• Food Science of Animal Resources
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• v.21 no.3
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• pp.256-264
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• 2001

Pyrolysis/GC-mass spectrometry(Hewlet-Packard 5890GC/mass selective detector, 5971 BMSD), interfaced to a CDS Pyroprobe 1500 was optimized for rapid analysis of flavour compounds in Cheddar cheese. Twenty flavour compounds, including aldehydes(4), ketones(4), fatty acids(10), alcohol(1), and hydrocarbon(1), were identified from Cheddar cheeses. In total, Twenty-three flavour compounds aldehydes(2), ketones(8), alcohols(3), fatty acids(7), lactone(1), benzene derivative(1) and amide(1) were identified from two samples of accelerated-ripened Cheddar cheese treated with the proteolytic enzymes of Lactobacillus casei LGY. In total, Twenty-one flavour compounds; aldehydes(2), ketones(5), alcohols(2), fatty acids(11), and lactone(1) were identified from enzyme-modified cheese(EMC) treated with the combination of the proteolytic enzymes of Lactobacillus casei LGY and commercial endopeptidase or lipase. However, All the flavour compounds identified by pyrolysis/GC/MS in samples of ARC and EMC were not determined whether they are recognized as typical Cheddar flavour or not. More studies were requested on the development of methods for a rapid and convienent analysis of dairy fermented products using pyrolysis/GC-mass spectrometry.

• Food Science and Biotechnology
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• v.14 no.1
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• pp.68-72
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• 2005

Moisture sorption characteristics of edible composite films were determined and compared against moisture barrier properties. Edible composite films were Z1 (zein film with polyethylene glycol(PEG) and glycerol), Z2 (zein film with oleic acid), ZA1 (zein-coated high amylose corn starch film with PEG and glycerol), and ZA2 (zein-coated high amylose corn starch film with oleic acid). Z2 film showed the lowest equilibrium moisture content (EMC), monolayer value ($W_m$), water vapor permeability (WVP), and water solubility (WS). Surface structure of Z2 was relatively denser and finer than that of other edible films. GAB $W_m$ and C values decreased, while K values increased with increasing temperature. Correlation coefficients of WS:EMC and WVP:EMC at Aw 0.75 were higher than those of WS: $W_m$ and WVP: $W_m$, respectively. EMC values at Aw 0.75 appeared useful for evaluating or predicting moisture barrier properties of edible films.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.4
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• pp.100-109
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• 2005

This paper introduce electromagnetic environmental requirements, test procedures and test results for the Command Telemetry Unit(CTU), which is engineering qualification model for communication satellite in geostationary earth orbit. Also, through debugging of the CTU during the Electro Magnetic Compatibility(EMC) tests, this paper evaluates characteristics of noise generated by the CTU. It is also obtained that better EMC performance can be acquired by improving electrical power converter module of the CTU.

• Tuberculosis and Respiratory Diseases
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• v.78 no.4
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• pp.428-431
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• 2015

Epithelial-myoepithelial carcinoma (EMC) of lung is a minor subset of salivary type carcinoma of lung of known low grade malignancy. Histologically, two-cell components forming duct-like structure with inner epithelial cell layer and outer myoepithelial cell layer are characteristics of EMC. In salivary gland, dedifferentiation of conventional low grade malignancy has been reported and is thought to be related with poor prognosis. However, precise histomorphology and prognostic factors of pulmonary EMC have not been clarified due to its rarity. Herein, we reported a rare case of EMC presented as endobronchial mass in a 53-year old woman, which showed predominant solid lobular growth pattern and lymph node metastases.

• Korean Journal of Materials Research
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• v.14 no.5
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• pp.322-327
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• 2004

Copper-based leadframe sheets were oxidized in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched Brazil-nut (SBN) specimens. The SBN specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under mixed-mode (mode I + mode II) loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The results revealed that the failure paths were strongly dependent on the oxide type. In case of brown oxide, hackle-type failure was observed and failure path lay near the EMC/CuO interface with a little inclining to CuO at all case. On the other hand, in case of black oxide, quite different failure path was observed with respect to the distance from the tip of pre-crack and phase angle. Different failures occurred with oxide type is presumed to be due to the difference in microstructure of the oxides.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.50-57
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• 2001

This paper describes a design for the circularly polarized microstrip EMC cross dipole array antenna with the wide bandwidth. To realize the characteristics of wide bandwidth and circular polarization, the electromagnetic-coupled cross dipole element is proposed. The optimum design parameters of a circularly polarized EMC cross dipole element are calculated by the FDTD and the Ensemble. To obtain the uniform aperture illumination of electric field in an array, offset technique that the cross dipole elements are alternatively arranged on center of the microstrip feed line is adopted. In 20-element array design, the calculated axial ratio and gain are about 0.1dB and 9.9 dBi at 12 GHz, respectively, The frequency characteristics of a fabricated 20-element array antenna are measured. The calculated results agree well with the measured ones.

