• Journal of the Korean Institute of Telematics and Electronics
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• v.20 no.3
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• pp.33-39
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• 1983

New Schottky devices with thin stepped oxide layer (about 1000 ${\AA}$) along the edge of metal-semiconductor junction have been designed and fabricated. The breakdown voltages of these diodes have been compared with those of conventional metal overlap and P guard ring Schottky diode structures. Thin stepped oxide layer has been grown by the process of T.C.E. oxidation. In order to compare and demonstrate the improved down phenomena of these devices, conventional metal overlap diode and P guard ring which have the same dimension with new devices have also been integrated in a same New Schottty devices structured with thin stepped oxide layer have shown significant improvement in breakdown phenomena compared with conventional diodes.

• Journal of Welding and Joining
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• v.17 no.3
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• pp.71-78
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• 1999

The welded metal bellows is commonly manufactured by welding pairs of washer-shaped discs of thin sheet metal stamped from strip stock in thickness from 0.025 to 0.254 mm. The discs, or diaphragms, are formed with mating circumferential corrugations. In this study, the diaphragms were welded by using a CW Nd: YAG laser to form metal bellows. The bellows was fixed on a jig and compressed axially, while Cu-rings were installed between belows edges for intimate contact of edges. The difference between the inner diameter of bellows and jig shaft causes an eccentricity, while the tolerance between motor shaft and jig shaft causes a wobble type motion. A vision sensor which is based on the optical triangulation was used for seam tracking. An image processing algorithm which can distinguish the image by bellows edge from that by Cu-ring was developed. The geometric relationship which describes the eccentricity and wobble type motion was modeled. The seam tracking using the image processing algorithm and the geometric modeling was performed successfully.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.155-160
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• 2023

The potential performance benefits of Silicon Carbide(SiC) MOSFETs in high power, high frequency power switching applications have been well established over the past 20 years. In the past few years, SiC MOSFET offerings have been announced by suppliers as die, discrete, module and system level products. In high-voltage SiC vertical devices, major design concerns is the edge termination and cell pitch design Field Limiting Rings(FLR) based structures are commonly used in the edge termination approaches. This study presents a comprehensive analysis of the impact of variation of FLR and JFET region on the performance of a 3.3 kV SiC MOSFET during. The improvement in MOSFET reverse bias by optimizing the field ring design and its influence on the nominal operating performance is evaluated. And, manufacturability of the optimization of the JFET region of the SiC MOSFET was also examined by investigating full-map electrical characteristics.

• Journal of the Korea Furniture Society
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• v.16 no.1
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• pp.17-23
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• 2005

European maple is famous for the optimum solid wood for making bridge which is the most important part in violin acoustics. This study was carried out to investigate the variation of main features, i. e. annual ring width and cutting direction of costly imported violin bridge blanks and to examine the effect of these features of the blanks on the vibrational characteristics of bridge blanks. Imported violin bridge blanks had somewhat large variation in major macroscopical and physical properties and there was little relationship between annual ring density and weight of maple blanks. Resonant frequency of violin bridge blanks had some positive correlation with weight, however, damping having negative relationship with frequency was seldom affected by any physical properties of the maple blanks. Deviation from the radial cutting of tail side(ray direction from top toward feet on the edge of bridge blank) lowered the resonant frequency. Consequently, weight and ray direction should be taken for the critical quality decisive factors(QDF) of incoming bridge blanks by not only inspectors also luthiers who tune the bridge by shaping and are responsible for the final timbre quality of this complicate instrument.

• Journal of the Korean Mathematical Society
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• v.49 no.1
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• pp.85-98
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• 2012

Let R be a commutative ring and I its proper ideal, let S(I) be the set of all elements of R that are not prime to I. Here we introduce and study the total graph of a commutative ring R with respect to proper ideal I, denoted by T(${\Gamma}_I(R)$). It is the (undirected) graph with all elements of R as vertices, and for distinct x, y ${\in}$ R, the vertices x and y are adjacent if and only if x + y ${\in}$ S(I). The total graph of a commutative ring, that denoted by T(${\Gamma}(R)$), is the graph where the vertices are all elements of R and where there is an undirected edge between two distinct vertices x and y if and only if x + y ${\in}$ Z(R) which is due to Anderson and Badawi [2]. In the case I = {0}, $T({\Gamma}_I(R))=T({\Gamma}(R))$; this is an important result on the definition.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.188-191
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• 2005

