• New & Renewable Energy
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• v.16 no.3
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• pp.1-12
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• 2020

Shingled technology is the latest cell interconnection technology developed in the photovoltaic (PV) industry due to its reduced resistance loss, low-cost, and innovative electrically conductive adhesive (ECA). There are several advantages associated with shingled technology to develop cell to module (CTM) such as the module area enlargement, low processing temperature, and interconnection; these advantages further improves the energy yield capacity. This review paper provides valuable insight into CTM loss when cells are interconnected by shingled technology to form modules. The fill factor (FF) had improved, further reducing electrical power loss compared to the conventional module interconnection technology. The commercial PV module technology was mainly focused on different performance parameters; the module maximum power point (Pmpp), and module efficiency. The module was then subjected to anti-reflection (AR) coating and encapsulant material to absorb infrared (IR) and ultraviolet (UV) light, which can increase the overall efficiency of the shingled module by up to 24.4%. Module fabrication by shingled interconnection technology uses EGaIn paste; this enables further increases in output power under standard test conditions. Previous research has demonstrated that a total module output power of approximately 400 Wp may be achieved using shingled technology and CTM loss may be reduced to 0.03%, alongside the low cost of fabrication.

• Journal of the Korean Wood Science and Technology
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• v.51 no.1
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• pp.38-48
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• 2023

Two important steps in utilizing technical kraft lignin (KL) from black liquor to synthesize lignin-phenol-formaldehyde (LPF) resin are its extraction via precipitation and fractionation. However, the effects of precipitation pH and acetone fractionation on the characteristics of hardwood KL have not been studied for LPF resins. Therefore, this paper reports the effects of the precipitation pH of black liquor and acetone fractionation on the characteristics of KL from mixed hardwood species for LPF resins. The precipitation was conducted at various pH levels from 3 to 9 of black liquor to obtain crude KL (C-KL), which was used in acetone fractionation to produce acetone-soluble KL (AS-KL) and acetone-insoluble KL (AI-KL). Precipitation at pH 3 and 9 produced the highest and lowest yields of C-KL, respectively. As expected, the C-KL infrared spectra were similar regardless of the precipitation pH levels. As the pH increased, the molecular weight of C-KL increased. However, the molecular weight of AS-KL and AI-KL after acetone fractionation increased to a maximum of 4,170 and 47,190 g/mol at pH 7, then decreased to 3,210 and 19,970 g/mol at pH 9, respectively. The smallest molecular weights of AS-KL and AI-KL were 3,210 and 15,480 g/mol and were found at pH 9 and 3, respectively. These results suggest that both AS-KL at pH 9 and AI-KL at pH 3 have good potential as starting lignins for synthesizing LPF resins that require cross-linking for polymerization.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.31 no.5
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• pp.779-784
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• 1998

The specific growth rate and production of resting ega of the freshwater rotifer, Brachionus calyciflorus Pallas was investigated at the different temperatures ($20\~30^{\circ}C$). The rotifer was cultured in 250 ml flask and fed on concentrated freshwater Chlorella. Specific growth rate of B. calyciflorus showed higher rate at higher temperature, but maximum density was observed higher at lower temperature, expect at $20^{\circ}C$. The production of resting egg with temperature was showed decrease on the basis on $26^{\circ}C$. The highest number of resting egg per ml and rotifer $10^4$ were 157 eggs and 810 eggs at $26^{\circ}C$, respectively. This result shows that the optimum temperature for mass culture and resting egg production of this freshwater rotifer were $30^{\circ}C$ and $26^{\circ}C$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.155-161
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• 2018

A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.