• Nuclear Engineering and Technology
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• v.51 no.4
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• pp.1132-1141
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• 2019

Steel-concrete-steel (SCS) sandwich structures have important advantages over conventional concrete structures, however, bond-slip between the steel plate and concrete may lead to a loss of composite action, resulting in a reduction of stiffness and fatigue life of SCS sandwich structures. Due to the inaccessibility and invisibility of the interface, the interfacial performance monitoring and debonding detection using traditional measurement methods, such as relative displacement between the steel plate and core concrete, have proved challenging. In this work, two methods using piezoelectric transducers are proposed to detect the bond-slip between steel plate and core concrete during the test of the beam. The first one is acoustic emission (AE) method, which can detect the dynamic process of bond-slip. AE signals can be detected when initial micro cracks form and indicate the damage severity, types and locations. The second is electromechanical impedance (EMI) method, which can be used to evaluate the damage due to bond-slip through comparing with the reference data in static state, even if the bond-slip is invisible and suspends. In this work, the experiment is implemented to demonstrate the bond-slip monitoring using above methods. Experimental results and further analysis show the validity and unique advantage of the proposed methods.

• Journal of information and communication convergence engineering
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• v.14 no.3
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• pp.184-190
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• 2016

We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS-EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.

• Proceedings of the KIEE Conference
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• 1999.07f
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• pp.2733-2735
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• 1999

The conducted noises mainly emitted from PWM DC power supply have a periodicity with respect to switching frequency, and especially center at the switching frequency and the discrete harmonic frequencies. The concentration of noise energy at these discrete frequencies makes it harder to meet EMI regulations. To reduce the conducted noises, this paper presents the novel FM-PWM control method by using random switching frequency modulation control. This control makes it to generate the noises of side bands by shattering emission spectrum, and to reduce the peak level of conducted noises.

• Proceedings of the KIEE Conference
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• 2003.04a
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• pp.273-275
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• 2003

SMPS는 신속한 스위칭에 의하여 높은 $d{\upsilon}$/dt 및 di/dt 특성을 가지며, 이러한 스위칭 특성으로 SMPS에서 발생하는 EMI 노이즈는 기기 내부 및 외부에 간섭을 일으킨다. 일반적으로 전자파 이미션은 전도성 이미션 및 방사성 이 미션으로 분류되며. 전도성 이미션은 공통모드와 차동모드로 구분한다. 최근 노이즈전류를 평형시킴으로써 공통모드 노이즈를 감소시키는 방법이 연구되었다. 이 방법은 공통모드 노이즈가 시스템 불평형의 결과라는 측면을 고려한 것이며. 노이즈 전류의 평형상태에서 컨버터를 동작시키면 공통모드 노이즈가 크게 줄어들 수 있음을 보여준다. 본 논문에서는 절연형 SMPS에서 노이즈 전류의 평형기법을 이용하여 SMPS의 1차 및 2차 측의 노드 확장에 따른 노이즈 감소를 분석한다.

• Journal of Convergence for Information Technology
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• v.10 no.8
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• pp.47-52
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• 2020

In this study, a simulation investigation was conducted on the method of reducing switching noise and spurious emission among design methods for step-down DC-DC converter modules for automotive. A typical 4-layer converter circuit using a PMIC(Power Management Integrated Circuit) chip was presented, and the simulation results of conductive emissions at two input terminals (+, -) and the point between the input filter and the PMIC was performed in the 1.0~5.0MHz band and the 100MHz band. The results for the conducted and radiated emissions in the HF(3~30MHz) and VHF(30-300MHz) bands were presented. It showed an improvement of about 10dB over the bands by routing the output terminal placed on the 3 or 4-layer in the opposite direction to the input terminal. The result of this study is expected to be useful in the design of the DC-DC converter modules in the future because it gives a better improvement compared to the existing methods.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.4
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• pp.298-308
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• 2017

