• Title/Summary/Keyword: Dynamic Stress intensity Factor

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Effect of the Stiffness of Ingerface Defect on Dynamic Interface Crack propagation (계면에 존재하는 결함의 강성도가 동적 계면균열전파에 미치는 영향)

  • 이억섭;윤해룡;황시원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.671-674
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    • 2001
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the stiffness of interface defect(exist along the path of the crack propagation) on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

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Effect of Interface Hole Shape on Dynamic Interface Crack propagation (계면에 존재하는 결함의 모양이 동적 계면균열전파에 미치는 영향)

  • 이억섭;윤해룡;조운기;황시원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.429-432
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

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A Study on Fracture Parameters for PVC/MBS Composites under Low Velocity Impact (저속 충격시 PVC/MBS재료의 파괴특성에 관한 연구)

  • 최영식;박명균;박세만
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.837-840
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    • 2002
  • An analysis method for rubber toughened PVC is suggested to evaluate critical dynamic strain energy release rates($G_c$) from the Charpy impact energy measurements. An instrumented Charpy impact tester was used to extract ancillary information concerning fracture parameters in addition to total fracture energies and maximum critical loads. The dynamic stress intensity factor $K_{Id}$ was computed for varying amounts of rubber contents from the obtained maximum critical loads and also toughening effects were investigated as well. The fracture surfaces produced under low velocity impact fur PVC/MBS composites were investigated by SEM. The results show that MBS rubber is very effective reinforcement material for toughening PVC.C.

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A study on the Impact Characteristics for Rubber Toughened polymeric Materials under Low Velocity Impact (고무보강 폴리머 재료의 저속 충격 해석)

  • 구본성;박명균;박세만
    • Proceedings of the Safety Management and Science Conference
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    • 2004.05a
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    • pp.219-231
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    • 2004
  • The Charpy and Izod impact tests are the most prevalent techniques used to characterize the effects of high impulse loads on polymeric materials. An analysis method for rubber toughened PVC is suggested to evaluated critical dynamic strain energy release rates(G$_c$) from the Charpy impact tester was used to extract ancillary information concerning fracture parameters in additional to total fracture energies and maximum critical loads. The dynamic stress intensity factor KID was computed for varying amounts of rubber contents from the obtain maximum critical loads and also toughening effects were investigated as well. The fracture surfaces produced under low velocity impact for PVC/MBS composites were investigated by SEM. The results show that MBS rubber is very effective reinforcement material for toughening PVC.

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Dynamic Characteristics of an Eccentric Crack in a Functionally Graded Piezoelectric Ceramic Strip

  • Shin, Jeong-Woo;Kim, Tae-Uk;Kim, Sung-Chan
    • Journal of Mechanical Science and Technology
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    • v.18 no.9
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    • pp.1582-1589
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    • 2004
  • The dynamic response of an eccentric Griffith crack in functionally graded piezoelectric ceramic strip under anti-plane shear impact loading is ana lysed using integral transform method. Laplace transform and Fourier transform are used to reduce the problem to two pairs of dual integral equations, which are then expressed to Fredholm integral equations of the second kind. We assume that the properties of the functionally graded piezoelectric material vary continuously along the thickness. The impermeable crack boundary condition is adopted. Numerical values on the dynamic stress intensity factors are presented for the functionally graded piezoelectric material to show the dependence of the gradient of material properties and electric loadings.

Crack Growth Behavior of Tensile Overload for Small Load Amplitude (하중진폭이 작은 인장과대 하중의 균열성장 거동)

  • 유헌일
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.2
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    • pp.54-61
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    • 1998
  • This paper examines the crack growth behavior of 7075-T651 aluminum alloy for small tensile overload under high-low block loading condition. The cantilever beam type specimen with a chevron notch is used in this study. The crack growth and closure are investigated by compliance method. The applied initial stress ratios are R=-0.5 R=0.0 and R=0.25 Crack length, effective stress intensity factor range, ratio of effective stress intensity factor range and crack growth rate etc, are inspected with fracture mechanics estimate.

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A Study on the Development of the Dynamic Photoelastic Hybrid Method for Two Dissimilar Isotropic Bi-Materials (두 상이한 등방성 이종재료용 동적 광탄성 하이브리드법 개발에 관한 연구)

  • Sin, Dong-Cheol;Hwang, Jae-Seok;Gwon, O-Seong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.3
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    • pp.434-442
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    • 2001
  • When the interfacial crack of two dissimilar isotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid method developed in this research are valid. Separating method of stress component is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 80∼85% (in case of aluminum, 24.3∼25.9%) of Rayleigh wave velocity of epoxy resin. The near-field stress components of crack-tip are similar with those of pure isotropic material under static or dynamic loading, but very near-field stress components of crack-tip are different from those.

Effect of Interface Hole Shape on Dynamic Interface Crack Propagation (계면에 존재하는 구멍의 모양이 동적 계면균열전파에 미치는 영향)

  • Yin, Hai-Long;Lee, Ouk-Sub
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.7
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    • pp.1217-1222
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    • 2002
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

Development of the Dynamic Photoelastic Hybrid Method for Propagating Interfacial Crack of Isotropic/Orthotropic Bi-materials (등방성/직교이방성 이종재료의 진전 계면균열에 대한 동적 광탄성 실험 하이브리드 법 개발)

  • Hwang, Jae-Seok;Sin, Dong-Cheol;Kim, Tae-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.7
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    • pp.1055-1063
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    • 2001
  • When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

Propagation behavior of the interface crack through a hole (구멍을 통과하는 계면균열의 전파거동)

  • Lee, O.S.;Yin, H.L.;Hwang, S.W.;Byun, K.H.
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.127-131
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (existed on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

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