• 한국주조공학회지
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• 제18권5호
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• pp.474-480
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• 1998

Microstructural characteristics of semi-solid state processed hypereutectic Al-Si alloys have been investigated. Main concern of the present study is to investigate the effects of P and Sr addition on the size and morphology change of the primary Si particles. Refinement of the primary Si particles was observed with the addition of P and Sr at the early stage of semi-solid state processing, but such a refining effects became negligible resulting in Si particles with a near-spherical morphology with continuous stirring. This implies that the microstructural transformation mechanism became more dependent to stirring effects than to the alloying effects during semi-solid state processing. Brittle fracture and agglomeration were proposed as the mechanisms for microstructural alterations during semi-solid state processing.

• 대한전자공학회논문지
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• 제27권12호
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• pp.1859-1864
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• 1990

The effect of H+ and OH- ion concentrations at doped Si semiconductor/pH buffer solution interfaces were investigated in terms of cyclic current-voltage characteristics. The effects of space charge on oppositely doped Si semiconductors, i.e., p-and n-Si semiconductors, can be effectively applied to study the pH effects and the slow surface states at the interfaces. The adsorptions of H+ and OH- inons on the doped Si semiconductor surfaces are physical adsorption rather than chemical adsorption. Adsorptive processes and charging effects of the slow surface states can be explained as the potential barrier variations and the related current-voltage characteristics at the interfaces. Under forward bias, the charged slow surface states on the p-and n-si semiconductor surface are donor and acceptor slow surface states, respectively. The effects of minority carriers on the slow surface states can be neglected at the doped Si semiconductor interfaces.

• Journal of Welding and Joining
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• 제15권5호
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• pp.104-114
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• 1997

The microstructure and bond strength were investigated on the SiC/SiC and SiC/mild steel joints brazed by Ag-5at%Ti alloy. Ag-5at%Ti-2at%Fe and -5at%Fe brazing alloys were also used to see the effects of Fe addition on the bond strength of SiC/SiC brazed joints. Brazing temperature and brazing gap were selected and examined as brazing variables. The microstructure of SiC/SiC brazed joints was affected by Fe addition to the Ag-5at%Ti alloy, but the bond strength was not. Increasing brazing temperature also changed the microstructure of $Ti_5Si_3$ reaction layer and brazing alloy matrix of the SiC/SiC and SiC/mild steel joints, but not the bond strength. Brazing gap had a great effects on the bond strength. Decreasing brazing gap from 0.2 mm to 0.1 mm in SiC/SiC brazing increased the bond strength from 187 MPa to 263 MPa and, in SiC/mild steel brazing, from 189 MPa to 212 MPa. It was concluded that the most important parameter on the bond strength in SiC/SiC and SiC/mild steel brazing was the relative ratio between brazing gap and specimen size.

• 한국주조공학회지
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• 제15권6호
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• pp.588-595
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• 1995

SiC particles reinforced Mg-Zr, Mg-Zn and Mg-Zn-Zr composites were manufactured by Rheocompocasting method. Effects of Zn, Zr addition on microstructures and hardness were investigated by using the micro Vickers hardness tester, the optical and scanning electron microscopy. By the Zr addition to the pureMg/SiCp composites, SiC particles become more homogeneously dispersed and grain refined so that the micro hardness of the composite increased. In case of Zn addition, although grain refinement and homogeneous dispersion effects of SiC particles were not obtained, hardness was more increased than the only Zr added composite by the formation of many Mg-Zn intermetallic compounds at grain boundary. In the Mg-Zn-Zr/SiCp composite, the highest value of hardness was obtained by triple effects such as grain refining, dispersion hardening of SiC particles and Mg-Zn compounds.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1019-1021
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• 1995

Light induced degradation of hydrogenated amorphous silicon(a-Si:H) are related to the number of weak dangling bonds which are thought to be responsible for the Staebler-Wronski effects, and caused the many photoelectric problems in applications of thin film transistors and solar cell, etc. In this paper, we deposited fluorinated amorphous silicon films(a-Si:H;F) with $SiH_4$ and $SiF_4$ gas mixture and investigated the effects of fluorine atoms on the evoluations of the crystallinity and improvements of light instability. We have found that micro-crystallinity produced in a-SI:H;F films and marked maximum value of 22% at the flow rate of $SiH_4:SiF_4$=2:10 sccm by UV spectrophotometer measurement, while n-Si:H film deposited with only $SiH_4$ gas showed no crystallinity. Light-induced degradation property of a-Si:H;F films is also improved which is mainly due to the etching effects of fluorine atoms on the weak Si-Si bonds and unstable hydrogen bonds. It is considered that involving fluorine atoms in a-Si:H films may contribute to the suppression of light-induced degradation and evolution of micro-crystallinity.

