• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.11
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• pp.121-129
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• 1998

In-plane ESPI(Electronic Speckle Pattern Interferometry) was devised to measure in-plane deformations and rotation of a specimen with laser in this study. ESPI is a optical measuring method to be able to measure the deformations of engineering components and materials in industrial fields. The conventional measuring methods of surface deformations such as the strain gauge have many demerits because they are contact and point-to-point measuring ones. But that ESPI is noncontact, nondestructive and whole field measuring method can overcome previous disadvantages. We used ESPI which is sensitive to in-plane displacement for measuring in-plane deformations of a disk. And the 4-frame phase shifting method was used for the quantitative analysis. First of all, the system calibration was done due to an in-plane rotation before getting deformations of a disk. Finally we showed good agreement between the experiment results and those of the FEA(Finite Element Analysis).

• Journal of the Korean Society for Precision Engineering
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• v.11 no.1
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• pp.114-122
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• 1994

ESPE(Electonic-Speckle-Pattern-Interferometry) is very useful method for measuring In-plane displacement. Using the CW-Laser and Image processing system, it is possible to measure displacement and strain. Unlike traditional straingauge or moire' method, ESPI method requires no special surface preparation or attachments and can be measured In-plane displacement with no contact and real time. In this experimental specimen was loaded in paralled with loadcell, which provided loading step. The specimen was sheet plate, which was attached straingauge in x-y direction. In this study provides an example of how ESPI has been used to measure two dimensional displacement and strain distribution in this specimen. The results measured by ESPI compare with the data which was measured straingauge method in tensile testing at 1 ton range.

• Journal of Mechanical Science and Technology
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• v.19 no.3
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• pp.820-825
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• 2005

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.240-245
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• 2004

Tensile properties of hard coating material, TiN, were evaluated using micro-tensile testing system. TiN has been known as a hard coating material commonly used today. Micro-tensile testing system consisted of a micro tensile loading system and a micro-ESPI(Electronic Speckle Pattern Interferometry) system. Micro-tensile loading system had a maximum load capacity of 500mN and a resolution of 4.5 nm in stroke. TiN thin film $1{\mu}m$ thick was deposited on the Si wafer pre-deposited of $Si_3N_4$ film substrate by the closed field unbalanced magnetron sputtering (CFUBMS) process. Three kinds of micro-tensile specimen with the respective width of $50{\mu}m$, $100{\mu}m$ and $500{\mu}m$ were fabricated by MEMS process. The mechanical properties including tensile strength and elastic modulus were determined using the micro-tensile testing system and compared by those obtained by nano-indentation

• Journal of the Korean Society for Nondestructive Testing
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• v.14 no.2
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• pp.101-111
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• 1994

Electronic speckle pattern interferometry(ESPI) using a CW laser, a video system and an image processor were applied to the in-plane displacement measurements. Unlike traditional strain gauges or Moire method, ESPI method requires no special surface preparation or attachments and it can be measured in-plane displacement without any contact and real time. In this experiment, specimen was loaded in paralled with a loa cell. The specimen was plance to which strain gauges was attached. The study provides an example of how ESPI have been used to measure displacement and strain distribution in this specimen. The results measured by ESPI were compared with the data which were measured by strain gauge method in tensile testing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.29-33
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,000$^{\circ}C$. Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 800$^{\circ}C$. There needs to measure the data up to 800$^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000$^{\circ}C$. In previous studies related to thermal strain analysis, the quantitative results are not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,000$^{\circ}C$and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1％ blow 600$^{\circ}C$ however, there is some difference up to 600$^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 800$^{\circ}C$. The reason is the phase transformation of STS430 probably begins at 800$^{\circ}C$.

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.50-56
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• 2013

Optical-fiber electronic speckle pattern interferometry (ESPI) is a non-contact, non-destructive examination technique with the advantages of rapid measurement, high accuracy, and full-field measurement. The optical-fiber ESPI system used in this study was compact and portable with the advantages of easy set-up and signal acquisition. By suitably configuring the optical-fiber ESPI system, producing an image signal in a charge-coupled device camera, and periodically modulating beam phases, we obtained phase information from the speckle pattern using a four-step phase shifting algorithm. Moreover, we compared the actual defect size with that of interference fringes which appeared on a screen after calculating the pixel value according to the distance between the object and the CCD camera. Conventional methods of measuring defects are time-consuming and resource-intensive because the estimated values are relative. However, our simple method could quantitatively estimate the defect length by carrying out numerical analysis for obtaining values on the X-axis in a line profile. The results showed reliable values for average error rates and a decrease in the error rate with increasing defect length or pressure.

• Journal of the Korean Society of Industry Convergence
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• v.5 no.3
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• pp.187-192
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• 2002

In-plane ESPI(Electronic Speckle Patten Interferometry)was devised to measure in~plane defamation and rotation of a specimen with laser in this study. The conventional measuring methods of surface deformations such as the strain gauge have many demerits because they are contact and point-to-point measuring ones. But that ESPI is noncontact, nondestructive and whole field measuring method can overcome previous disadvantages. We used ESPI which is sensitive to in-plane displacement for measuring in-plane deformations of a disk. First of all, the system calibration was done due to an in-plane rotation before getting deformations of a disk. Finally we showed good agreement between theexperiment results and those of the FEA(Finit Element Analysis).

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.78-83
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• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.