• 제목/요약/키워드: Dual-Aspect of Technology

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Global Value Chain in East Asia Under "New Normal": Ideology- Technology-Institution Nexus

  • Choi, Byung-il
    • East Asian Economic Review
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    • 제24권1호
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    • pp.3-30
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    • 2020
  • This paper analyzes how the current Global Value Chain (GVC) of East Asia has been established, and attempts to project the future trajectory of GVC under New Normal in the global trading system. For this purpose, the framework of Ideology-Technology-Institution nexus is presented with focus on the dynamics of interplay between ideology and technology, duly recognizing the dual-aspect of technology- a platform for business and also for national defense. The paper analyzes how the Information and Communication Technology (ICT) of the 1990s played a role of "facilitator" in shaping the GVC of East Asia, where China plays 'factory for final assembly' and the US plays 'the largest consumer'. Under New Normal, digital technology is likely to play the opposite role of "disrupting" the GVC of East Asia, unlike ICT. The paper explores the mechanism behind this great disruption. What is driving New Normal is the US-China power competition, seeking for dominance in East Asia and beyond. This paper argues that New Normal is not temporary shock, but will last for some time. Under this presumption, the paper presents three scenarios for the future trajectory of GVC in East Asia.

Experimental investigations on resilient beam-column end-plate connection with structural fuse

  • Arunkumar Chandrasekaran;Umamaheswari Nambiappan
    • Steel and Composite Structures
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    • 제47권3호
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    • pp.315-337
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    • 2023
  • The steel structure is an assembly of individual structural members joined together by connections. The connections are the focal point to transfer the forces which is susceptible to damage easily. It is challenging to replace the affected connection parts after an earthquake. Hence, steel plates are utilised as a structural fuse that absorbs connection forces and fails first. The objective of the present research is to develop a beam-column end plate connection with single and dual fuse and study the effect of single fuse, dual fuse and combined action of fuse and damper. In this research, seismic resilient beam-column end plate connection is developed in the form of structural fuse. The novel connection consists of one main fuse was placed horizontally and secondary fuse was placed vertically over main fuse. The specimens are fabricated with the variation in number of fuse (single and dual) and position of fuse (beam flange top and bottom). From the fabricated ten specimens five specimens were loaded monotonically and five cyclically. The experimental results are compared with Finite Element Analysis results of Arunkumar and Umamaheswari (2022). The results are critically assessed in the aspect of moment-rotation behaviour, strain in connection components, connection stiffness, energy dissipation characteristics and ductility. While comparing the performance of total five specimens, the connection with fuse exhibited superior performance than the conventional connection. An equation is proposed for the moment of resistance of end-plate connection without and with structural fuse.

Visions and the Use of a Community Information and Communication Technology (ICT): Assessing the Effectiveness of the Delivery of Community Network Services

  • Kwon, Nahyun
    • 한국도서관정보학회지
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    • 제35권1호
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    • pp.377-397
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    • 2004
  • This study investigated the use of community information and communication technologies in light of its dual visions (i.e., serving as an affordable Internet service provider and a community building tool). Surveying the randomly selected users of a community network (n = 213), this study examined the influence of the community features on service use compared to that of Internet features. The present study found that the respondents were using the service mainly for general Internet features, such as email and web access. More than two-thirds of the respondents did not recognize community contents as available service. Community features of the service were found as significant predictors of use only among people who were aware of community contents but not among people who were not. Nonetheless, there was no difference in the amount of use between the two groups, indicating that the awareness of community contents itself did not increase use. Findings suggest that the service providers did not fully communicate the community aspect of the service with the users although the very aspect distinguishes the service from other Internet services.