• 한국표면공학회지
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• 제23권3호
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• pp.160-166
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• 1990

The effects of the variation of proedd varibles on the flow patterns and effects of the flow patterns on the deposition rate and uniformity in the Si-epitaxy CVD with SiH4 as the source of Si were studied through the calculation by use of control volume method. The reslts showed that the natural convection was undesirable to the uniformity of deposition rate, whose effects were decreased with the dercrese with the decrese of the pressure in the reactoor and with the increase of the flow rate. However. the excessive increase of flow rate caused the movement of the unreacted gas to the substrate. Therefore it resulted in the non-uniform depositions. The rotation of substrate was apperared to improve the uniformity. The resulte of this study could used in CVD process to design the reator and to find the optimum conditions of the process variables.

• 한국세라믹학회지
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• 제20권2호
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• pp.115-122
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• 1983

There has been many controversies about the effects of additive in sintering of SiC But no prior systematic work has been reported about the difference between the effects of B and $B_4C$ as additive. The sintering behavior of SiC and its strength are studied and the optimum concentrations of additives and sintering conditions for SiC are determined. The effects of B and $B_4C$ have same effects on reactive sintering of SiC except the easiness of transport via vapor phase for uniform distribution in case of B. The strength of sintered SiC without exaggerated grain growth is limited by surface flaws and is nearly independent of temperature up to 140$0^{\circ}C$.

• 한국세라믹학회지
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• 제36권10호
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• pp.1007-1015
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• 1999

The Si3N4 composites reinforced with carbon-coated SiC whiskers were fabricated by hot-pressing at 180$0^{\circ}C$ for 2 hours to examine the effects of carbon-coated whiskers on the mechanical properties of SiC whisker reinforced Si3N4 composites. The flexural strength of the Si3N4 composites and Si3N4 monolith respectively. The weak interfacial bond between carbon-coated SiC whiskers and Si3N4 matrix which enhances the crack deflection and whisker pull-out could contribute to the improvement of mechanical properties of the composites.

• 한국세라믹학회지
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• 제45권1호
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• pp.69-74
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• 2008

The effects of $SiO_2$ impurity on the high temperature resistivities of AIN ceramics have been investigated. When $SiO_2$ was added into 1 wt% $Y_2O_3$-doped AIN, DC resistivities have decreased and electrode polarizations disappeared. Impedance spectroscopy showed two semi-circles at $600^{\circ}C$, which were attributed to grain and grain boundary, respectively. $SiO_2$ doping had more significant effects on the grain resistivity than grain boundary resistivity, implying that doped Si acted as a donor in AIN lattice. In addition, voltage dependency of DC resistivity was observed, which might be related to dependency of size of grain boundary semi-circle on the bias voltage in impedance spectroscopy.

• Journal of Korean Vacuum Science & Technology
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• 제5권1호
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• pp.11-18
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• 2001

Dielectric passivation effects on the EM(electromigration) have been a great interest with recent ULSI and multilevel structure tends in thin film interconnections of a microelectronic device. SiO$_2$, PSG(phosphosilicate glass), and Si$_3$N$_4$ passivation materials effects on the EM resistance were investigated by utilizing widely used Al-1%Si thin film interconnections. A standard photolithography process was applied for the fabrication of 0.7㎛ thick 3㎛ wide, and 200㎛ ~1600㎛ long Al-1%Si EM test patterns. SiO$_2$, PSG, and Si$_3$N$_4$ dielectric passivation with the thickness of 300 nm were singly deposited onto the Al-1%Si thin film interconnections by using an APCVD(atmospheric pressure chemical vapor deposition) and a PECVD(plasma enhanced chemical vapor deposition) in order to investigate the passivation materials effects on the EM characteristics. EM tests were performed at the direct current densities of 3.2 $\times$ 10$\^$6/∼4.5 $\times$ 10$\^$6/ A/cm$^2$ and at the temperatures of 180 $\^{C}$, 210$\^{C}$, 240$\^{C}$, and 270$\^{C}$ for measuring the activation energies(Q) and for accelerated test conditions. Activation energies were calculated from the measured MTF(mean-time-to-failure) values. The calculated activation energies for the electromigration were 0.44 eV, 0.45 eV, and 0.50 eV, and 0.66 eV for the case of nonpassivated-, Si$_3$N$_4$passivated-, PSG passivated-, and SiO$_2$ passivated Al-1%Si thin film interconnections, respectively. Thus SiO$_2$ passivation showed the best characteristics on the EM resistance followed by the order of PSG, Si$_3$N$_4$ and nonpassivation. It is believed that the passivation sequences as well as the passivation materials also influence on the EM characteristics in multilevel passivation structures.