• Proceedings of the Korea Society for Industrial Systems Conference
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• 2001.05a
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• pp.224-231
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• 2001

Hydrogenated amorphous carbon films were deposited by ERC-PECVD with deposition conditions, such as ECR power, gas composition of methane and hydrogen, deposition time, and substrate bias voltage. The characteristics of the film were analyzed using the AES, ERDA, FTIR. Raman spectroscopy and micro hardness tester. From the results of AES and ERDA, the elements in the deposited film were confirmed as carbon and hydrogen atoms. FTIR spectroscopy analysis shows that the atomic bonding structure of a-C:H film consisted of sp³and sp²bonding, most of which is composed of sp³bonding. The structure of the a-C:H films changed from CH₃bonding to CH₂or CH bonding as deposition time increased. We also found that the amount of dehydrogenation in a-C:H films was increased as the bias voltage increased. Raman scattering analysis shows that integrated intensity ratio (I/sub D//I/sub G/) of the D and G peak was increased as the substrate bias voltage increased, and films hardness was increased.

• Journal of Korean Society on Water Environment
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• v.20 no.3
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• pp.281-289
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• 2004

Optimal analytical conditions have been established for mixing and reaction coil length, concentrations of ECR, CTAB, and acetate, reaction temperature and pH in the determination of aluminum by using flow injection analysis(FIA). Detection limit and repeatability for this system were $3{\mu}g/L$ and better than 1% of relative standard deviation, respectively. The interference from iron(III) was suppressed up to 6mg/L of iron(III) by $0.1{\mu}M$ ascorbic acid, and the interference from fluoride could be tolerated in absorption of Al/ECR/CTAB derivative by 10mM boric acid at pH 3.5 adjusted with nitric acid. This FIA system was applied to the determination of aluminum leached from cooking utensils by distilled and tap water containing fluoride ranged from 0.5 to 2mg/L by measurement of absorbance for Al/ECR/CTAB at 585nm. The leached aluminum content was increased with increasing concentration of fluoride. The aluminum contents leached from aluminum utensils by tap water were about 9 fold higher than those leached by distilled water, whereas aluminum contents leached by distilled water containing fluoride were about 2 fold higher compared to those leached by distilled water. That represented that other dissolved substances as well as fluoride in tap water contributed to liberation of aluminum from aluminum utensils. A comparison between FIA data and ICP-AES data by correlation and paired t test showed that the FIA system could be accepted as a good alternative method for the determination of aluminum in tap water.

• Korean Journal of Materials Research
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• v.13 no.3
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• pp.174-179
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• 2003

Thin copper films were grown by electrodeposition on copper seed layers which were grown by sputtering of an ultra-pure copper target on tantalum nitride-coated silicon wafers and subsequently, cleaned in ECR plasma. The copper films were then subjected to ⅰ) vacuum annealing, ⅱ) rapid thermal annealing (RTA) and ⅲ) rapid thermal nitriding (RTN) at various temperatures over different periods of time. XRD, SEM, AFM and resistivity measurements were done to ascertain the optimum heat treatment condition for obtaining film with minimum resistivity, predominantly (111)-oriented and smoother surface morphology. The as-deposited film has a resistivity of ∼6.3 $\mu$$\Omega$-cm and a relatively small intensity ratio of (111) and (200) peaks. With heat treatment, the resistivity decreases and the (111) peak becomes dominant, along with improved smoothness of the copper film. The optimum condition (with a resistivity of 1.98 $\mu$$\Omega$-cm) is suggested as the rapid thermal nitriding at 400oC for 120 sec.

• Korean Journal of Materials Research
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• v.7 no.2
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• pp.93-101
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• 1997

Lead titanate박막을 $Pt/Ti/SiO_{2}/Si(Pt/Ti기판)와\;Pt/Ta/SiO_{2}/SiO_{2}$Si(Pt/Ta 기판) 위에서 전자 사이크로트론 공명플라즈마 화학증착법(ECR PECVD)으로 증착하였다. 증착온도, 산소유입량, MO source유입비등의 증착변수에 따른 lead titanate박막의 조성과 미세구조를 주사전자현미경(SEM), 투과전자현미경(TEM), X선 회절법(XRD)으로 조사하였다. 산소유입량이 적을 경우,Tisource와 Pb source의 산소화의 반응성 차이 때문에 Pb 농도가 부족한 화학양론비가 잘 맞는 박막이 증착되었다. Pt/ti기판은 lead titanate박막증착도중 기판의 Ti층과 Pt층의 확산으로 기판변형이 발생하는 반면, Pt/Ta기판은 기판변형이 일어나지 않았다. Pt/Ta기판에서 페롭스카이트 화학양론비를 갖는 매우 평탄한 lead titanate박막을 증착 하였는데, 산소유입량이 lead titanate박막의 결정성을 크게 지배하였다.

• Proceedings of the Korea Concrete Institute Conference
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• 1995.04a
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• pp.396-401
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• 1995

Epoxy coated reinforcing steels (ECRs) were acquired from ten sources and coatings from each source were initially characterized in terms of defects, thickness, solvent extraction weight loss and hardness. Testing involved exposure in three aqueous solutions at elevated temperature (8$0^{\circ}C$) and in chloride-contaminated concrete slabs under outdoor exposure, It was found that the density and size of coating defects was the promary factor affecting ECR performance. The equivalent circuit analysis using electrochemical impedance spectroscopy (EIS) data indicated that the impedance response for well-performing ECR specimens showed no signs of active degradation at the interface although diffusional processes similar to those noted for poorly performing bars occurred here. Experimental results also indicated a relationship between corrosion behavior and bar source. Weight loss upon solvent extraction correlated with impedance reduction from hot water exposure. Coating defects during most of the tests, especially in high pH solutions containing chloride ions. ECRs with excessive coating defects, either initially present or ones which developed in service, performed poorly in every test category regardless of source. Forms of coating failure were extensive rusting at defects, blistering, wet adhesion loss, cathodic delamination, underfilm corrosion and coating cracks. These occurred sequentially or concurrently, depending on the condition of the ECR and nature of the environment