Two different coverlayers which is useful for an optical buffer and a mechanical protection made of not only UV resin but also polycarbonate coversheet were prepared on small form factor optical disks. Thin coverlayer of 10 ${\mu}m$ and thick coverlayer of 80 ${\mu}m$ were fabricated. 10 ${\mu}m$-thick coverlayer was coated using UV resin material by spin coating method for the flying optical head application. On the other hand, 80 ${\mu}m$-thick coverlayer using coversheet with the resin bonding material was prepared for the non-flying optical head application. Both cases, the thickness uniformity seem to be the primary prerequisite factor, and it was analyzed. Thickness of 10 ${\mu}m$-thick UV resin coverlayer could be controlled within ${\pm}0.2m$ range and 80 ${\mu}m$-thick coversheet could be controlled within ${\pm}3{\mu}m$ range. However, the yield of such thickness tolerance was not good. New design of metal housing holder and polycarbonate outer ring was adopted to diminish the ski-jump phenomenon. Specifically, the polycarbonate outer ring was very effective to reduce the ski-jump. However, it should be careful to maintain uniform edge between disk and ring for the perfect coverlayer.

• Journal of Power System Engineering
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• v.20 no.6
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• pp.40-45
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• 2016

The manufacturing process of large scaled Al 7050 alloy is difficult for the occurrence of solidification crack during casting. The aims of this study are the evaluations of microstructure and mechanical properties of extruded Al 7050 billet and ring forged one with large scale. Large scaled Al 7050 billet was casted by direct-chill casting process. The extruded and ring forged specimens were prepared from the casted ingot after residual stress relief and homogenization heat treatment, respectively. Microstructures, hardness and tensile test of the surface, middle and center part of each specimen were performed at room temperature. Sheared and elongated type grains were observed at the edge parts of surface and center area and its aspect ratios of grains were low and similar as 0.21 while that of middle area was closed to 0.92 value in ring forged Al 7050 alloy. The mechanical properties of extruded Al 7050 alloy were superior than those of ring forged one. The hardness values of surface and center part were slightly higher than that of middle part in ring forged Al 7050 alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.396-399
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• 2003

4H-SiC un diodes with field limiting rings(FLRs) were fabricated and characterized. The dependences of reverse breakdown voltage on the number of FLRs, the distance between p-base main junction and first FLR, and activation temperatures, were investigated. Al and B ions were implanted and activated at high temperature to form p-base region and p+ region in the n-epilayer. We have obtained up to 1782V of reverse breakdown voltage in the un diode with two FLRs on loom thick epilayer. The differential on-resistances of the fabricated diode are $5.3m{\Omega}cm^2$ at $100A/cm^2$ and $2.7m{\Omega}cm^2$ at $1kA/cm^2$, respectively. All pn diodes with FLRs have higher avalanche breakdown voltages than that of diode without an FLR. Regardless of the activation temperature, the un diode with a FLR located 5um apart from main junction has the highest mean breakdown voltage around 1600V among the diodes with one ring. On the other hand, the pn diode with two rings showed different behavior with activation temperature. It reveals that high voltage SiC pn diodes with low on-resistance can be fabricated by using the FLR edge termination.

• Journal of Chest Surgery
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• v.56 no.1
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• pp.56-58
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• 2023

Untreated severe tricuspid regurgitation (TR) is associated with poor outcomes. Functional TR occurs secondary to dilatation of the annulus and tethering of the leaflets. Ring annuloplasty alone can correct most cases, but is insufficient in cases of severe annular dilatation due to severe leaflet tethering. In such cases, a tricuspid edge-to-edge technique may be an option. However, stitching of the leaflet tips alone is likely to result in tearing of the leaflets. Approximation of the durable chordae tendineae is considered helpful for this problem. Herein, we present the case of a 39-year-old man who had undergone open-heart surgery for acute type A aortic dissection 13 months earlier. A right mini-thoracotomy approach with a beating-heart strategy was used, which did not require unnecessary pericardial adhesiolysis and dissection. This technique had the advantage of reducing the operation time and the risk of bleeding. To summarize, we present a case of tricuspid valve repair in a high-risk patient with severe leaflet tethering that was successfully managed using these methods.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.171-171
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• 2009

We have investigated the impact of coffee ring effect on the inkjet-printed $Al_2O_3$ thick films. In a single solvent system such as Dimethylformamide, the coffee-ring-pattern has appeared on the edge of sessile drop after evaporation. The peak-to-valley height difference in $Al_2O_3$ coffee ring is over 2um. This non-uniform deposition of $Al_2O_3$ over the surface leads to sever surface roughness of the inkjet-printed films. However, we have manipulated our printing parameters to improve the surface roughness and the packing density of the printed $Al_2O_3$ films. Our inkjet-printed $Al_2O_3$ films show 10 times smoother surface than the initially printed sample's surface. Also the packing density of the printed Ah03 film becomes 70% of high packed $Al_2O_3$. In this presentation, we would like to present the key process parameters of the inkjet printing process to overcome the genetic coffee ring problem.