• Title/Summary/Keyword: EMC test

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EMC/LVD Compatibility Evaluation of ITER AC/DC Converter Subrack by EN 61000 and IEC 61010 (ITER AC/DC Converter 서브랙의 EN 61000 및 IEC 61010에 의한 EMC/LVD 시험평가)

  • Shin, Hyun-Kook;Oh, Jong-Seok;Song, In-Ho;Suh, Jae-Hak;Choi, Jung-Wan
    • The Transactions of the Korean Institute of Power Electronics
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    • v.26 no.3
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    • pp.222-226
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    • 2021
  • To comply with CE marking requirements, the electromagnetic compatibility (EMC) and low-voltage directive (LVD) tests are conducted on the sub-racks of International Thermonuclear Experimental Reactor (ITER) AC/DC converters and bypass switches. The EMC tests consist of a series of tests, including the electromagnetic interference test, the electromagnetic field immunity test, and the rapid transient burst immunity test. In the LVD test, the electric shock protection test, the xcessive temperature limit and heat resistance of equipment tests, and the fire spread prevention test are performed. This work presents and reviews the European Directive for EMC/LVD and introduces the methods of EMC and LVD tests for the sub-racks of AC/DC converters and bypass switches. It also evaluates the test method and results to meet the European Directive requirements for CE marking. The sub-racks of ITER AC/DC converters and bypass switches successfully pass the EMC and LVD tests.

KoDSat System Level EMC(Electro Magnetic Compatibility) Test and an Analysis of the Test Results (검증위성 시스템레벨 전자기파(EMC) 시험 및 결과에 대한 분석)

  • Seo, Min-Seok;Park, Seok-Jun;Sim, Eun-Seop;Kim, Se-Yeon;Chae, Jang-Su
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.34 no.4
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    • pp.102-109
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    • 2006
  • In this paper, the system level EMC radiated emission test results of KoDSat(Korea Demonstration Satellite), its affects upon the Launch vehicle and H/W improving methods regarding its over exceed value of EMC specification are discussed. Regarding its over exceed value, we estimated that DAU of KoDSat generated the exceeded EMC noise source, and these test results were analyzed using the EMC2000 tool to find out how did it affect the FTS(Flight Termination Subsystem) of KSLV-1(Korea Small Launch Vehicle). To diminish the EMC noise source of UHF(430.1Mhz) band level, we redesigned the DAU power board to be applied the various schemes for EMI noise reduction such as grounding, shielding and EMI filtering, and also verified these reworks to analyze its diminishing affects in UHF band level by means of performing the DAU box level EMC test and performing the second KoDSat's system level EMC test.

On the Problems of EMC Test Site and EMC Antennas (EMC 측정 시험장과 EMC 안테나에 관한 문제점)

  • Kim, Ki-Chai
    • Journal of The Institute of Information and Telecommunication Facilities Engineering
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    • v.2 no.1
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    • pp.78-87
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    • 2003
  • One of the most difficult and important problems associated with radiated electromagnetic emissions from digital devices are the determination of antenna factor and site acceptability of an open area test site. This paper presents the problems of the open area test site and EMC antennas far measuring electromagnetic interferences radiated from the equipements. It seems desirable that the antenna factor of EMC antennas be revised to the antenna factor with zero reflection presented in this paper for accurate measurements.

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EMC Test of Deimos-2 satellite (Deimos-2 위성 EMC 시험)

  • Park, In-Yong
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.42 no.10
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    • pp.878-883
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    • 2014
  • This paper presents the test result of system level EMC of LEO satellite Deimos-2 FM that has been launched in June 20, 2014. The Deimos-2 satellite was designed considering the EMC of unit modules level in addition to the structure aspects. The Auto-Compatibility, Radiated Emission and Radiated Susceptibility test was conducted. The test result has meet the standard of system EMC of Deimos-2 program.

