• Transactions on Electrical and Electronic Materials
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• v.7 no.6
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• pp.305-308
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• 2006

We have studied liquid crystal (LC) aligning capabilities for homeotropic alignment and the control of tilt angles on the $SiO_{x}$ thin film by electron beam evaporation method. A high tilt angle of about $86.5^{\circ}$ was obtained, and also the suitable tilt angle of the NLC on the $SiO_{x}$ thin film at $20{\sim}50\;nm$ thickness with e-beam evaporation can be achieved. The uniform LC alignment on the $SiO_{x}$ thin film surfaces with electron beam evaporation can be achieved. It is considerated that the LC alignment on the $SiO_{x}$ thin film by electron beam evaporation is attributed to elastic interaction between LC molecules and micro-grooves at the $SiO_{x}$ thin film surface created by evaporation.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.255-255
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• 2011

$SiO_2$는 유전체 물질로서 고온에 강하고 열 변화에 민감하지 않으며 자외선을 잘 투과시키는 특성 때문에 각종 광전자 소자에 많이 응용되고 있다. 최근에는 classical thermal oxidation 방식을 이용하여 태양전지의 효율을 증가하기 위한 표면 보호막, 유기발광다이오드의 보호막 및 barrier로 적용되고 있다. $SiO_2$ 박막의 경우 RF-DC sputtering, thermal evaporation, plasma enhanced chemical vapor deposition, E-beam evaporation 등의 다양한 방법을 통하여 제작되고 있다. 이들 중 E-beam evaporation 법은 높은 증착속도, 증착방향성, 낮은 불순물농도 등 많은 장점을 가지고 $SiO_2$ 박막 증착이 가증하다. 따라서 본 연구에서는 Si 기판위에 $SiO_2$를 증착각도를 0$^{\circ}$, 25$^{\circ}$, 50$^{\circ}$, 70$^{\circ}$로 변화시켜 증착하였고, 증착속도, 빔 세기, 기판 회전속도 등을 변화시켰다. 또한, 증착 각도에 따른 유전율 차이를 무반사 특성 향상에 응용하기 위해 다양한 layer 층을 순차적으로 성장시켰다. 제작된 $SiO_2$의 나노구조의 구조적, 광학적 특성은 field emission scanning microscopy, atomic force microscopy, UV-VIS-NIS spectrophotometer를 이용하여 분석되었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.312-312
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• 2013

GaN based light emitting diodes (LEDs) are important devices that are being used extensively in our daily life. For example, these devices are used in traffic light lamps, outdoor full-color displays and backlight of liquid crystal display panels. To realize high-brightness GaN based LEDs for solid-state lighting applications, the development of p-type ohmic electrodes that have low contact resistivity, high optical transmittance and high refractive index is essential. To this effect, indiumtin oxide (ITO) have been investigated for LEDs. Among the transparent electrodes for LEDs, ITO has been one of the promising electrodes on p-GaN layers owing to its excellent properties in optical, electrical conductivity, substrate adhesion, hardness, and chemical inertness. Sputtering and e-beam evaporation techniques are the most commonly used deposition methods. Commonly, ITO films on p-GaN by sputtering have better transmittance and resistivity than ITO films on p-GaN by e-bam evaporation. However, ITO films on p-GaN by sputtering have higher specific contact resistance, it has been demonstrated that this is due to possible plasma damage on the p-GaN in the sputtering process. In this paper, we have investigated the advanced sputtering using plasma damage-free p-electrode. Prepared the ITO films on the GaN based LEDs by e-beam evaporation, normal sputtering and advanced sputtering. The ITO films on GaN based LEDs by sputtering showed better transmittance and sheets resistance than ITO films on the GaN based LEDs by e-beam evaporation. Finally, fabricated of GaN based LEDs by using advanced sputtering. And compared the electrical properties (measurement by using C-TLM) and structural properties (HR-TEM and FE-SEM) of ITO films on GaN based LEDs produced by e-beam evaporation, normal sputtering and advanced sputtering. As a result, It is expected to form plasma damage free-electrode, and better light output power and break down voltage than LEDs by e-beam evaporation and normal sputter.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1564-1567
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• 2009

Cu(In,Ga)$Se_2$ (CIGS) thin films were formed using CIGS bulk by electron-beam evaporation method with an evaporation current from 20 mA to 90 mA. The experimental results showed that the chemical compositions and the properties of CIGS films varied with the different evaporation current. The Cu-rich CIGS film was deposited successfully with a band gap of 1.20 eV when the evaporation current was 90 mA.