This paper presents a Interleaved Buck Converter(IBC) system with Random PWM to reduce electromagnetic noise by harmonics. Swithced mode power supply generally controlled by high switching frequency have a electromagnetic interference(EMI) issue due to the high-voltage/high-current switching to regulate the voltage in buck converter. To solve the problem. we present a novel IBC system with PRBS. IBC system has two active switches with 180 phase difference that controll the cicuit with two PWM signal. IBC system may be disadventageous for the cost due to the addtion of one set of switch, but it has adventages of power distribution, current ripple cancellation, fast transient response, and passive component size reduction. To verify the validity of study, simulation program has been bulit using PSIM and the experimental results of IBC system using RPWM was compared with the conventinal PWM and randomized PWM.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.3
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• pp.366-375
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• 2008

Generally a return current plane(RCP) of high speed digital and analog part is partitioned. This is achieved in order to decrease the noise interference between subsystem in PCBs(Printed Circuit Boards). However, when the connected signal line exists between each sub system, this partition will cause unwanted effects. In a circuital point of view, RCP partition has a bad influence upon signal integrity. In a EMI(Electromagnetic Interference) point of view, the partition of the return current plane becomes a primary factor to increase the radiated emission. Component bridge(CB) is usecl for the way of maintaining signal integrity, still specific user's guide doesn't give sufficient principle. In a view point of signal integrity, design principle of multi-CB using method will be analyzed by measurement and simulation. And design principle of noise mitigation will be provided. Generally interval of CB is ${\lambda}/20$ ferrite bead. In this study. When multi-CB connection is applied, design principle of ferrite bead and chip resistor is proved by measurement and simulation. Multi-connected chip resistance$(0{\Omega})$ is proved to be more effective design method in the point of signal integrity.

• Journal of Advanced Navigation Technology
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• v.22 no.2
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• pp.105-110
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• 2018

The North Korea nuclear issue is now posing a serious security threat to the Korea and Northeast Asia. Accordingly, the South Korean military is pushing for the introduction of long-range air-to-surface flights and the development of domestic nuclear facilities that can precisely hit North Korea headquarters building and nuclear facility even hundreds of kilometers above the border. In this paper, we removed the cable braid for securing the weight of the missile among several design elements for long-range air-to-surface missile development and estimated and analyzed the resulting performance. The possibility of braid removal was analyzed in terms of crosstalk inside the cable and CS114, RE101 of MIL-STD-461F.

• Journal of IKEEE
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• v.25 no.4
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• pp.591-597
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• 2021

This paper proposes an EMC-aware PCB design method to reduce electromagnetic emission, where trace length and teturn path of critical signal are shortened by changing chip location and trace layout on the PCB, while additional filters or decoupling capacitors are not required. In the proposed method, signal velocity is calculated for various signals on the PCB. Critical signal with the fastest signal velocity is determined and its return path is shortened as much as possible by placing chip location and trace routing first. Return path of critical signal should be carefully designed not to have discontinuity. Power plane and ground plane should be carefully designed not to be divided, since these planes are the reference of return path. The proposed method was applied to automotive directional Bluetooth speaker which failed to pass CISPR 32 and CISPR 25 EMC tests. Its PCB was redesigned based on the proposed method and it easily passed the EMC tests. The proposed method is useful to EMC-sensitive electronic equipments.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1678-1679
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• 2011

고속/고전압으로 동작하는 자동차 전장품에 대한 EMI/EMC(Electromagnetic Interfere / Electromagnetic Compatibility) 문제는 기존의 PCB(Printed Circuit Board)에서의 문제와 다르며 하이브리드/전기 자동차에서 중요하게 다뤄지는 배터리에 대한 최적화 된 모델링 방법이 본 논문에 소개 되어있다. 기존의 단순한 저항과 커패시터의 연결로 표현 된 모델링이 아닌 고주파를 반영 할 수 있는 모델링 방법을 사용하였다. 이를 분석하기 위해 ANSYS사의 Simplorer와 Matlab을 사용해서 결과를 보았다. 본 논문에서는 DOD(Depth Of Discharge)에 따른 통합 등가회로 모델을 구현하면서 기존의 단순한 지수함수 곡선적합(Curve fitting)이 아닌 SOC(State Of Charge)의 경계조건을 반영하여 정확성을 높였다. 이로써 실험 데이터를 이용해 배터리 등가회로 모델링을 하여 정확한 배터리 동작의 해석을 할 수 있고 이에 따른 전도성 방사(CE : Conducted Emission)문제에 보다 쉽게 접근 할 수 있다.