• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.16-22
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• 2018

Silicon carbide (SiC) is used in various semiconductor processes because it has superior thermal, mechanical, and electrical characteristics as well as higher chemical and corrosion resistance than existing materials. Due to these characteristics, various manufacturing technologies have been developed for SiC. A recent development among these technologies is Chemical Vapor Deposition SiC (CVD-SiC). Many studies have been carried out on the processing and manufacturing of CVD-SiC due to its different material characteristics compared to existing materials like RB-SiC or Sintered-SiC. CVD-SiC is physically stable and has excellent chemical and corrosion resistance. However, there is a problem with increasing the thickness, because it is manufactured through a deposition process. Additionally, due to its high strength and hardness, it is difficult to subject to machining.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.74-75
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• 2007

We report on the characteristics of organic light-emitting diodes with Al cathode deposited by specially designed twin target sputter(TTS) system. It was found that the Al cathode films grown by TTS system were amorphous structure with nanocrystallines due to low substrate temperature during sputtering process. Effective confinement of high-density plasma between two Al targets lead to low temperature sputtering process on organic layer. Moreover, organic light-emitting diodes with Al cathode deposited by TTS system exhibited low leakage current density of $4{\times}10^{-6}\;mA/cm2$ at -6 V indicating plasma damage due to bombardment of energetic particles such as ions and $\gamma$-electrons was effectively restricted in the ITS system. Sputtering method using ITS system is expected to be applied in organic electronics and flexible displays due to its low temperature and plasma damage free deposition process.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.6
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• pp.367-373
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• 2023

600 MPa-grade deformed bar samples were manufactured by conventional hot rolling and subsequent Tempcore heat treatment processes. Considering the short-time water quenching step of the Tempcore process for hot-rolled steel, it is inevitable that the temperature profile of the deformed bar depends strongly on its position throughout the sample thickness. As a result, its microstructure can be easily divided into two regions, the surface and the core regions. The former is expected to have a fresh martensite microstructure under rapid cooling conditions, but self-tempering occurs due to the intense heat flow from the hot core region after the process. The latter is generally known to exhibit a mixed microstructure of ferrite and pearlite due to its slow cooling rate. In this study, detailed microstructural evolutions were examined through the thickness direction. The large variation of the microstructure through the thickness direction in the deformed bar samples is partly due to the easy carbon diffusion from the limited additions of alloying elements.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.68-71
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• 2000

In this paper, we have measured the oxygen contents by FTIR in silicon wafer various process technology(slicing, lapping, polishing). The measured data are also compared with the data of etching process(KOH, Bright etching). Also we have measured the surface morpology in backside silicon wafer after etching treatment and etch pit density due to OISF after 4 step high temperature annealing process with optical microscope.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.5
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• pp.108-116
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• 1996

A semiconductor process imulator operated in windows$^{TM}$ environment has been developed. two-dimensional process simulation in personal computer has been enabled due to the improvement of CPU speed and the efficient use of memory. The process simulator in this paper is capable of calculating diffusion, oxidation, ion implantation, etching and deposition in two-dimensional manner. In addition, graphic-user-friendly editor, parser, and multi-dimensional graphical routine is also available in the devloped simulator.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.40-52
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• 1998

Among the non-traditional machining methods, Abrasive waterjet machining process shows big promise in drilling difficult-to-machine materials due to its numerous advantages such as absence of heat affect zone and thermal distortion. Acoustic emission signal technique is used to understand about material removal mechanisms during abrasive waterjet drilling process. More information about the drilling process is derived through frequency decomposition of auto regressive moving average modeling representing acoustic emission signals.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.225-226
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• 2016

Bottom ash generated in thermoelectric power plants could be used as substitutional fine aggregate such as pearlite of fireproof mortar due to its lightweight and porosity. Development of substitutional materials is necessary because pearlite has several problems such as production of carbon dioxide during manufacturing process and high price. This study is to confirm the possibility of air cooling process bottom ash for fireproof mortar as substitutional material of pearlite through basic experiment.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.363-369
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• 2017

Phase-change random access memory (PRAM) has been emerged as a potential memory due to its excellent scalability, non-volatility, and random accessibility. But, as the cell current is reducing due to cell size scaling, the read-sensing window margin is also decreasing due to increased variation of cell performance distribution, resulting in a substantial loss of yield. To cope with this problem, a novel adaptive read-sensing reference current generation scheme is proposed, whose trimming range and resolution are adaptively controlled depending on process conditions. Performance evaluation in a 58-nm CMOS process indicated that the proposed read-sensing reference current scheme allowed the integral nonlinearity (INL) to be improved from 10.3 LSB to 2.14 LSB (79% reduction), and the differential nonlinearity (DNL) from 2.29 LSB to 0.94 LSB (59% reduction).

• Journal of applied mathematics & informatics
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• v.26 no.5_6
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• pp.889-900
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• 2008

The problem of scheduling n jobs on a single machine is considered when the machine is subject to stochastic breakdowns. The objective is to minimize the weighted squared deviation of job completion times from a common due date. Two versions of the problem are addressed. In the first one the common due date is a given constant, whereas in the second one the common due date is a decision variable. In each case, a general form of deterministic equivalent of the stochastic scheduling problem is obtained when the counting process N(t) related to the machine uptimes is a Poisson process. It is proved that an optimal schedule must be V-shaped in terms of weighted processing time when the agreeable weight condition is satisfied. Based on the V-shape property, two dynamic programming algorithms are proposed to solve both versions of the problem.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.55-62
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• 2007

With the developments in knitting, manufacturing, and polymers, coated gloves have been evolved in a way to maximize occupational safety and functionality. In this paper, we have considered the PU-coating process for the glove knitted by Dyneema to reduce the occurrence of the defects due to air bubble. This paper classifies the types of defect due to air bubble and traces their forming mechanisms. The air between coating layer of glove and mold's surface forms the defects if it is not evacuated fully in the process of submerging into water. The defects can be suppressed or avoided by forming air-evacuating path on the surface of the molds.