• Transactions on Electrical and Electronic Materials
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• v.8 no.6
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• pp.274-277
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• 2007

In this study, liquid crystal(LC) aligning capabilities for homeotropic alignment on the $SiO_x$ thin film by electron beam evaporation method were investigated. Also, the control of pretilt angles and thermal stabilities of the nematic liquid crystal(NLC) treated on $SiO_x$ thin film were investigated. A high pretilt angle of about $86.5^{\circ}$ was obtained, and also the suitable pretilt angle of the NLC on the $SiO_x$ thin film at $10{\sim}50nm$ thickness with e-beam evaporation can be achieved. The uniform LC alignment and good thermal stabilities on the $SiO_x$ thin film surfaces with electron beam evaporation can be achieved. It is considered that the LC alignment on the $SiO_x$ thin film by electron beam evaporation is attributed to elastic interaction between LC molecules and micro-grooves at the $SiO_x$ thin film surface created by evaporation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.11
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• pp.43-50
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• 2007

We have investigated the electro-optical characteristics and reliability of LEDs with the Indium-Tin-Oxide (ITO) electrodes formed by different deposition methods: electron beam evaporation, sputtering, and hybrid method of electron beam evaporation and subsequent sputtering. The deposition method of the ITO electrode has significant influence on the electro-optical characteristics and reliability of LEDs. The LEDs with the ITO electrodes formed by sputtering and electron beam evaporation have problems caused by sputtering damage and increased electrical resistance, respectively, and the problems have been solved by the hybrid method.

• Korean Journal of Materials Research
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• v.23 no.3
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• pp.194-198
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• 2013

In this paper, we studied a p-type reflector based on indium tin oxide (ITO) for vertical-type ultraviolet light-emitting diodes (UV LEDs). We investigated the reflectance properties with different deposition methods. An ITO layer with a thickness of 50 nm was deposited by two different methods, sputtering and e-beam evaporation. From the measurement of the optical reflection, we obtained 70% reflectance at a wavelength of 382 nm by means of sputtering, while only 30% reflectance resulted when using the e-beam evaporation method. Also, the light output power of a $1mm{\times}1mm$ vertical chip created with the sputtering method recorded a twofold increase over a chip created with e-beam evaporation method. From the measurement of the root mean square (RMS), we obtained a RMS value 1.3 nm for the ITO layer using the sputtering method, while this value was 5.6 nm for the ITO layer when using the e-beam evaporation method. These decreases in the reflectance and light output power when using the e-beam evaporation method are thought to stem from the rough surface morphology of the ITO layer, which leads to diffused reflection and the absorption of light. However, the turn-on voltage and operation voltage of the two samples showed identical results of 2.42 V and 3.5 V, respectively. Given these results, we conclude that the two ITO layers created by different deposition methods showed no differences in the electric properties of the ohmic contact and series resistance.

• Current Photovoltaic Research
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• v.7 no.1
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• pp.15-20
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• 2019

Most high-efficiency n-type silicon solar cells are based on the high quality surface passivation and ohmic contact between the emitter and the metal. Currently, various metalization methods such as screen printing using metal paste and physical vapor deposition are being used in forming electrodes of n-type silicon solar cell. In this paper, we analyzed the degradation factors induced by the front electrode formation process using e-beam evaporation of double passivation structure of p-type emitter and $Al_2O_3/SiN_x$ for high efficiency solar cell using n-type bulk silicon. In order to confirm the cause of the degradation, the passivation characteristics of each electrode region were determined through a quasi-steady-state photo-conductance (QSSPC).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.378-378
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• 2007

In this study, liquid crystal (LC) aligning capabilities for homeotropic alignment on the $ZrO_x$ thin film by electron beam evaporation method were investigated. Also, the control of pretilt angles and thermal stabilities of the NLC treated on $ZrO_x$ thin film were investigated. The uniform LC alignment on the $ZrO_x$ thin film surfaces and good thermal stabilities with electron beam evaporation can be achieved. It is considerated that the LC alignment on the $ZrO_x$ thin film by electron beam evaporation is attributed to elastic interaction between LC molecules and micro-grooves at the $ZrO_x$ thin film surface created by evaporation. In addition, it can be achieved the good electro-optical (EO) properties of the VA-LCD on $ZrO_x$ thin film layer with. oblique electron beam evaporation.

• Proceedings of the Korean Magnestics Society Conference
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• 1996.10a
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• pp.32-33
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• 1996