• International Journal of Aerospace System Engineering
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• v.9 no.1
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• pp.1-15
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• 2022

Pyrotechnic initiators provide a source of pyrotechnic energy used to initiate a variety of space mechanisms. Pyrotechnic systems build in electromagnetic environment that may lead to critical or catastrophic hazards. Special precautions are need to prevent a pulse large enough to trigger the initiator from appearing in the pyrotechnic firing circuits at any but the desired time. The EMC verification shall be shown by analysis or test that the pyrotechnic systems meets the requirements of inadvertent activation. The MIL-STD-1576 and two range safeties, AFSPC and CSG, require the safety margin for electromagnetic potential hazards to pyrotechnic systems to a level at least 20 dB below the maximum no-fire power of the EED. The PC23 is equivalent to NASA standard initiator and the 1EPWH100 squib is ESA standard initiator. This paper verifies the two safety margins for electromagnetic potential hazards. The first is verified by analyzing against a RF power. The second is verified by testing against a DC current. The EMC safety margin requirement against RF power has been demonstrated through the electric field coupling analysis in differential mode with 21 dB both PC23 and 1EPWH100, and in common mode with 58 dB for PC23 and 48 dB for 1EPWH100 against the maximum no-fire power of the EED. Also, the EMC safety margin requirement against DC current has been demonstrated through the electrical isolation test for the pyrotechnic firing circuits with greater than 20 dB below the maximum no-fire current of the EED.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.3
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• pp.316-323
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• 2013

This paper deals with the near-field to far-field calculation for far-field characteristics of antenna and electromagnetic compatibility(EMC) testing. Since the conventional EMC testing process is inefficient such as measurements of the wide band signals and mega structures, Stratton-Chu formula is used to predict the far-field emission by simple and direct process. The usefulness of Stratton-Chu formula is verified by comparing to the analytic solution of the uniform distribution aperture in free-space. In order to inspect the far-fields and to get the near-field values, full-wave simulation solver is utilized. Through the full-wave simulation about the patch antenna, calculated far-field results from Stratton-Chu formula are proven. The predicted magnitudes of the far-field are in error by less than 6 %.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.19 no.3
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• pp.137-147
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• 2020

This paper proposes printed bow-tie antennas with 3 ~ 5 GHz broadband characteristics were proposed for testing the electromagnetic immunity of automotive electrical components in the 5G frequency band. The antenna get -10 dB bandwidth in the 2.75 ~ 6 GHz frequency band and the broadside radiation pattern with S₁₁ characteristic of -16.2 dB at resonant frequency. In testing electromagnetic immunity in the 5G mobile communication frequency band, the VSWR characteristic remained below 2.1, forming a level of 1 W as proposed by international standards. As a result, it is confirmed that the proposed antenna can be applied to antenna testing for electromagnetic immunity verification in the 5G mobile communication frequency band.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.41-45
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• 2018

As the size of semiconductor chip shrinks, the electronic industry has been paying close attention to fan-out wafer level packaging (FO-WLP) as an emerging solution to accommodate high input and output density. FO-WLP also has several advantages, such as thin thickness and good thermal resistance, compared to conventional packaging technologies. However, one major challenge in current FO-WLP manufacturing process is to control wafer warpage, caused by the difference of coefficient of thermal expansion and Young's modulus among the materials. Wafer warpage induces misalignment of chips and interconnects, which eventually reduces product quality and reliability in high volume manufacturing. In order to control wafer warpage, it is necessary to understand the effect of material properties and design parameters, such as chip size, chip to mold ratio, and carrier thickness, during packaging processes. This paper focuses on the effects of thickness of chip and molding compound on 12" wafer warpage after PMC of EMC using finite element analysis. As a result, the largest warpage was observed at specific thickness ratio of chip and EMC.