fatigue crack growth model has been developed for dissimilar metal weld joints of a piping component under cyclic loading, where in the crack is located at the center of the weld in the circumferential direction. The fracture parameter, Stress Intensity Factor (SIF) has been computed by using principle of superposition as K_H + K_M. K_H is evaluated by assuming that, the complete specimen is made of the material containing the notch location. In second stage, the stress field ahead of the crack tip, accounting for the strength mismatch, the applied load and geometry has been characterized to evaluate SIF (K_M). For each incremental crack depth, stress field ahead of the crack tip has been quantified by using J-integral (elastic), mismatch ratio, plastic interaction factor and stress parallel to the crack surface. The associated constants for evaluation of K_M have been computed by using the quantified stress field with respect to the distance from the crack tip. Net SIF (K_H + K_M) computed, has been used for the crack growth analysis and remaining life prediction by Paris crack growth model. To validate the model, SIF and remaining life has been predicted for a pipe made up of (i) SA312 Type 304LN austenitic stainless steel and SA508 Gr. 3 Cl. 1. Low alloy carbon steel (ii) welded SA312 Type 304LN austenitic stainless-steel pipe. From the studies, it is observed that the model could predict the remaining life of DMWJ piping components with a maximum difference of 15% compared to experimental observations.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2004년도 SMICS 2004 International Symposium on Maritime and Communication Sciences
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• 마이크로전자및패키징학회지
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• 제23권1호
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• pp.17-22
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• 2016

플렉서블 OLED는 매우 다양한 유기(organic) 및 무기 물질로 이루어져 있으며, 각 층을 증착하는 과정에 의하여 고온에 의한 휨(warpage)이 발생한다. 휨으로 인하여 발생한 굽힘 변형은 후속 공정에 많은 영향을 미치며, 궁극적으로 생산 수율 및 신뢰성을 저하시킨다. 본 연구에서는 플렉서블 OLED 소자의 고온 환경신뢰성 시험 및 공정 단계에서 발생하는 휨 변형을 수치해석을 이용하여 예측하였으며 실험 결과와 비교하였다. 이를 통하여 휨에 가장 큰 영향을 미치는 재료를 파악하고, 궁극적으로 휨을 최소화 함으로써 플렉서블 OLED의 신뢰성을 향상시키고자 하였다. 휨의 측정 및 수치해석 결과, 편광 필름과 베리어 필름이 휨에 많은 영향을 줌을 알 수 있었으며, OCA가 휨에 미치는 영향은 미미하였다. 플렉서블 OLED의 휨에 가장 큰 영향을 주는 소재는 plastic cover이였으며, 휨을 최소화하기 위한 plastic cover 소재의 최적 물성을 실험계획법으로 계산한 결과, 탄성 계수는 4.2 GPa, 열팽창계수는 $20ppm/^{\circ}C$ 일 경우 플렉서블 OLED의 휨은 1 mm 이하가 됨을 알 수 있었다.

• 대한기계학회논문집A
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• 제36권2호
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• pp.187-194
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• 2012

일반적으로 복합재의 강도에 대한 크기 효과는 입자강화 알루미늄 복합재 제조시, 입자와 기지재를 압밀한 후 냉각할 때 입자와 기지재 사이의 열팽창계수 차에 의하여 기지재에 펀칭되는 기하적 필수 전위와, 변형 중 입자와 기지재사이의 탄소성 강성도 차로 인해 발생하는 변형률 구배 소성으로 인한 기하적 필수 전위가 주로 영향을 미치는 것으로 알려져 있다. 본 논문에서는 이러한 두 종류의 기하적 필수 전위를 전위 소성 이론에 입각하여 강도로 환산한 후 계층적으로 입자 주위 유한요소 영역에 할당하여 동일한 체적비에서 입자의 크기에 따라 변화하는 복합재의 파손 거동을 효과적으로 예측하였다. 이 방법을 적용함으로써 구형입자의 경우 간단한 축대칭 유한요소 모델링과 실험데이터를 연계하여 입자강화 복합재의 입자 크기 의존 강도 및 파손 효과를 수월하게 예측할 수 있음을 보였다. 또한 서로 다른 입자의 체적비 및 크기에 대하여SiC강화 알루미늄 2124-T4 복합재의 강도와 파손 거동이 분명한 차이가 있음을 보인다.