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이중제트에서 노즐과 노즐사이의 각도 변화에 따른 유동 특성 (The Flow Characteristics with Variation of Nozzle-to-nozzle Angles on Unventilated Dual Jests)

  • 김동건;김문경;윤순현
    • Journal of Advanced Marine Engineering and Technology
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    • 제32권8호
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    • pp.1231-1239
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    • 2008
  • The characteristics of flow on unventilated dual jets was experimentally investigated. The two nozzles each with an aspect ratio of 20 were separated by 6 nozzle widths. Reynolds number based on nozzle width was set to 5,000 by nozzle exit velocity. All measurements were made over a range of nozzle-to-nozzle angles from $0^{\circ}$ to $25^{\circ}$. The particle image velocimetry and pressure transducer were employed to measure turbulent velocity components and mean static pressure, respectively. It was shown that a recirculation zone with sub-atmospheric static pressure was bounded by the inner shear layers of the individual jets and the nozzles plated. As nozzle-to-nozzle inclined angles were decreased, it was found that the spanwise turbulent intensity is greater than the streamwise turbulent intensity in the merging region. In the combined region, the velocity of dual jets agree well with that of single jet, but the turbulence intensity of dual jets not agree with that of single jet.

Experimental study on liquid sloshing with dual vertical porous baffles in a sway excited tank

  • Sahaj, K.V.;Nasar, T.;Vijay, K.G.
    • Ocean Systems Engineering
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    • 제11권4호
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    • pp.353-371
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    • 2021
  • Sloshing behavior of liquid within containers represents one of the most fundamental fluid-structure interactions. Liquid in partially filled tanks tends to slosh when subjected to external disturbances. Sloshing is a vicious resonant fluid motion in a moving tank. To understand the effect of baffle positioned at L/3 and 2L/3 location, a shake table experiments was conducted for different fill volumes of aspect ratio 0.163, 0.325 and 0.488. For a fixed amplitude of 7.5 mm, the excitation frequencies are varied between 0.457 Hz to 1.976 Hz. Wave probes have been located at both tank ends to capture the surface elevation. The experimental parameters such as sloshing oscillation and energy dissipation are discussed here. Comparison is done for with baffles and without baffles conditions. For both conditions, the results showed that aspect ratio of 0.163 gives better surface elevation and energy dissipation than obtained for aspect ratio 0.325 and 0.488. Good agreement is observed when numerical analysis is compared with the experiments results.

Balancing Inter-Ring Loads on SONET Dual-Ring without Demand Splitting

  • Lee, Chae-Y.;Moon, Jung-H.
    • 산업공학
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    • 제9권3호
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    • pp.64-71
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    • 1996
  • In the survivability and simplicity aspect, SONET Self-healing Ring(SHR) is one of the most important schemes for the high-speed telecommunication networks. Since the ring capacity requirement is defined by the largest STS-1 cross-section in the ring, load balancing is the key issue in the design of SONET SHR. Recently, most of the research on load balancing problem have been concentrated on the SONET single-ring case. However, in certain applications, multiple-ring configuration is necessary because of the geographical limitations or the need for extra bandwidth. In this paper, the load balancing problem for SONET dual-ring is considered by assuming symmetric inter-ring demands. We present a linear programming based formulation of the problem. Initial solution and improvement procedures are presented, which solves the routing and interconnection between the two rings for each demand. Computational experiments are performed on various size of networks with randomly generated demand sets. Results show that the proposed algorithm is excellent in both the solution quality and the computational time requirement. The average error bound of the solutions obtained is 0.26% of the optimum.

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A Versatile Medical Image Enhancement Algorithm Based on Wavelet Transform

  • Sharma, Renu;Jain, Madhu
    • Journal of Information Processing Systems
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    • 제17권6호
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    • pp.1170-1178
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    • 2021
  • This paper proposed a versatile algorithm based on a dual-tree complex wavelet transform for intensifying the visual aspect of medical images. First, the decomposition of the input image into a high sub-band and low-sub-band image is done. Further, to improve the resolution of the resulting image, the high sub-band image is interpolated using Lanczos interpolation. Also, contrast enhancement is performed by singular value decomposition (SVD). Finally, the image reconstruction is achieved by using an inverse wavelet transform. Then, the Gaussian filter will improve the visual quality of the image. We have collected images from the hospital and the internet for quantitative and qualitative analysis. These images act as a reference image for comparing the effectiveness of the proposed algorithm with the existing state-of-the-art. We have divided the proposed algorithm into several stages: preprocessing, contrast enhancement, resolution enhancement, and visual quality enhancement. Both analyses show the proposed algorithm's effectiveness compared to existing methods.