The Method of Reinforcing the Immunity of Residual Current Circuit Breaker for the EMC Composite Surge (누전차단기의 EMC 조합서지 내성 강화를 위한 방안)

  • Kim Jae-Chul;Han Yoon-Tak;Kim Oun-Seok;Seol Kyu-Hwan;Kang Jang-Kyou;Moon Jong-Fil
    • The Transactions of the Korean Institute of Electrical Engineers A
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    • v.55 no.8
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    • pp.322-328
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    • 2006
  • In this paper, The impulse un-tripping characteristics and the electro magnetic compatibility characteristics are compared with each other. The performance of impulse un-tripping test exists at domestic standard (KSC 4613). However test items are insufficient because the more test items such as EMC exist at international standard (IEC). Also, Electric Appliances Safety Certificate has taken the certificate test since July 2004 in Korea but did not confirm the EMC performance for RCCBs made in Korea. Thus, in this paper, We experiment with Oscillatory waves immunity test and the 7 EMC tests for 32 RCCBs of 4 types (mini, home standard, plug, outlet) for 16 brands according to IEC standard 61009-1 and 61008-1. As a result, 24 RCCBs proved to be poor for surge immunity test. However the RCCBs operating incorrectly for surge immunity test operate correctly for oscillatory waves immunity test. Thus, the correlation between oscillatory waves immunity test and EMC test is little and standard for compatibility of combination surge at IEC 61000-4-5 should be added to KS standard as soon as possible.

Module level EMC verification method for replacement items in nuclear power plant

  • Hee-Taek Lim;Moon-Gi Min;Hyun-Ki Kim;Gwang-Hyun Lee;Chae-Hyun Yang
    • Nuclear Engineering and Technology
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    • v.55 no.7
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    • pp.2407-2418
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    • 2023
  • Internal replaceable electronic module substitutions can impact EMC (ElectroMagnetic Compatibility) qualification testing and results if EMC testing is conducted at the cabinet level. The impact of component substitutions on EMC qualification results therefore should be evaluated. If a qualitative evaluation is not adequate to ensure that the modified product will not impact the cabinet level EMC qualification results, a new qualification testing should be conducted. Component level retesting should be conducted under electromagnetically equivalent conditions with the cabinet level test. This paper analyzes the propagation of conducted susceptibility test waveforms in a representative cabinet and evaluates the impact of component substitutions on cabinet level EMC qualification results according to the location of the replacement items. A guideline for a qualitative evaluation of the impact of component substitutions is described based on the propagation of the conducted susceptibility test waveforms. A module level test method is also described based on an analysis of the shielding effectiveness of the cabinet.

EMC Compatibility Analysis of CEU EMC test results in the Optical Satellite System (광학위성 카메라전자부 EMC 시험결과의 시스템 양립성 검토)

  • Jang, Jae-Woong;Kim, Tae-Yoon;Lim, Seong-Bin;Moon, Guee-Won
    • Aerospace Engineering and Technology
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    • v.9 no.2
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    • pp.161-167
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    • 2010
  • CEU(Camera Electronic Unit) loaded in optical satellite for a high resolution image acquisition is composited with CC(Camera Controlloer), FPA(Focal Plane Assembly) and CEUP(CEU Power supply). EMC test and analysis results are explained in this paper. CE, CS, RE and RS test is performed in the 1st EMC test, RE, RS test which is not complied and influence considerably after shielding structure is performed in the 2nd EMC test. An effect due to the noise of CEU in the GPS/S-band receiving band is analyzed based on 2nd EMC test results. Margin more than 6dB is guaranteed when CEU is shielded.

Measurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensor (유전 센서 및 광섬유 센서를 이용한 EMC 유효 경화 수축 측정)

  • Baek, Jeong-hyeon;Park, Dong-woon;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.4
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    • pp.83-87
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    • 2022
  • Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

A Design Verification for the EQM CBS Ka-band Payload System by EMC Test (EQM 통신방송위성 KA대역 탑재체 시스템의 EMC 시험을 통한 검증)

  • Lee,Ho-Jae;U,Hyeong-Je;Sin,Dong-Hwan;Park,Jong-Heung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.31 no.10
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    • pp.97-104
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    • 2003
  • This paper addresses EMC test results for the EQM Communications & Broadcasting Satellite(CBS) Ka-band Payload System. The aim of the EMC test is to verify that the payload system has no effect on the other system and is not affected by the external field. The compliance of EMC system requirements was verified by the analysis and measurement of the emission level from the payload system. The variation of performance by noise injection was measured to inspect the susceptibility of the payload system. The analysis and test results also showed that the electromagnetic interference has no serious effect on the overall payload system performance. It is confirmed that the EQM CBS Ka-band payload system can be operable in the space environment from the EMC performance's viewpoint. It is also obtained that better performance can be acquired by improving waveguide design and integration method.

Study of EMC Optimization of Automotive Electronic Components using ECAE

  • Kim, Tae-Ho;Kim, Mi-Ro;Jung, Sang-Yong
    • Journal of international Conference on Electrical Machines and Systems
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    • v.3 no.3
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    • pp.248-251
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    • 2014
  • As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper proposes EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.