• 제목/요약/키워드: Dynamic Interface Crack Stress Field

검색결과 11건 처리시간 0.024초

Dynamic Interface Crack Propagating Along a Line Between Two Holes

  • Lee, Ouk-Sub;Park, Jae-Chul;Yin, Hai-Long;Byun, Kwi-Hwan
    • Journal of Mechanical Science and Technology
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    • 제15권2호
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    • pp.172-179
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    • 2001
  • The effects of the interface and two holes located near the crack path in the hybrid specimen on the dynamic crack propagation behavior have been investigated using dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system. The dynamic stress field around the dynamically propagating interface crack tip in the three point bending specimens under a dynamic load applied by a hammer dropped from 0.6m high without initial velocity are recorded. The complex stress intensity factors for the dynamically propagating interface crack are extracted by using a overdeterministic least square method. Theoretical dynamic interface isochromatic fringe loops generated by using the numerically determined complex stress intensity factors are compared with the experimental results. Furthermore, the influence of the hole to the dynamic interface crack velocities has been investigated experimentally.

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등방성/직교이방성 이종재료의 진전 계면균열에 대한 동적 광탄성 실험 하이브리드 법 개발 (Development of the Dynamic Photoelastic Hybrid Method for Propagating Interfacial Crack of Isotropic/Orthotropic Bi-materials)

  • 황재석;신동철;김태규
    • 대한기계학회논문집A
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    • 제25권7호
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    • pp.1055-1063
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    • 2001
  • When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

Dynamic Mixed Mode Crack Propagation Behavior of Structural Bonded Joints

  • Lee, Ouk-Sub;Park, Jae-Chul;Kim, Gyu-Hyun
    • Journal of Mechanical Science and Technology
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    • 제14권7호
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    • pp.752-763
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    • 2000
  • The stress field around the dynamically propagating interface crack tip under a remote mixed mode loading condition has been studied with the aid of dynamic photoelastic method. The variation of stress field around the dynamic interface crack tip is photographed by using the Cranz-Shardin type camera having $10^6$ fps rate. The dynamically propagating crack velocities and the shapes of isochromatic fringe loops are characterized for varying mixed load conditions in double cantilever beam (DCB) specimens. The dynamic interface crack tip complex stress intensity factors, $K_1\;and\;K_2$, determined by a hybrid-experimental method are found to increase as the load mixture ratio of y/x (vertical/horizontal) values. Furthermore, it is found that the dynamically propagating interface crack velocities are highly dependent upon the varying mixed mode loading conditions and that the velocities are significantly small compared to those under the mode I impact loading conditions obtained by Shukla (Singh & Shukla, 1996a, b) and Rosakis (Rosakis et al., 1998) in the USA.

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계면에 존재하는 구멍의 모양이 동적 계면균열전파에 미치는 영향 (Effect of Interface Hole Shape on Dynamic Interface Crack Propagation)

  • 윤해룡;이억섭
    • 대한기계학회논문집A
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    • 제26권7호
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    • pp.1217-1222
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    • 2002
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

초기 혼합모드 동적 하중을 받는 경사계면균열의 동적 전파거동 (Dynamic Slant Interface Crack Propagation Behavior under Initial Impact Loading)

  • 이억섭;박재철;윤해룡
    • 한국정밀공학회지
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    • 제18권2호
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    • pp.146-151
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    • 2001
  • The effects of slant interface in the hybrid specimen on the dynamic crack propagation behavior have been investigated using dynamic photoelasticity. The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamic stress field around the dynamically propagating inclined interface crack tip in the three point bending specimens. The dynamic load is applied by a hammer dropped from 0.08m high without initial velocity. The dynamic crack propagation velocities and dynamic stresses field around the interface crack tips are investigated. Theoretical dynamic isochromatic fringe loops are compared with the experimental reults. It is interesting to note that the crack propagating velocity becomes comparable to the Rayleigh wave speed of the soft material of a specimen when slant angle decreases.

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Analysis of Propagating Crack Along Interface of Isotropic-Orthotropic Bimaterial by Photoelastic Experiment

  • 이광호;;;;황재석
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.102-107
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    • 2001
  • Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when $\alpha=90^{\circ}C$ (fibers perpendicular to the interface) than when $\alpha=0^{\circ}C$ (fiber parallel to the interface) and those when $\alpha=90^{\circ}C$ are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating crack are greater when $\alpha=0^{\circ}C$ than $\alpha=90^{\circ}C$. The relationship between complex dynamic stress intensity factor $|K_D|$ and crack speed C is similar to that for isotropic homogeneous materials, the rate of increase of energy release rate G or $|K_D|$ with crack speed is not as drastic as that reported for homogeneous materials.

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구멍을 통과하는 계면균열의 전파거동 (Propagation behavior of the interface crack through a hole)

  • 이억섭;윤해룡;황시원;변귀환
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집A
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    • pp.127-131
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (existed on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

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두 상이한 등방성 이종재료용 동적 광탄성 하이브리드법 개발에 관한 연구 (A Study on the Development of the Dynamic Photoelastic Hybrid Method for Two Dissimilar Isotropic Bi-Materials)

  • 신동철;황재석;권오성
    • 대한기계학회논문집A
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    • 제25권3호
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    • pp.434-442
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    • 2001
  • When the interfacial crack of two dissimilar isotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid method developed in this research are valid. Separating method of stress component is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 80∼85% (in case of aluminum, 24.3∼25.9%) of Rayleigh wave velocity of epoxy resin. The near-field stress components of crack-tip are similar with those of pure isotropic material under static or dynamic loading, but very near-field stress components of crack-tip are different from those.

구멍을 통과하는 계면균열의 전파거동 (Propagation Behavior of the Interface Crack Through a Hole)

  • 이억섭;윤해룡;황시원
    • 대한기계학회논문집A
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    • 제24권11호
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    • pp.2823-2827
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (exited on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

Static and Dynamic Fracture Analysis for the Interface Crack of Isotropic-Orthotropic Bimaterial

  • Lee, Kwang-Ho;Arun Shukla;Venkitanarayanan Parameswaran;Vijaya Chalivendra;Hawong, Jae-Sug
    • Journal of Mechanical Science and Technology
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    • 제16권2호
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    • pp.165-174
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    • 2002
  • In the present study, interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static cracks are greate. when ${\alpha}$: 90$^{\circ}$(fibers perpendicular to the interface) than when ${\alpha}$=0$^{\circ}$(fibers parallel to the interface), and those when ${\alpha}$=90$^{\circ}$are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating cracks are greater when ${\alpha}$=0$^{\circ}$ than ${\alpha}$=90$^{\circ}$. For the velocity ranges (0.1 < C/C$\sub$s1/<0.7) observed in this study, the complex dynamic stress intensity factor │K$\sub$D/│increases with crack speed c, however, the rate of increase of │K$\sub$D/│with crack speed is not as drastic as that reported for homogeneous materials.