A Study on the Optimized Copper Electrochemical Plating in Dual Damascene Process

  • Yoo, Hae-Young;Chang, Eui-Goo;Kim, Nam-Hoon
    • Transactions on Electrical and Electronic Materials
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    • 제6권5호
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    • pp.225-228
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    • 2005
  • In this work, we studied the optimized copper thickness in Cu ECP (Electrochemical Plating). In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge (bump, hump or over-plating amount), Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness. In the aspect of bump and dishing, the bulge increased according as target plating thickness decreased. Dishing of edge was larger than center of wafer. Also in case of electrical property, metal line resistance distribution became broad gradually according as Cu ECP thickness decreased. In conclusion, at least $20\%$ reduced Cu ECP thickness from current baseline; $0.8\;{\mu}m$ and $1.0\;{\mu}m$ are suitable to be adopted as newly optimized Cu ECP thickness for local and intermediate layer.

Frequency effect of TEOS oxide layer in dual-frequency capacitively coupled CH2F2/C4F8/O2/Ar plasma

  • Lee, J.H.;Kwon, B.S.;Lee, N.E.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.284-284
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    • 2011
  • Recently, the increasing degree of device integration in the fabrication of Si semiconductor devices, etching processes of nano-scale materials and high aspect-ratio (HAR) structures become more important. Due to this reason, etch selectivity control during etching of HAR contact holes and trenches is very important. In this study, The etch selectivity and etch rate of TEOS oxide layer using ACL (amorphous carbon layer) mask are investigated various process parameters in CH2F2/C4F8/O2/Ar plasma during etching TEOS oxide layer using ArF/BARC/SiOx/ACL multilevel resist (MLR) structures. The deformation and etch characteristics of TEOS oxide layer using ACL hard mask was investigated in a dual-frequency superimposed capacitively coupled plasma (DFS-CCP) etcher by different fHF/ fLF combinations by varying the CH2F2/ C4F8 gas flow ratio plasmas. The etch characteristics were measured by on scanning electron microscopy (SEM) And X-ray photoelectron spectroscopy (XPS) analyses and Fourier transform infrared spectroscopy (FT-IR). A process window for very high selective etching of TEOS oxide using ACL mask could be determined by controlling the process parameters and in turn degree of polymerization. Mechanisms for high etch selectivity will discussed in detail.

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높은 A/R의 콘택 산화막 에칭에서 바닥모양 변형 개선에 관한 연구 (A Study on The Improvement of Profile Tilting or Bottom Distortion in HARC)

  • 황원태;김길호
    • 한국전기전자재료학회논문지
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    • 제18권5호
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    • pp.389-395
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    • 2005
  • The etching technology of the high aspect ratio contact(HARC) is necessary at the critical contact processes of semiconductor devices. Etching the $SiO_{2}$ contact hole with the sub-micron design rule in manufacturing VLSI devices, the unexpected phenomenon of 'profile tilting' or 'bottom distortion' is often observed. This makes a short circuit between neighboring contact holes, which causes to drop seriously the device yield. As the aspect ratio of contact holes increases, the high C/F ratio gases, $C_{4}F_{6}$, $C_{4}F_{8}$ and $C_{5}F_{8}$, become widely used in order to minimize the mask layer loss during the etching process. These gases provide abundant fluorocarbon polymer as well as high selectivity to the mask layer, and the polymer with high sticking yield accumulates at the top-wall of the contact hole. During the etch process, many electrons are accumulated around the asymmetric hole mouth to distort the electric field, and this distorts the ion trajectory arriving at the hole bottom. These ions with the distorted trajectory induce the deformation of the hole bottom, which is called 'profile tilting' or 'bottom distortion'. To prevent this phenomenon, three methods are suggested here. 1) Using lower C/F ratio gases, $CF_{4}$ or $C_{3}F_{8}$, the amount of the Polymer at the hole mouth is reduced to minimize the asymmetry of the hole top. 2) The number of the neighboring holes with equal distance is maximized to get the more symmetry of the oxygen distribution around the hole. 3) The dual frequency plasma source is used to release the excessive charge build-up at the hole mouth. From the suggested methods, we have obtained the nearly circular hole bottom, which Implies that the ion trajectory Incident on the hole bottom is symmetry.