• Korean Journal of Materials Research
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• v.7 no.8
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• pp.635-639
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• 1997

ECR-PECVD법을 사용하여 450-49$0^{\circ}C$이하의 온도에서 Pt/SiO$_{2}$/Si기판 위에 PZT 박막을 증착하였다. 기판 온도가 46$0^{\circ}C$ 이하일 경우에는 페로브스이트 상과 제2상으로 이루어진 박막이 성장하였으며 기판온도가 47$0^{\circ}C$이상일 때에는 페로브스카이트 단일상의 PZT 박막이 성장하였다. 49$0^{\circ}C$에서 매우 얇은 페로브스카이트의 PZT 박막을 증착한 후 $650^{\circ}C$에서 1분간 raped thermal annealing(RTA) 처리한 결과 박막의 조성과 결정성에는 거의 변화가 없었으나 박막의 전하 저장 밀도는 크게 향상되었다. 이는 RTA 처리에 의한 저유전 계면층의 소멸이 주된 이유라고 판단된다. 열처리 후 두께 40-45nm의 PZT박막은 200kV/cm의 전장 하에서 $10^{-6}$$\textrm{cm}^2$이하의 누설전류값을 갖고 있었으며, 인가전압 1V에서 300fF/$\mu$$m^2$의 정전용량, 즉 SiO$_{2}$환산두께 0.12nm를 나타내었다.

• Journal of the Korean Ceramic Society
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• v.31 no.11
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• pp.1330-1336
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• 1994

Ta2O5 films were deposited on the p-Si(100) substrates by ECR-PECVD and annealed in O2 atmosphere. The thicknesses of Ta2O5/SiO2 layers were measured by an ellipsometer and a cross-sectional TEM. Annealing in O2 atmosphere enhanced the stoichiometry of the Ta2O5 film and reduced the impurity carbon content. Ta2O5 films were crystallized at the annealing temperatures above 75$0^{\circ}C$. The best leakage current characteristics and the maximum dielectric constant of Ta2O5/SiO2 film capacitor were observed in the specimen annealed at $700^{\circ}C$ and 75$0^{\circ}C$, respectively. The flat band voltage of the Al/Ta2O5/SiO2/p-Si MOS capacitor was varied in the range of -0.6~-1.6 V with the annealing temperature. The conduction mechanism in the Ta2O5 film, the variation of the effective oxide charge density with the annealing temperature, and the effective electric field distribution in the Ta2O5/SiO2 double layer were also discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.397-397
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• 2011

최근 태양전지 연구가 활발히 진행되는 가운데 저가 고효율 태양전지로 제안되는 제3세대 태양전지로 Quantum Dots (QD: 양자점) 태양전지에 대한 연구가 많은 연구자들에 의해 관심이 모아지고 있다. 현재까지 보고된 최고효율은 NSWU의 13%의 효율을 보고하고 있으며, 국내에서도 다양한 분야에서 연구가 진행되고 있다. 본 연구에서는 기존의 PECVD에서 문제시 되고 있는 플라즈마에 의한 박막손상과 고온 증착온도 등의 단점을 보완한 증착 기술로 중성입자빔 (Hyper-thermal neutral beam ; HNB)을 이용한 저온 증착방법에 대한 연구를 진행하였다. 유리기판과 p-type Si 기판 그리고 SiNx 박막 위에 Ar, He, H2, 그리고 SiH4 가스를 소스 가스로 활용하여 ECR-microwave 플라즈마에서 생성된 중서입자빔을 이용한 Si 양자점을 형성하였고, Si 양자점 형성 특성과 크기제어 방법에 대한 연구를 진행하였다. 또한 TEM, FTIR, Raman, Photo Luminescence 등의 분석 방법을 이용하여 결정성 및 성분 등을 분석하여 HNB의 특성 및 효과를 규명하였다.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.31 no.2
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• pp.112-121
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• 2008

Nowaday the supply chain competitiveness is emphasized more and more than a company's own competitiveness. One of the most important processes in import and export is a publication over the Bill of Loading. In the publication of those bills S/R(shipping request) and check B/L for reviewing are circulated among consignors, forwarders, shipping companies and airlines by fax and e-mail. Or there should be expensive a One to One system, like an EDI. Each party has to re-input S/R data to their own systems and check it several times. The S/R data are converted digital to analog type and analog to digital repeatedly to check in the process. As the process goes by there can be not only input data errors but also waste of time and cost. ECR(electronic character recognition) is a technology can solve the Problem. Considering the data structure of documents in many systems used ECR samples SIR data from documents written in the digital type. But it is not enough with it only. To make N to N composition in reality more efficient we make a documents hub on the web reengineering the existing process to One to One relation. The ECR documents hub system has given us beneficial effects over a year throughout a field test.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.63-67
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• 2001

Up to now, most studies about Pt-etching have been focused on physical sputtering mechanism with Cl-based plasma, while only a limited results are available for etching characteristics with fluorine-based plasma. In this study, etch characteristics of Pt thin film with $Cl_2$/Ar and $SF_{6}$/Ar Ar gas chemistries have been studied with ECR plasma etching system. It is confirmed that $SF_{6}$/Ar Ar plasma chemistry could make volatile etch-products through the reaction with Pt thin film. Also the improvement in etch rate, etch profile and surface roughness is obtained due to the formation of volatile platinum fluoride compounds.