• Proceedings of the KSME Conference
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• 2000.04a
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• pp.236-241
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• 2000

In this paper, transparent dynamic photoelastic experimental hybrid method for propagating cracks in orthotropic material is developed. Using transparent dynamic photoelastic experimental hybrid method, we can obtain stress intensity factor and separate the stress components from only isochromatic fringe patterns without using isoclinics. It is certified that the dynamic photoelastic experimental hybrid method is very useful for the problems of the dynamic tincture mechanics.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1273-1280
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• 2003

In this paper, transparent dynamic photoelastic experimental hybrid method for propagating cracks in orthotropic material was developed. Using transparent dynamic photoelastic experimental hybrid method, we can obtain stress intensity factor and separate the stress components from only isochromatic fringe patterns without using isoclinics. When crack is propagated with constant velocity, the contours of stress components in the vicinity of crack tip in orthotropic material are similar to those of isotropic material or orthotropic material with stationary crack under the static load. Dynamic stress intensity factors are decreased as crack growths. It was certified that the dynamic photoelastic experimental hybrid method was very useful for the analysis of the dynamic fracture mechanics.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.292-297
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• 2000

In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.3
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• pp.434-442
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• 2001

When the interfacial crack of two dissimilar isotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid method developed in this research are valid. Separating method of stress component is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 80∼85% (in case of aluminum, 24.3∼25.9%) of Rayleigh wave velocity of epoxy resin. The near-field stress components of crack-tip are similar with those of pure isotropic material under static or dynamic loading, but very near-field stress components of crack-tip are different from those.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.7
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• pp.1055-1063
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• 2001

When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

• Transactions of the Korean Society of Mechanical Engineers
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• v.7 no.2
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• pp.161-167
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• 1983

In this study the phenomenon of cutting stress which arises on cutting tools and work pieces in cutting process is investigated by rake angle of cutting tools and feed for this measurement, P$_{s}$-1 (high modulus, photolastic Inc.) was used as a cutting tool, P$_{s}$-3 (medium modulus, photolastic Inc.) was used as work piece and reduction apparatus was attached to the head stock, and orthogonal cutting was adapted as a cutting method and transparent glass was used to block the strain in the orientation of thickness. The followings are the results of this study. (1) Photoelastic experimental equipments have made it possible to make dynamic measurement and analyze stress distribution in cutting tool and work piece surface which has hitherto been conducted only in static measurement and analyzing method. (2) The maximum stress arising at tools and work pieces in cutting process is on the tool edge tip, and the maximum stress arising on the tip of cutting tools is equal to that on the contacting area of work pieces in values. (3) The distributions of maximum shear stress on certain parts of the cutting tools and work pieces are as follows; for cutting tools, .alpha.=12.deg., .alpha.=0.deg., .alpha.=-12.deg. in order, and for work pieces, .alpha.=-12.deg., .alpha.=0.deg., .alpha.=12.deg. in opposite order.der.

• Journal of Mechanical Science and Technology
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• v.14 no.7
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• pp.752-763
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• 2000

The stress field around the dynamically propagating interface crack tip under a remote mixed mode loading condition has been studied with the aid of dynamic photoelastic method. The variation of stress field around the dynamic interface crack tip is photographed by using the Cranz-Shardin type camera having $10^6$ fps rate. The dynamically propagating crack velocities and the shapes of isochromatic fringe loops are characterized for varying mixed load conditions in double cantilever beam (DCB) specimens. The dynamic interface crack tip complex stress intensity factors, $K_1\;and\;K_2$, determined by a hybrid-experimental method are found to increase as the load mixture ratio of y/x (vertical/horizontal) values. Furthermore, it is found that the dynamically propagating interface crack velocities are highly dependent upon the varying mixed mode loading conditions and that the velocities are significantly small compared to those under the mode I impact loading conditions obtained by Shukla (Singh & Shukla, 1996a, b) and Rosakis (Rosakis et al., 1998) in the USA.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1776-1785
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• 2004

In this research, the relationships between static bimaterial constant and dynamic oscillation index are studied. It was certified that static bimaterial constant has the same form equation as the dynamic oscillation index. Bimaterial constant and oscillation index are increased with the increment of Young's modulus ratio and approached to the some value. Isochromatic fringe patterns are slanted to the left side with increment of bimaterial constants and oscillation index. Though patterns of stress components in above the crack surface are similar to each other, their magnitudes are different a little. In the ahead of crack tip, there are big differences in the isochromatic fringe patterns and their magnitudes. The influence of bimaterial with Young's modulus ratio is bigger in the propagation crack than in the stationary crack.